Zhongli Ji

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Shenzhen, CN

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Patents Applicationslast 30 patents

Information Patent Application
CHIP SYSTEM AND COMMUNICATION DEVICE
- Publication number 20240321771
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- Bai DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING MODULE AND ELECTRONIC DEVICE
- Publication number 20230307428
- Publication date Sep 28, 2023
- Huawei Technologies Co., Ltd
- Zhongli JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING MODULE AND PACKAGING METHOD THEREFOR, AND ELECTRONIC DEVICE
- Publication number 20230178496
- Publication date Jun 8, 2023
- Huawei Technologies Co., Ltd
- Zhongli JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND ELECTRONIC DEVICE THAT INCLUDES SEMICON...
- Publication number 20230104555
- Publication date Apr 6, 2023
- Huawei Technologies Co., Ltd
- Yan Xu
- H01 - BASIC ELECTRIC ELEMENTS