Patent Application
20240321771
This application relates to the field of chip technologies, and in particular, to a chip system and a communication device.
As a semiconductor process size continuously decreases, integration of various chips in an electronic device gradually improves, and a working frequency of the chip continuously improves. Consequently, a conductive element or a conductive structure with a small size in the electronic device becomes an antenna, and performs electromagnetic radiation outward, causing electromagnetic interference to a radio frequency circuit that is included in the electronic device and that is easily affected by radio frequency interference, and a processor, a memory, and the like that need to use a clock signal. A conventional method for reducing impact of electromagnetic radiation is to dispose an electromagnetic shielding for a radiation device that generates electromagnetic radiation or a sensitive device that is easily affected by electromagnetic radiation.
The chip package body shown in the figure includes a chip 11 and a package substrate 14. The chip 11 and the package substrate 14 are welded through solder balls. An electromagnetic shielding enclosure 13 is generally a technical stamping structure, covers an upper part, namely, a side surface, of the chip 11 and is fastened to an upper surface of the package substrate 14 through a connection part 15. An upper surface of the chip 11 is in contact with the electromagnetic shielding enclosure 13 by using a thermal interface material (TIM) 12, to accelerate heat dissipation. Electromagnetic radiation of the chip 11 may be reduced by using the electromagnetic shielding enclosure 13.
However, because the package substrate 14 is connected to a printed circuit board (PCB) 20 through solder balls 30, and there is a gap between solder balls 30, the solder balls 30 become a leakage source of the electromagnetic radiation. As a working frequency of the chip 11 continuously increases, a requirement for reducing electromagnetic radiation leakage continuously increases, and electromagnetic radiation leaked by the solder balls 30 may even seriously affect performance of the chip.
To resolve the foregoing problem, this application provides a chip system and a communication device, and this reduces electromagnetic leakage of a first connection part, improves an electromagnetic shielding capability of a chip, and ensure performance of the chip.
According to a first aspect, this application provides a chip system. The chip system includes a chip package body and an electromagnetic shielding enclosure. The chip package body is electrically connected to a circuit board through a first connection part. In a typical implementation, the first connection part includes solder balls. The chip package body includes a package substrate and at least one chip that are electrically connected, and the electromagnetic shielding enclosure includes a conductive first shielding structure and a conductive second shielding structure. The first shielding structure is connected to the package substrate, the first shielding structure includes a first cavity, and the first cavity is configured to accommodate at least one chip. A first end of the second shielding structure is connected to the circuit board or connected to a solder pad on the circuit board, and a second end of the second shielding structure is connected to the first shielding structure to form a second cavity; or a first end of the second shielding structure is connected to a solder pad on the circuit board or connected to the circuit board, and the second shielding structure covers the first shielding structure to form a second cavity; and the first connection part is located in the second cavity.
According to the chip system provided in this application, after the first shielding structure is connected to the second shielding structure, the formed second cavity encloses the first connection part. Because both the first shielding structure and the second shielding structure are conductive, the first shielding structure and the second shielding structure jointly perform a shielding function, to implement electromagnetic shielding on the first connection part, reduce electromagnetic leakage of the first connection part, improve an electromagnetic shielding capability, ensure chip performance, and reduce impact of electromagnetic leakage on another circuit component.
In a possible implementation, the first connection part includes an insulation material and a plurality of electrical connection parts, where the plurality of electrical connection parts are configured to connect the chip package body and the circuit board, and the insulation material is filled in a region among the package substrate of the chip package body, the circuit board, and the plurality of electrical connection parts.
In a typical implementation, the electrical connection part is solder balls, the first connection part includes the solder balls and the insulation material, and the solder ball is configured to implement an electrical connection between the chip package body and the circuit board.
In one aspect, the insulation material may function as assisting in heat dissipation. In another aspect, an insulation material filled between a connection region of the chip package body and the circuit board may further play a support role, so that the second shielding structure may be closely attached to a side wall of the insulation material, and is more stable and reliable. In addition, a connection region between the chip package body and the circuit board is increased, and stability of a connection between the chip package body and the circuit board is improved.
In a possible implementation, the first connection part filled with the insulation material includes two connection surfaces, one connection surface close to the circuit board is a first connection surface, one connection surface close to the chip package body is a second connection surface, and a width of the first connection surface is greater than a width of the second connection surface. That is, after the insulation material is filled, an upper side is narrow, and a lower side is wide, so that the insulation material can provide support for the second shielding structure.
In a possible implementation, the second shielding structure covers all or a part of side walls of the insulation material.
When the insulation material is filled in the connection region between the chip package body and the circuit board, the insulation material may be filled according to a capillary principle, and the second shielding structure covers all or a part of side walls of the insulation material, that is, metal solder balls are surrounded inside. This implements electromagnetic shielding on the metal solder balls. In addition, when the second shielding structure is in contact with an edge of the insulation material, the insulation material filled between the connection region of the chip package body and the circuit board can further play a support role, so that the second shielding structure can be closely attached to the side wall of the insulation material, and is more stable and reliable.
In a possible implementation, a first end of the second shielding structure is connected to a solder pad on the circuit board, to improve connection stability of the second shielding structure.
In a possible implementation, a first end of the second shielding structure is connected to a solder pad on the circuit board, and the solder pad is grounded. In this case, the electromagnetic shielding enclosure improves an electromagnetic shielding capability for a chip and the first connection part.
In a possible implementation, the package substrate is located on the solder pad, and the first end of the second shielding structure is electrically connected to the solder pad.
In a possible implementation, the chip package body is electrically connected to the circuit board by using a land grid array LGA packaging technology, and a grounding pin of the chip package body is electrically connected to the second shielding structure. Because the solder pad is electrically connected to the first shielding structure by using the second shielding structure, when the solder pad is grounded, the second shielding structure and the first shielding structure are also grounded. This improves electromagnetic shielding performance.
Further, when a part of grounding pins on the circuit board is located outside a range covered by an outline of the chip package body, the grounding pins may alternatively be electrically connected to the first shielding structure by using a soldering process, to avoid grounding through wiring and simplify a ground line.
In a possible implementation, a first surface of each of the at least one chip is connected to the first shielding structure through a first material. A second surface of each of the at least one chip is electrically connected to a first surface of the package substrate, and the first shielding structure is connected to the first surface of the package substrate through a second connection part.
The first material may be a thermal interface (TIM) material, and the thermal interface material is mostly a flexible material, for example, may be a gel or a silicone lipide material, and is filled between the first surface of the chip and the first shielding structure. In one aspect, this can assist in heat dissipation, so that heat generated when the chip works is quickly conducted to the first shielding structure. In another aspect, this provides support for the first shielding structure, and stability of the first shielding structure is improved.
The first shielding structure is fastened to the first surface of the package substrate through the second connection part, and the first shielding structure is further fastened to the first surface of the chip through the first material. This improves stability of the first shielding structure. After the package substrate is fastened to the circuit board through the first connection part, a position of the first shielding structure relative to the circuit board is also fixed.
In a possible implementation, the second connection part is a metal solder, and the first shielding structure is welded to the first surface of the package substrate through the second connection part. In this case, the first shielding structure is securely connected to the package substrate, and the electromagnetic shielding enclosure has good electromagnetic shielding performance. Alternatively, the second connection part is an electrically conductive adhesive, and the first shielding structure is connected to the first surface of the package substrate through the second connection part. In this manner, the electromagnetic shielding enclosure can have good electromagnetic shielding performance. Alternatively, the second connection part is an insulation collosol, and the first shielding structure is connected to the first surface of the package substrate through the second connection part. In this manner, manufacturing difficulty is reduced, and the first shielding structure can be securely connected to the package substrate.
In a possible implementation, a first surface of each of the at least one chip is connected to the first shielding structure through a first material. A second surface of each of the at least one chip is electrically connected to a first surface of the package substrate. The first shielding structure is connected to a side wall of the package substrate through a second connection part.
The first material may be a thermal interface material, and the first material is filled between the first surface of the chip and the first shielding structure. In one aspect, the first material can assist in heat dissipation, so that heat generated when the chip works is quickly conducted to the first shielding structure. In another aspect, the first shielding structure is supported, and connection stability of the first shielding structure is improved. In addition, the first shielding structure is connected to the side wall of the package substrate, to enclose the chip package body. This improves an electromagnetic shielding effect.
In a possible implementation, the second connection part is a metal solder, and the first shielding structure is welded to the side wall of the package substrate through the second connection part. In this case, the first shielding structure is securely connected to the package substrate, and the electromagnetic shielding enclosure has good electromagnetic shielding performance. Alternatively, the second connection part is an electrically conductive adhesive, and the first shielding structure is connected to the side wall of the package substrate through the second connection part. In this manner, the electromagnetic shielding enclosure can have good electromagnetic shielding performance. Alternatively, the second connection part is an insulation collosol, and the first shielding structure is connected to the side wall of the package substrate through the second connection part. In this manner, manufacturing difficulty is reduced, and the first shielding structure can be securely connected to the package substrate.
In a possible implementation, the first shielding structure is a metal mechanical part.
The metal mechanical part may be a metal mechanical part that has a groove structure and that is formed through stamping or casting. This is not specifically limited in this embodiment of this application. The groove is configured to accommodate a corresponding part of the chip package body, to implement electromagnetic shielding on the chip package body.
In a possible implementation, the chip package body further includes a molding compound. Each of the at least one chip is buried in the molding compound. The first shielding structure covers an outer surface of the molding compound and the side wall of the package substrate.
In one aspect, the molding compound can assist in heat dissipation, so that heat generated when the chip works is quickly conducted to the first shielding structure. In another aspect, the molding compound provides support for the first shielding structure, and this improves connection stability of the first shielding structure. In addition, the first shielding structure covers the outer surface of the molding compound and the side wall of the package substrate, to enclose the chip package body, and improve an electromagnetic shielding effect.
In a possible implementation, the chip package body further includes a molding compound, each of the at least one chip is buried in the molding compound, each of the at least one chip is electrically connected to a first surface of the package substrate, and the first shielding structure covers an outer surface of the molding compound and extends to the first surface of the package substrate.
In one aspect, the molding compound can assist in heat dissipation, so that heat generated when the chip works is quickly conducted to the first shielding structure. In another aspect, the molding compound provides support for the first shielding structure, and this improves connection stability of the first shielding structure. In addition, the first shielding structure covers the outer surface of the molding compound and the side wall of the package substrate. This reduces a quantity of used molding compounds and reduces material consumption of the first shielding structure.
In a possible implementation, the first shielding structure is any one of a conductive film, a metal material, or an electrically conductive adhesive material.
When the first shielding structure is implemented by using a conductive film, the conductive film may be formed through spraying. When the first shielding structure is implemented by using a metal material, the metal material may be generated through metal sputtering deposition or deposition using an electroplating process. When the first shielding structure is implemented by using an electrically conductive adhesive material, the electrically conductive adhesive material may be formed through coating.
In a possible implementation, the second shielding structure is any one of a conductive film, a metal material, or an electrically conductive adhesive material.
In a possible implementation, a plurality of electrical connection structures included in the first connection part may be any one of a metal solder ball, a sinter, a metal mechanical part, or a plug terminal. The electrical connection part may alternatively be implemented in another manner. Examples are not described one by one herein again in this application.
In a possible implementation, the second shielding structure completely covers the first shielding structure, to improve an electromagnetic shielding capability. When the second shielding structure is a conductive film, difficulty of forming the second shielding structure can be further reduced. In this case, the second shielding structure may be connected to the first shielding structure through a cohesive material, that is, the cohesive material is added to a contact surface between the second shielding structure and the first shielding structure, to improve stability of a connection between the second shielding structure and the first shielding structure.
Implementations of the second shielding structure and the first shielding structure may be the same or may be different. This is not specifically limited in this application. When the second shielding structure is implemented by using a conductive film, the conductive film may be formed through spraying. When the second shielding structure is implemented by using a metal material, the metal material may be generated through metal sputtering deposition or deposition using an electroplating process. When the second shielding structure is implemented by using an electrically conductive adhesive material, the electrically conductive adhesive material may be formed through coating.
In a possible implementation, the second shielding structure is located on an outer side of the first shielding structure, and at least a part of the second cavity is located between the package substrate and the circuit board.
In this case, the second shielding structure may be connected to the outer side of the first shielding structure, and is easy to be processed and formed. When the second shielding structure covers the first shielding structure, a position at which the first shielding structure is connected to the second shielding structure includes an inner shielding structure and an outer shielding structure. This improves electromagnetic shielding performance. The second cavity is located between the package substrate and the circuit board, and is configured to accommodate the first connection part, to implement electromagnetic shielding on the first connection part.
According to a second aspect, this application further provides a communication device. The communication device includes the chip system provided in the foregoing implementations. A chip package body included in the communication device has a high requirement on electromagnetic shielding. Therefore, when the chip package body is mounted on a PCB, electromagnetic shielding needs to be performed on the chip package body more comprehensively and completely.
An electromagnetic shielding enclosure included in the communication device provided in this application can implement electromagnetic shielding on an electrical connection part in a first connection part, reduce electromagnetic leakage of the electrical connection part of the first connection part, improve an electromagnetic shielding capability of the chip package body, ensure chip performance, and reduce impact of electromagnetic leakage on another circuit component. Therefore, performance of the communication device is further improved.
In a possible implementation, the communication device is a radio frequency transceiver. The radio frequency transceiver is connected to a baseband unit (BBU) of a base station through an optical fiber. The BBU is configured to process data transmitted by the radio frequency transceiver, and transmit to-be-transmitted data to the radio frequency transceiver. According to the technical solutions of this application, an electromagnetic shielding capability for the chip package body is improved, and working performance of the radio frequency transceiver is further improved.
In a possible implementation, at least one chip includes an intermediate frequency chip. The intermediate frequency chip is applied to an intermediate frequency circuit of the radio frequency transceiver.
To make a person skilled in the art better understand the technical solutions provided in embodiments of this application, an application scenario of the technical solutions provided in this application is first described below.
As a working frequency of a chip continuously improves, a requirement for reducing electromagnetic interference is increased. Therefore, to improve performance of a chip package body, electromagnetic shielding needs to be performed on the chip package body more comprehensively, to reduce electromagnetic radiation leakage.
The chip package body includes a chip and a package substrate. The chip includes but is not limited to an intermediate frequency (IF) chip, a radio frequency (RF) chip, a central processing unit (CPU), a graphics processing unit (GPU), a field programmable gate array (FPGA), a neural network processing unit (NPU), and the like.
For example, the chip package body is connected to a PCB through solder balls. Still refer to
To resolve the foregoing technical problem, this application provides a chip system and a communication device. The chip system includes a chip package body and an electromagnetic shielding enclosure, where the chip package body is electrically connected to a circuit board through a first connection part, and the chip package body includes a package substrate and at least one chip. The package substrate is electrically connected to the at least one chip. The electromagnetic shielding enclosure includes a conductive first shielding structure and a conductive second shielding structure. The first shielding structure is connected to the package substrate, a first cavity of the first shielding structure is configured to accommodate the at least one chip, a first end of the second shielding structure is connected to the circuit board or a solder pad on the circuit board, and a second end of the second shielding structure is connected to the first shielding structure to form a second cavity; or a first end of the second shielding structure is connected to a solder pad on the circuit board or the circuit board, and the second shielding structure covers the first shielding structure to form a second cavity. The first connection part is located in the second cavity. The electromagnetic shielding enclosure provided in this application is used, so that electromagnetic shielding on the first connection part can be implemented, and electromagnetic leakage of the first connection part is reduced, to further improve an electromagnetic shielding capability of the chip package body, ensure chip performance, and reduce impact of electromagnetic leakage on another circuit component.
To make a person skilled in the art understand the technical solutions in this application better, the following describes the technical solutions in embodiments of this application with reference to the accompanying drawings in embodiments of this application.
The terms “first” and “second” in this application are merely intended for a purpose of description, and shall not be understood as an indication or implication of relative importance or an implicit indication of a quantity of indicated technical features.
In addition, in this application, orientation terms such as “up” and “down” may include but are not limited to orientations schematically placed relative to components in the accompanying drawings. It should be understood that these directional terms may be relative concepts, are used for relative description and clarification, and may be correspondingly changed based on changes in placement orientations of the components in the accompanying drawings.
In this application, unless otherwise expressly specified and limited, the term “connection” should be understood in a broad sense. For example, “connection” may be a fixed connection, a detachable connection, or an integrated connection, or may be a direct connection or an indirect connection through an intermediate medium.
The chip package body may include one chip or a plurality of chips. For ease of description, the following embodiments are described by using an example in which the chip package body includes one chip.
A chip package body shown in the figure includes a chip 11 and a package substrate 14.
The package substrate 14 may be a circuit board including a plurality of conductive layers, and an exposed solder pad structure is disposed on both an upper surface and a lower surface of the package substrate 14.
The chip 11 is electrically connected to the package substrate 14. In a possible implementation, a surface of the chip 11 includes a metal bump, the chip 11 and the package substrate 14 are welded, and a solder may be a tin-containing alloy solder. Solder paste is printed on a surface of the substrate, and a connection between the chip and the substrate is implemented in a reflow soldering manner.
When the chip package body is welded to a PCB 20, the electromagnetic shielding enclosure provided in this application is used to implement electromagnetic shielding on the chip package body. The electromagnetic shielding enclosure includes a first shielding structure 13 and a second shielding structure 16.
Both the first shielding structure 13 and the second shielding structure 16 are conductive structures.
The first shielding structure 13 is connected to the package substrate 14, the first shielding structure 13 includes a first inner cavity, and the chip 11 is located in the first inner cavity of the first shielding structure 13.
The second shielding structure 16 is located on an outer side of the first shielding structure 13, and at least a part of a second cavity is located between the package substrate and the circuit board. In this case, the second shielding structure may be connected to the outer side of the first shielding structure, and is easy to be processed and formed. When the second shielding structure covers the first shielding structure, a position at which the first shielding structure is connected to the second shielding structure includes an inner shielding structure and an outer shielding structure. This improves electromagnetic shielding performance. The second cavity is located between the package substrate and the circuit board, and is configured to accommodate the first connection part, to implement electromagnetic shielding on the first connection part.
The chip package body is electrically connected to the PCB 20 through the first connection part.
The first connection part includes a plurality of electrical connection parts. The electrical connection part may include a metal solder ball, a sinter, a metal mechanical part, a plug terminal, or the like, or may be another electrical connection part, to implement an electrical connection between the first connection part and the PCB 20. This is not specifically limited in this embodiment of this application. The following description is provided by using an example in which the electrical connection part of the first connection part is a metal solder ball 30.
In this case, an electromagnetic shielding enclosure formed by the first shielding structure 13 and the second shielding structure 16 covers the chip package body and the first connection part. This reduces electromagnetic leakage of the first connection part, improves an electromagnetic shielding capability of the chip package body, ensures chip performance, and reduces impact of electromagnetic leakage on another circuit component.
In some other possible implementations, the second shielding structure 16 partially covers the side surface of the package substrate, so that a material can be saved.
The following provides a description with reference to specific implementations.
A package substrate 14 and a PCB 20 in this embodiment of this application may be connected in a ball grid array (BGA) packaging manner or a land grid array (LGA) packaging manner.
When the BGA packaging manner is used, a plurality of solder balls between the package substrate 14 and the PCB 20 form an array, and are distributed between the package substrate and the PCB 20, so that the PCB 20 communicates with a chip package body.
When the LGA packaging manner is used, a contact required when the chip package body is connected to the PCB 20 is located on the PCB 20, and a lower side of the package substrate covers a grid-shape connection end. The PCB 20 communicates with the chip package body by using a point contact technology. The PCB 20 provides a pin, which may replace the solder ball in the BGA packaging.
For ease of description, the following uses the BGA packaging as an example. In this case, a plurality of electrical connection parts of the first connection part in
A first surface of the chip 11 is fastened to a first shielding structure 13 through a first material 12.
In a possible implementation, the first material 12 is a thermal interface material (TIM). The thermal interface material is mostly a flexible material, for example, may be a gel or a silicone lipide material. When the thermal interface material is filled between the first surface of the chip 11 and the first shielding structure 13, in one aspect, heat dissipation can be assisted, so that heat generated when the chip 11 works is quickly conducted to the first shielding structure, and in another aspect, support for the first shielding structure 13 is provided, to improve stability of the first shielding structure 13.
A second surface of the chip 11 is electrically connected to a first surface of the package substrate 14.
Specifically, a surface of the chip 11 includes a metal bump, an upper surface of the package substrate 14 includes a solder pad, solder paste is printed on the surface of the package substrate 14, and soldering of the chip 11 and the package substrate 14 is implemented in a reflow soldering manner.
In some embodiments, an underfill material may be injected between the chip 11 and the package substrate 14, to improve connection stability. The underfill material is an insulation material. A specific type of the underfill material is not limited in this embodiment of this application, for example, may be epoxy resin.
The first shielding structure 13 is fastened to the first surface of the package substrate 14 through a second connection part 15.
Because the first shielding structure 13 is fastened to the first surface of the package substrate 14 through the second connection part 15, and the first shielding structure 13 is further fastened to the first surface of the chip 11 through the first material 12, stability of the first shielding structure 13 is improved. After the package substrate is fastened to the circuit board 20 through the first connection part, a position of the first shielding structure 13 relative to the circuit board is fixed.
In this case, the first shielding structure 13 is a metal mechanical part, and the metal mechanical part may be formed through stamping or casting. This is not specifically limited in this embodiment of this application. The metal mechanical part has a groove structure, and the groove is configured to accommodate a corresponding part of the chip package body, to implement electromagnetic shielding on the chip package body.
In a possible implementation, the second connection part 15 is a metal solder, and the first shielding structure 13 is welded to the first surface of the package substrate 14 through the second connection part 15. In this case, the first shielding structure 13 is securely connected to the package substrate 14, and an electromagnetic shielding enclosure has good electromagnetic shielding performance.
In another possible implementation, the second connection part 15 is an electrically conductive adhesive, and the first shielding structure 13 is fastened to the first surface of the package substrate 14 through the second connection part 15. In this manner, the electromagnetic shielding enclosure can have good electromagnetic shielding performance.
In still another possible implementation, the second connection part is an insulation collosol, and the first shielding structure 13 is fastened to the first surface of the package substrate 14 through the second connection part 15. In this manner, manufacturing difficulty is reduced, and the first shielding structure 13 can be securely connected to the package substrate.
A lower surface of the package substrate 14 is electrically connected to the PCB 20 through a metal solder ball 30. Specifically, the package substrate 14 may be electrically connected to the PCB by using a reflow soldering process.
The PCB 20 includes a plurality of circuit layers. The PCB shown in the figure is merely an example, and does not constitute a limitation on the technical solutions of this application.
There is a solder pad 201 on the PCB. The solder pad 201 is a metal solder pad. The solder pad 201 is connected to a ground circuit layer of the PCB. The solder pad 201 may be connected to the ground circuit layer through a plated through-hole structure or a slotted electroplated structure. This is not specifically limited in this embodiment of this application.
In addition to the electrical connection part, namely, the metal solder ball 30 in the figure, the first connection part further includes an insulation material 17.
A connection region between the chip package body and the circuit board 20 is filled with the insulation material 17, that is, a connection region between the lower surface of the package substrate 14 and the PCB 20 is filled with the insulation material 17.
The insulation material 17 may be the underfill material, for example, an epoxy resin material. The insulation material 17 may fill gaps between a plurality of metal solder balls according to a capillary principle.
The insulation material 17 may fill the gaps between the plurality of metal solder balls as much as possible, or the insulation material 17 fills only at an edge of the connection region between the chip package body and the circuit board 20.
The second shielding structure 16 shown in the figure covers a side wall of the insulation material 17. A first end of the second shielding structure 16 is connected to the sol der pad 201, and the solder pad 201 is grounded, to further improve an electromagnetic shielding capability of the electromagnetic shielding enclosure for the chip 11 and the first connection part. A second end of the second shielding structure 16 is connected to the first shielding structure 13.
In this case, the second shielding structure 16 encloses the metal solder balls 30 on an inner side, to implement electromagnetic shielding on the metal solder balls 30.
The insulation material 17 can further play a support role, so that the second shielding structure may be closely attached to a side wall of the insulation material, and is more stable and reliable.
The second shielding structure 16 is any one of a conductive film, a metal material, or an electrically conductive adhesive material. This is not specifically limited in this embodiment of this application.
When the second shielding structure 16 is a conductive film, the conductive film may be formed through spraying.
When the second shielding structure 16 is made of a metal material, the metal material may be generated through metal sputter deposition, or may be formed through deposition using an electroplating process. The metal material may be copper, silver, or another metal material. This is not specifically limited in this embodiment of this application.
When the second shielding structure 16 is an electrically conductive adhesive material, the electrically conductive adhesive material may be formed through coating. A commonly used conductive adhesive material may be an electrically conductive adhesive material including metal silver, namely, conductive silver adhesive.
When the insulation material 17 is filled, the side wall formed by the insulation material 17 extends outward in a top-down direction.
In this case, a first connection part filled with the insulation material 17 includes two connection surfaces, one connection surface close to the circuit board is a first connection surface, and the other connection surface close to the chip package body is a second connection surface.
A width of the first connection surface is greater than a width of the second connection surface. In other words, an upper side of the insulation material 17 is narrow, and a lower side is wide.
When a material of the second shielding structure 16 is implemented by using the conductive film, the conductive film may be formed through spraying and against a side wall of the insulation material 17, to ensure that the second shielding structure 16 encloses the metal solder balls 30 on the inner side.
When the second shielding structure is implemented by using a metal material, the metal material may be formed through metal sputter deposition or deposition using an electroplating process, or may be formed against a side wall of the insulation material 17, to ensure that the second shielding structure 16 encloses the metal solder balls 30 on the inner side.
When the second shielding structure is implemented by using an electrically conductive adhesive material, the electrically conductive adhesive material may be formed through coating and against a side wall of the insulation material 17, to ensure that the second shielding structure 16 encloses the metal solder balls 30 on the inner side.
In conclusion, the side wall of the insulation material 17 may provide support for the second shielding structure 16. In addition, the insulation material 17 may also reinforce a connection between the PCB and the package substrate.
The insulation material 17 in the following accompanying drawings and descriptions of this application uses a filling manner in
A top view shown in
A solder pad shown in
In some other embodiments, the solder pad may not be surrounded by the chip package body, to save materials.
In this case, an electromagnetic shielding enclosure formed by the first shielding structure 13 and the second shielding structure 16 covers the chip package body and the first connection part. This reduces electromagnetic leakage of the first connection part, improves an electromagnetic shielding capability of the chip package body, ensures chip performance, and reduces impact of electromagnetic leakage on another circuit component.
In this implementation, a second shielding structure 16 of the electromagnetic shielding enclosure is a conductive film, and the conductive film may further completely cover the second shielding structure 16. In this case, the second shielding structure 16 may be connected to the first shielding structure 13 through a cohesive material, in other words, the cohesive material is added to a contact surface between the second shielding structure 16 and the first shielding structure 13, to improve stability of a connection between the second shielding structure 16 and the first shielding structure 13.
The following describes a technical effect of the electromagnetic shielding enclosure shown in
The waveforms of the simulation test illustrated illustrate shielding performance in a frequency band from 2 GHz to 10 GHz when the solutions of
The shielding performance indicates attenuation of an electromagnetic wave by a shielding body. Because the shielding body can usually attenuate an electromagnetic wave strength to one hundredth to one ten-thousandth of an original strength, the shielding performance is usually expressed in decibels (dB).
Data of the simulation test in
It may be learned that, compared with the conventional technology shown in
The following describes other implementations of the electromagnetic shielding enclosure.
A first surface of a chip 11 is connected to a first shielding structure 13 through a first material 12. A second surface of the chip 11 is electrically connected to a first surface of a package substrate 14. The first shielding structure 13 is fastened to a side wall of the package substrate 14 through a second connection part 15.
In a possible implementation, the first material 12 may be a thermal interface material, and the thermal interface material is filled between the first surface of the chip 11 and the first shielding structure. In one aspect, the thermal interface material can assist in heat dissipation, so that heat generated when the chip works is quickly conducted to the first shielding structure. In another aspect, support for the first shielding structure is provided, and stability of the first shielding structure is improved. In addition, the first shielding structure is fastened to the side wall of the package substrate, so that a side surface of the chip package body is enclosed. This improves an electromagnetic shielding effect.
In a possible implementation, the second connection part 15 is a metal solder, and the first shielding structure 13 is welded to the side wall of the package substrate 14 through the second connection part 15. In this case, the first shielding structure 13 is securely connected to the package substrate 14, and the electromagnetic shielding enclosure has good electromagnetic shielding performance.
In another possible implementation, the second connection part 15 is an electrically conductive adhesive, and the first shielding structure 13 is fastened to the side wall of the package substrate 14 through the second connection part 15. In this manner, the electromagnetic shielding enclosure can have good electromagnetic shielding performance.
In still another possible implementation, the second connection part 15 is an insulation collosol, and the first shielding structure 13 is fastened to the side wall of the package substrate 14 through the second connection part 15. In this manner, manufacturing difficulty is reduced, and the first shielding structure can be securely connected to the package substrate.
A first end of a second shielding structure 16 is connected to a solder pad 201. The solder pad 201 is grounded, so that an electromagnetic shielding capability of the electromagnetic shielding enclosure for a chip and a first connection part is improved. A second end of the second shielding structure 16 is connected to the first shielding structure 13.
A difference between the implementation shown in the
The insulation material 17 is filled among a chip package body, a circuit board 20, and a plurality of metal solder balls 30, that is, a gap between a lower surface of a package substrate 14 and the PCB 20 is filled with the insulation material 17.
The insulation material 17 may be an underfill material, for example, an epoxy resin material. The insulation material 17 may fill gaps between a plurality of metal solder balls according to a capillary principle.
The insulation material 17 may fill the gap among the chip package body, the circuit board 20, and the plurality of metal solder balls as much as possible, or fill the insulation material 17 only at an edge of a connection region between the chip package body and the circuit board 20.
The second shielding structure 16 covers a side wall of the insulation material 17. A first end of the second shielding structure 16 is connected to a solder pad 201, and the solder pad 201 is grounded, thereby improving an electromagnetic shielding capability of the electromagnetic shielding enclosure for a chip and the first connection part. A second end of the second shielding structure 16 is connected to a first shielding structure 13.
In conclusion, the electromagnetic shielding enclosure provided in this application is used, so that electromagnetic shielding on the first connection part can be implemented, and electromagnetic leakage of the first connection part is reduced, to further improve an electromagnetic shielding capability of the chip package body, ensure chip performance, and reduce impact of electromagnetic leakage on another circuit component.
The following describes implementations of another electromagnetic shielding enclosure.
A chip package body shown in
The chip 11 is electrically connected to a first surface of a package substrate 14, and a first shielding structure covers an outer surface of the molding compound 18 and a side wall of the package substrate 14.
In this case, a first shielding structure 13 may be a conductive film, a metal material, or an electrically conductive adhesive material.
Specifically, when the first shielding structure 13 is implemented by using the conductive film, the conductive film may be formed through spraying.
When the first shielding structure 13 is implemented by using the metal material, the metal material may be formed through metal sputter deposition or deposition using an electroplating process, and the metal material may alternatively be a metal mechanical part that is formed through stamping or casting.
When the first shielding structure 13 is implemented by using the electrically conductive adhesive material, the electrically conductive adhesive material may be formed through coating.
In one aspect, the molding compound 18 can assist in heat dissipation, so that heat generated when the chip works is quickly conducted to the first shielding structure 13. In another aspect, the molding compound 18 provides support for the first shielding structure 13, and this improves stability of the first shielding structure, and enables the first shielding structure 13 to be formed against the molding compound 18.
The first shielding structure 13 covers an outer surface of the molding compound 18 and a side wall of the package substrate 14, to enclose the chip package body. This improves an electromagnetic shielding effect.
A second surface of the chip 11 is electrically connected to a first surface of the package substrate 14.
In a possible implementation, a surface of the chip 11 includes a metal bump, an upper surface of the package substrate 14 includes a solder pad, solder paste is printed on the surface of the package substrate 14, and the chip 11 and the package substrate 14 are welded in a reflow soldering manner. In some embodiments, an underfill material may be injected between the chip 11 and the package substrate 14, to improve connection stability. The underfill material is an insulation material. A specific type of the underfill material is not limited in this embodiment of this application, for example, may be epoxy resin.
A lower surface of the package substrate 14 is electrically connected to the PCB 20 through metal solder balls 30. Specifically, a package substrate 14 may be electrically connected to the PCB by using a reflow soldering process.
There is a solder pad 201 on the PCB. The solder pad 201 is a metal solder pad. The solder pad 201 is connected to a ground circuit layer of the PCB. The solder pad 201 may be connected to the ground circuit layer of the PCB through a plated through-hole structure or a slotted electroplated structure. This is not specifically limited in this embodiment of this application.
A second shielding structure 16 encloses the metal solder balls 30 on an inner side, to implement electromagnetic shielding on the metal solder balls 30. Implementations of the second shielding structure and the first shielding structure may be the same or may be different. This is not specifically limited in this application.
When the second shielding structure is implemented by using a conductive film, the conductive film may be formed through spraying. When the second shielding structure is implemented by using a metal material, the metal material may be generated through metal sputtering deposition or deposition using an electroplating process. When the second shielding structure is implemented by using an electrically conductive adhesive material, the electrically conductive adhesive material may be formed through coating.
A difference between the implementation shown in the
A region among a package substrate of a chip package body, a circuit board 20, and a plurality of metal solder balls is filled with the insulation material 17, that is, a gap between a lower surface of the package substrate 14 and the PCB 20 is filled with the insulation material 17.
The insulation material 17 may be an underfill material, for example, an epoxy resin material. The insulation material 17 may fill gaps between the plurality of metal solder balls according to a capillary principle.
The insulation material 17 may fill as much as possible the region among the package substrate of the chip package body, the circuit board 20, and the plurality of metal solder balls, or fill only an edge of a connection region between the chip package body and the circuit board 20.
A second shielding structure 16 covers a side wall of the insulation material 17. A first end of the second shielding structure 16 is connected to a solder pad 201. Grounding of the solder pad 201 improves an electromagnetic shielding capability of an electromagnetic shielding enclosure for a chip and the first connection part. A second end of the second shielding structure 16 is connected to a first shielding structure 13.
In conclusion, the electromagnetic shielding enclosure provided in this application is used, so that electromagnetic shielding on the first connection part can be implemented, and electromagnetic leakage of the first connection part is reduced, to further improve an electromagnetic shielding capability of the chip package body, ensure chip performance, and reduce impact of electromagnetic leakage on another circuit component.
The following describes a diagram of an electromagnetic shielding enclosure of still another chip package body.
A difference between an electromagnetic shielding enclosure shown in
In one aspect, the molding compound 18 can assist in heat dissipation, so that heat generated when a chip 11 works is quickly conducted to the first shielding structure 13. In another aspect, the molding compound 18 provides support for the first shielding structure 13, and this improves stability of fastening the first shielding structure. In addition, the first shielding structure covers an outer surface of the molding compound and a side wall of the package substrate. Compared with the implementation in
When the first shielding structure 13 is implemented by using a conductive film, the conductive film may be formed through spraying. When the first shielding structure 13 is implemented by using a metal material, the metal material may be generated through metal sputtering deposition or deposition using an electroplating process. When the first shielding structure 13 is implemented by using an electrically conductive adhesive material, the electrically conductive adhesive material may be formed through coating.
A first end of a second shielding structure 16 is connected to a solder pad 201 on a PCB 20, and the solder pad 201 is grounded to improve an electromagnetic shielding capability of an electromagnetic shielding enclosure for a chip and a metal solder ball. A second end of the second shielding structure 16 is connected to the first shielding structure 13. In this case, the second shielding structure 16 further covers a side surface of the package substrate 14.
Implementations of the second shielding structure 16 and the first shielding structure 13 may be the same or may be different. This is not specifically limited in this embodiment of this application. When the second shielding structure 16 is implemented by using a conductive film, the conductive film may be formed through spraying. When the second shielding structure 16 is implemented by using a metal material, the metal material may be generated through metal sputtering deposition or deposition using an electroplating process. When the second shielding structure 16 is implemented by using an electrically conductive adhesive material, the electrically conductive adhesive material may be formed through coating.
A difference between the implementation shown in the
A region among a package substrate of a chip package body, a circuit board 20, and a plurality of metal solder balls 30 is filled with the insulation material 17, that is, a gap region between a lower surface of a package substrate 14 and the PCB 20 is filled with the insulation material 17.
The insulation material 17 may be an underfill material, for example, an epoxy resin material. The insulation material 17 may fill gaps between the plurality of metal solder balls according to a capillary principle.
The insulation material 17 may fill as much as possible the region among the package substrate of the chip package body, the circuit board 20, and the plurality of metal solder balls 30, or fill only an edge of a connection region between the chip package body and the circuit board 20.
The second shielding structure 16 covers a side wall of the insulation material 17. A first end of the second shielding structure 16 is connected to a solder pad 201, and the solder pad 201 is grounded, thereby improving an electromagnetic shielding capability of the electromagnetic shielding enclosure for a chip and the first connection part. A second end of the second shielding structure 16 is connected to a first shielding structure 13.
In conclusion, the electromagnetic shielding enclosure provided in this application is used, so that electromagnetic shielding on the first connection part can be implemented, and electromagnetic leakage of the first connection part is reduced, to further improve an electromagnetic shielding capability of the chip package body, ensure chip performance, and reduce impact of electromagnetic leakage on another circuit component.
The following describes an implementation of another chip system.
The chip package body 10 includes a chip and a package substrate. The package substrate is located on the solder pad 201, a first end of the second shielding structure is electrically connected to the solder pad 201, and a second end of the second shielding structure is electrically connected to the first shielding structure.
The pins on the PCB 20 include a first pin 202 and a grounding pin 203. Specific distribution and quantities of first pins 202 and grounding pins 203 are not specifically limited in this application. The first pin 202 is a signal transmission pin, and the grounding pin 203 is configured to be grounded.
A projection of the first pin 202 on the plane on which the x axis and the y axis are located is within a range covered by a contour of the chip package body 10. A projection of the grounding pin 203 on the plane on which the x axis and the y axis are located is partially within the range covered by the contour of the chip package body 10, or is completely outside the range covered by the contour of the chip package body 10. In this application, an example in which the grounding pin 203 is partially within the range covered by the contour of the chip package body 10 is used for description.
Projections of two sides of the solder pad 201 on the plane on which the x axis and the y axis are located outside the range covered by the contour of the chip package body 10. Regions extended from the two sides of the solder pad 201, namely, a region B and a region B1 shown in the figure, are used to implement an electrical connection between the solder pad 201 and the first shielding structure by using a soldering process. Specific areas of the region B and the region B1 are not limited in this embodiment of this application.
A region C and a region C1 in the figure are regions in which the chip package body 10 and the PCB 20 are connected by using an electrical signal. In a possible implementation, when an LGA packaging manner is used, a contact required when the chip package body 10 is connected to the PCB 20 is located on the PCB 20, and a lower side of the package substrate covers a grid-shape connection end. The PCB 20 communicates with the chip package body by using a point contact technology. The PCB 20 provides a pin, which may replace the solder ball in BGA packaging.
The region may be filled with an insulation material. The insulation material may be an underfill material, for example, an epoxy resin material. The insulation material may fill a gap according to a capillary principle.
In some other embodiments, the region may not be filled with the insulation material.
Regions extending from two sides of a solder pad 201, namely, a region B and a region B1 shown in the figure, are used to form a second shielding structure 16 by using a soldering process, so that the solder pad 201 is electrically connected to a first shielding structure 13.
That is, one end of the second shielding structure 16 is connected to the solder pad 201, and the other end is connected to the first shielding structure 13.
A first surface of a chip 11 is fastened to the first shielding structure 13 through a first material 12.
In a possible implementation, the first material 12 is a TIM material, and the TIM material is mostly a flexible material, for example, may be a gel or a silicone lipide material. When the TIM material is filled between the first surface of the chip 11 and the first shielding structure 13, in one aspect, heat dissipation can be assisted, so that heat generated when the chip 11 works is quickly conducted to the first shielding structure, and in another aspect, support for the first shielding structure 13 is provided, thereby improving stability of the first shielding structure 13.
In this case, the first shielding structure 13 is a metal mechanical part, and the metal mechanical part may be formed through stamping or casting. This is not specifically limited in this embodiment of this application. The metal mechanical part has a groove structure, and the groove is configured to accommodate a corresponding part of the chip package body, to implement electromagnetic shielding on the chip package body.
Because the solder pad 201 is electrically connected to the first shielding structure 13 through the second shielding structure 16, when the solder pad 201 is grounded, the second shielding structure 16 and the first shielding structure 13 are also grounded. This improves electromagnetic shielding performance.
Further, because the grounding pins 203 on the PCB 20 are partially located outside a range covered by an outline of the chip package body 10, the grounding pins 203 may alternatively be electrically connected to the first shielding structure 13 by using a soldering process, to avoid grounding on the PCB 20 through wiring, and this simplifies a ground line.
In this case, a first shielding structure 13 may be a conductive film, a metal material, or an electrically conductive adhesive material.
Specifically, when the first shielding structure 13 is implemented by using the conductive film, the conductive film may be formed through spraying.
When the first shielding structure 13 is implemented by using the metal material, the metal material may be formed through metal sputter deposition or deposition using an electroplating process, and the metal material may alternatively be a metal mechanical part that is formed through stamping or casting.
When the first shielding structure 13 is implemented by using the electrically conductive adhesive material, the electrically conductive adhesive material may be formed through coating.
In one aspect, the molding compound 18 can assist in heat dissipation, so that heat generated when the chip works is quickly conducted to the first shielding structure 13. In another aspect, the molding compound 18 provides support for the first shielding structure 13, and this improves stability of the first shielding structure, and enables the first shielding structure 13 to be formed against the molding compound 18.
The first shielding structure 13 covers an outer surface of the molding compound 18 and a side wall of the package substrate 14, to enclose the chip package body. This improves an electromagnetic shielding effect.
A part of a grounding pin 203 extended to outside a range of the chip package body 10 may alternatively form the second shielding structure 16 by using the soldering process, to implement an electrical connection to the first shielding structure 13. This avoids grounding on a PCB 20 through wiring, and simplifies a grounding line. In addition, the grounding pin 203, the solder pad 201, the first shielding structure 13, and the second shielding structure 16 enclose a first pin 202, and this further improves electromagnetic shielding performance of a chip system.
In this case, a first shielding structure 13 may be a conductive film, a metal material, or an electrically conductive adhesive material.
Specifically, when the first shielding structure 13 is implemented by using the conductive film, the conductive film may be formed through spraying.
When the first shielding structure 13 is implemented by using the metal material, the metal material may be formed through metal sputter deposition or deposition using an electroplating process, and the metal material may alternatively be a metal mechanical part that is formed through stamping or casting.
When the first shielding structure 13 is implemented by using the electrically conductive adhesive material, the electrically conductive adhesive material may be formed through coating.
In one aspect, the molding compound 18 can assist in heat dissipation, so that heat generated when the chip works is quickly conducted to the first shielding structure 13. In another aspect, the molding compound 18 provides support for the first shielding structure 13, and this improves stability of the first shielding structure, and enables the first shielding structure 13 to be formed against the molding compound 18.
The first shielding structure 13 covers an outer surface of the molding compound 18 and a side wall of the package substrate 14, to enclose the chip package body. This improves an electromagnetic shielding effect.
A first part of the second shielding structure is a conductive film, the conductive film covers an exterior of a second shielding structure 16, and the conductive film is fastened by using regions extending from two sides of a solder pad 201.
A part of the grounding pin 203 extends to outside a range of a chip package body 10, and forms a second part of the second shielding structure 16 by using a soldering process, to implement an electrical connection to a first shielding structure 13. This avoids grounding on a PCB 20 through wiring, and simplifies a grounding line. In addition, the grounding pin 203, the solder pad 201, the first shielding structure 13, and the second shielding structure 16 enclose a first pin 202, and this improves electromagnetic shielding performance of a chip system.
In this case, the solder pad 201, the first shielding structure 13, and the second shielding structure 16 enclose the first pin 202, and this improves electromagnetic shielding performance of the chip system.
It may be understood that, the foregoing description is provided by using an example in which the first pin 202 and the grounding pin 203 in the chip system are located on an upper side and a lower side of the chip package body 10. In actual application, as a quantity of first pins 202 and grounding pins 203 changes, layout positions of the first pins 202 and the grounding pins 203 may be adjusted accordingly, and may be arranged only on one side, or arranged on three sides, or arranged on four sides. Details are not described herein again.
Based on the chip system provided in the foregoing embodiment, an embodiment of this application further provides a communication device to which the chip system is applied. The following provides specific descriptions.
The communication device includes a PCB, and a chip package body corresponding to an intermediate frequency (IF) chip and a radio frequency (RF) chip on the PCB may use the chip system provided in the foregoing embodiment.
The following uses an example in which the communication device is a radio frequency transceiver for description.
A radio frequency transceiver 01 applied to a wireless communication system supports a multiple-input multiple-output (MIMO) function, and can simultaneously send signals to different user equipment (UE) by using a plurality of transmit antennas, and simultaneously receive, by using a plurality of receive antennas, signals sent by a plurality of UE 02.
A radio frequency transceiver system provided in embodiments of this application includes the radio frequency transceiver 01 and a base-band unit (BBU) 03.
In actual application, the radio frequency transceiver system generally includes a plurality of radio frequency transceivers 01 and a plurality of BBUs 03. One BBU 03 supports simultaneous access of a plurality of radio frequency transceivers 01. A specific quantity of radio frequency transceivers 01 that are simultaneously accessed by one BBU 03 is not limited in embodiments of this application.
When the radio frequency transceiver system includes a plurality of BBUs 03, a quantity of radio frequency transceivers 01 connected to the BBUs 03 may be the same or may be different. This is not specifically limited in embodiments of this application.
The radio frequency transceiver 01 is connected to the BBU 03 through an optical fiber. In one aspect, the radio frequency transceiver 01 obtains, through the optical fiber, an optical signal sent by the BBU, converts the optical signal into a high-speed electrical signal through an optical module, processes the high-speed electrical signal by using an internal baseband circuit, an intermediate frequency circuit, and a radio frequency power amplification circuit, and then sends a processed high-speed electrical signal to a plurality of user equipment through a plurality of transmit antennas. In another aspect, the radio frequency transceiver 01 can receive, through a plurality of receive antennas, radio frequency signals sent by the plurality of user equipment, process the radio frequency signals by using the internal radio frequency power amplification circuit, the intermediate frequency circuit, and the baseband circuit, convert processed radio frequency signals into high-speed electrical signals, convert the high-speed electrical signals into optical signals through the optical module, and transmit the optical signals to the BBU 03 through the optical fiber.
An intermediate frequency chip of the intermediate frequency circuit may be applied to the chip system provided in this embodiment of this application, that is, the chip package body of the intermediate frequency chip is disposed on a PCB on which the intermediate frequency circuit is located by using the foregoing electromagnetic shield.
In conclusion, the chip system included in the communication device provided in this embodiment of this application can implement electromagnetic shielding on a first connection part, reduce electromagnetic leakage of the first connection part, improve an electromagnetic shielding capability of the chip package body, ensure chip performance, and reduce impact of electromagnetic leakage on another circuit component, thereby improving performance of the communication device.
The foregoing descriptions are merely specific implementations of this application. It should be noted that a person of ordinary skill in the art can further make several improvements and modifications without departing from the principles of this application, and these improvements and modifications shall also be considered as the protection scope of this application.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202111479134.2 | Dec 2021 | CN | national |
This application is a continuation of International Application No. PCT/CN2022/131597, filed on Nov. 14, 2022, which claims priority to Chinese Patent Application No. 202111479134.2, filed on Dec. 6, 2021. The disclosures of the aforementioned applications are hereby incorporated by reference in their entireties.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2022/131597 | Nov 2022 | WO |
| Child | 18734122 | US |
