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San Diego, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Stacked multi-chip integrated circuit package
Patent number
9,406,649
Issue date
Aug 2, 2016
QUALCOMM Incorporated
Dongming He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Crack stopping structure in wafer level packaging (WLP)
Patent number
9,379,065
Issue date
Jun 28, 2016
QUALCOMM Incorporated
Lizabeth Ann Keser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor
Patent number
9,263,186
Issue date
Feb 16, 2016
QUALCOMM Incorporated
Yue Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect pillars with directed compliance geometry
Patent number
9,184,144
Issue date
Nov 10, 2015
QUALCOMM Incorporated
Zhongping Bao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked multi-chip integrated circuit package
Patent number
8,963,339
Issue date
Feb 24, 2015
QUALCOMM Incorporated
Dongming He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management of integrated circuits using phase change materi...
Patent number
8,937,384
Issue date
Jan 20, 2015
QUALCOMM Incorporated
Zhongping Bao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-circular under bump metallization (UBM) structure, orientation...
Patent number
8,847,391
Issue date
Sep 30, 2014
QUALCOMM Incorporated
Zhongping Bao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for use case-based thermal analysis of heuristica...
Patent number
8,601,428
Issue date
Dec 3, 2013
QUALCOMM Incorporated
James D. Burrell
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
STRUCTURE AND METHOD FOR PROTECTING STRESS-SENSITIVE INTEGRATED CIR...
Publication number
20160013136
Publication date
Jan 14, 2016
QUALCOMM Incorporated
Vidhya RAMACHANDRAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED MULTI-CHIP INTEGRATED CIRCUIT PACKAGE
Publication number
20150155265
Publication date
Jun 4, 2015
QUALCOMM Incorporated
Dongming He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CRACK STOPPING STRUCTURE IN WAFER LEVEL PACKAGING (WLP)
Publication number
20150048517
Publication date
Feb 19, 2015
QUALCOMM Incorporated
Lizabeth Ann Keser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DC/ AC DUAL FUNCTION POWER DELIVERY NETWORK (PDN) DECOUPLING CAPACITOR
Publication number
20140252544
Publication date
Sep 11, 2014
QUALCOMM Incorporated
Yue Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED MULTI-CHIP INTEGRATED CIRCUIT PACKAGE
Publication number
20140097535
Publication date
Apr 10, 2014
QUALCOMM Incorporated
Dongming He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-CIRCULAR UNDER BUMP METALLIZATION (UBM) STRUCTURE, ORIENTATION...
Publication number
20140008788
Publication date
Jan 9, 2014
QUALCOMM Incorporated
Zhongping Bao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT OF INTEGRATED CIRCUITS USING PHASE CHANGE MATERI...
Publication number
20130285233
Publication date
Oct 31, 2013
QUALCOMM Incorporated
Zhongping Bao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System and Method For Use Case-Based Thermal Analysis of Heuristica...
Publication number
20130167103
Publication date
Jun 27, 2013
QUALCOMM Incorporated
James D. Burrell
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Interconnect Pillars with Directed Compliance Geometry
Publication number
20130020711
Publication date
Jan 24, 2013
QUALCOMM Incorporated
Zhongping Bao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Reinforced Wafer-Level Molding to Reduce Warpage
Publication number
20120025362
Publication date
Feb 2, 2012
QUALCOMM Incorporated
Arvind Chandrasekaran
H01 - BASIC ELECTRIC ELEMENTS