Zhongqin Zhang

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Marlborough, MA, US

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Patents Applicationslast 30 patents

Information Patent Application
ELECTROPLATED LEAD-FREE BUMP DEPOSITION
- Publication number 20120325671
- Publication date Dec 27, 2012
- TEL NEXX, Inc.
- Arthur Keigler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR