Zhuojie Wu

Person

Port Chester, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Moisture detection along input/output opening in IC structure
- Patent number 12,265,048
- Issue date Apr 1, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- G01 - MEASURING TESTING
Information Patent Grant
IC structure moisture ingress detection by current hump in current-...
- Patent number 12,158,442
- Issue date Dec 3, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- G01 - MEASURING TESTING
Information Patent Grant
Moisture seal for photonic devices
- Patent number 11,810,870
- Issue date Nov 7, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Asli Sahin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture seal for photonic devices
- Patent number 11,587,888
- Issue date Feb 21, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Asli Sahin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level testing of lasers attached to photonics chips
- Patent number 11,531,172
- Issue date Dec 20, 2022
- GLOBALFOUNDRIES U.S. INC.
- Zhuojie Wu
- G02 - OPTICS
Information Patent Grant
IC structure with interdigitated conductive elements between metal...
- Patent number 10,770,407
- Issue date Sep 8, 2020
- GLOBALFOUNDRIES Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure integrity sensor having interdigitated conductive elem...
- Patent number 9,947,602
- Issue date Apr 17, 2018
- GLOBALFOUNDRIES Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE WITH CAVITY AROUND THROUGH SEMICONDUCTOR VIA
- Publication number 20240429127
- Publication date Dec 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Dewei Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FINGER STRUCTURE IN INPUT/OUTPUT OPENING OF IC CHIP
- Publication number 20240361545
- Publication date Oct 31, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER CHIPS ATTACHED TO A PHOTONICS CHIP BY MULTIPLE ANCHORS
- Publication number 20240356302
- Publication date Oct 24, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER CHIPS ATTACHED TO A PHOTONICS CHIP BY MULTIPLE ADHESIVES
- Publication number 20240348005
- Publication date Oct 17, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTORS WITH A LIGHT-ABSORBING LAYER AT LEAST PARTIALLY WRAP...
- Publication number 20240347652
- Publication date Oct 17, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPENING IN WALL BETWEEN INPUT/OUTPUT OPENINGS OF IC CHIP
- Publication number 20240304570
- Publication date Sep 12, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFECT DETECTION SYSTEM FOR CAVITY IN INTEGRATED CIRCUIT
- Publication number 20240280632
- Publication date Aug 22, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- G02 - OPTICS
Information Patent Application
PHOTONICS CHIPS WITH THERMAL MANAGEMENT FOR A CAVITY-MOUNTED CHIP
- Publication number 20240264374
- Publication date Aug 8, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INCLUDING MOISTURE BARRIER ALONG INPUT/OUTPUT OPENING AND...
- Publication number 20240243078
- Publication date Jul 18, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH AIR GAPS EXTENDING FROM DIELECTRIC LINER AROUND THRO...
- Publication number 20240243037
- Publication date Jul 18, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Dewei Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE DETECTION ALONG INPUT/OUTPUT OPENING IN IC STRUCTURE
- Publication number 20240167974
- Publication date May 23, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- G02 - OPTICS
Information Patent Application
CAVITY-MOUNTED CHIPS WITH MULTIPLE ADHESIVES
- Publication number 20240154384
- Publication date May 9, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIC STRUCTURE WITH WIRE(S) BETWEEN Z-STOP SUPPORTS ON SIDE OF OPTIC...
- Publication number 20240103237
- Publication date Mar 28, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT INCLUDING PLURALITY OF DISCRETE OPTICAL...
- Publication number 20240094465
- Publication date Mar 21, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Yusheng Bian
- G02 - OPTICS
Information Patent Application
IC STRUCTURE MOISTURE INGRESS DETECTION BY CURRENT HUMP IN CURRENT-...
- Publication number 20240077445
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- G01 - MEASURING TESTING
Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCATTERING LIGHT-BASED MONITOR FOR PHOTONIC INTEGRATED CIRCUIT, MON...
- Publication number 20240019651
- Publication date Jan 18, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT INCLUDING PASSIVE OPTICAL GUARD
- Publication number 20230408763
- Publication date Dec 21, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- G02 - OPTICS
Information Patent Application
MOISTURE SEAL FOR PHOTONIC DEVICES
- Publication number 20230126719
- Publication date Apr 27, 2023
- GlobalFoundries U.S. Inc.
- Asli SAHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL TESTING OF LASERS ATTACHED TO PHOTONICS CHIPS
- Publication number 20210356684
- Publication date Nov 18, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- G01 - MEASURING TESTING
Information Patent Application
MOISTURE SEAL FOR PHOTONIC DEVICES
- Publication number 20210183791
- Publication date Jun 17, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Asli SAHIN
- G02 - OPTICS
Information Patent Application
IC STRUCTURE WITH INTERDIGITATED CONDUCTIVE ELEMENTS BETWEEN METAL...
- Publication number 20200219826
- Publication date Jul 9, 2020
- GLOBALFOUNDRIES INC.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE INTEGRITY SENSOR HAVING INTERDIGITATED CONDUCTIVE ELEM...
- Publication number 20180047648
- Publication date Feb 15, 2018
- GLOBALFOUNDRIES INC.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Moisture detection along input/output opening in IC structure

IC structure moisture ingress detection by current hump in current-...

Moisture seal for photonic devices

Moisture seal for photonic devices

Wafer-level testing of lasers attached to photonics chips

IC structure with interdigitated conductive elements between metal...

IC structure integrity sensor having interdigitated conductive elem...

Patents Applicationslast 30 patents

STRUCTURE WITH CAVITY AROUND THROUGH SEMICONDUCTOR VIA

METAL FINGER STRUCTURE IN INPUT/OUTPUT OPENING OF IC CHIP

LASER CHIPS ATTACHED TO A PHOTONICS CHIP BY MULTIPLE ANCHORS

LASER CHIPS ATTACHED TO A PHOTONICS CHIP BY MULTIPLE ADHESIVES

PHOTODETECTORS WITH A LIGHT-ABSORBING LAYER AT LEAST PARTIALLY WRAP...

OPENING IN WALL BETWEEN INPUT/OUTPUT OPENINGS OF IC CHIP

DEFECT DETECTION SYSTEM FOR CAVITY IN INTEGRATED CIRCUIT

PHOTONICS CHIPS WITH THERMAL MANAGEMENT FOR A CAVITY-MOUNTED CHIP

STRUCTURE INCLUDING MOISTURE BARRIER ALONG INPUT/OUTPUT OPENING AND...

STRUCTURE WITH AIR GAPS EXTENDING FROM DIELECTRIC LINER AROUND THRO...

MOISTURE DETECTION ALONG INPUT/OUTPUT OPENING IN IC STRUCTURE

CAVITY-MOUNTED CHIPS WITH MULTIPLE ADHESIVES

PIC STRUCTURE WITH WIRE(S) BETWEEN Z-STOP SUPPORTS ON SIDE OF OPTIC...

PHOTONIC INTEGRATED CIRCUIT INCLUDING PLURALITY OF DISCRETE OPTICAL...

IC STRUCTURE MOISTURE INGRESS DETECTION BY CURRENT HUMP IN CURRENT-...

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

SCATTERING LIGHT-BASED MONITOR FOR PHOTONIC INTEGRATED CIRCUIT, MON...

PHOTONIC INTEGRATED CIRCUIT INCLUDING PASSIVE OPTICAL GUARD

MOISTURE SEAL FOR PHOTONIC DEVICES

WAFER-LEVEL TESTING OF LASERS ATTACHED TO PHOTONICS CHIPS

MOISTURE SEAL FOR PHOTONIC DEVICES

IC STRUCTURE WITH INTERDIGITATED CONDUCTIVE ELEMENTS BETWEEN METAL...

IC STRUCTURE INTEGRITY SENSOR HAVING INTERDIGITATED CONDUCTIVE ELEM...