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Zhuqing Zhang
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Corvallis, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Encapsulating a bonded wire with low profile encapsulation
Patent number
10,946,658
Issue date
Mar 16, 2021
Hewlett-Packard Development Company, L.P.
Chien-Hua Chen
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Vent
Patent number
10,603,922
Issue date
Mar 31, 2020
Hewlett-Packard Development Company, L.P.
David R Otis
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Device including interposer between semiconductor and substrate
Patent number
9,686,864
Issue date
Jun 20, 2017
Hewlett-Packard Development Company, L.P.
Robert G Walmsley
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Display device having multiplexing resistors within resin layer
Patent number
7,859,498
Issue date
Dec 28, 2010
Hewlett-Packard Development Company, L.P.
Alan R. Arthur
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Patents Applications
last 30 patents
Information
Patent Application
MOLDED FLUIDIC DIE ASSEMBLIES
Publication number
20230104463
Publication date
Apr 6, 2023
Hewlett-Packard Development Company, L.P.
Kenneth James Faase
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
Encapsulating a Bonded Wire with Low Profile Encapsulation
Publication number
20200139705
Publication date
May 7, 2020
Hewlett-Packard Development Company, L.P.
Chien-Hua Chen
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
VENT
Publication number
20170368835
Publication date
Dec 28, 2017
Hewlett-Packard Development Company, L.P.
David R Otis
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
Encapsulating a Bonded Wire with Low Profile Encapsulation
Publication number
20160257117
Publication date
Sep 8, 2016
Hewlett-Packard Development Company, L.P.
Chien-Hua Chen
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
SEMICONDUCTOR SECURED TO SUBSTRATE VIA HOLE IN SUBSTRATE
Publication number
20150191349
Publication date
Jul 9, 2015
Hewlett-Packard Development Company, L.P.
Jennifer Wu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
STRUCTURED GLASS WAFER FOR PACKAGING A MICROELECTROMECHANICAL-SYSTE...
Publication number
20120199920
Publication date
Aug 9, 2012
Zhuqing ZHANG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICRO DEVICE PACKAGING
Publication number
20120012963
Publication date
Jan 19, 2012
Zhuqing Zhang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
IMPRINT LITHOGRAPHY APPARATUS AND METHOD
Publication number
20100264560
Publication date
Oct 21, 2010
Zhuqing Zhang
B82 - NANO-TECHNOLOGY
Information
Patent Application
Display device having multiplexing resistors within resin layer
Publication number
20080266242
Publication date
Oct 30, 2008
Alan R. Arthur
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS