Ziyu LIU

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Beijing, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for bonding semiconductor devices on sustrate and bonding st...
- Patent number 9,613,925
- Issue date Apr 4, 2017
- Tsinghua University
- Jian Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bolometer and preparation method thereof
- Patent number 9,258,894
- Issue date Feb 9, 2016
- Tsinghua University
- Jian Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ADAPTER PANEL AND MANUFACTURING METHOD AND ENCAPSULATION STRUCTURE...
- Publication number 20170323849
- Publication date Nov 9, 2017
- Qian WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDING STRUCTURE FORMED USING THE SAME
- Publication number 20160172326
- Publication date Jun 16, 2016
- TSINGHUA UNIVERSITY
- Jian CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOLOMETER AND PREPARATION METHOD THEREOF
- Publication number 20150021479
- Publication date Jan 22, 2015
- Jian Cai
- G01 - MEASURING TESTING