10th Group

Industry

CPC
H01L2924/052

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/05210th Group

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonded assembly containing oxidation barriers and/or adhesion enhan...
- Patent number 11,139,272
- Issue date Oct 5, 2021
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having circuit board to which contact part is...
- Patent number 11,107,784
- Issue date Aug 31, 2021
- Fuji Electric Co., Ltd.
- Rikihiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction structure
- Patent number 11,088,308
- Issue date Aug 10, 2021
- TDK Corporation
- Takasi Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,825,792
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pnictide buffer structures and devices for GaN base applications
- Patent number 10,615,141
- Issue date Apr 7, 2020
- IQE plc
- Andrew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,381,323
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rare earth pnictides for strain management
- Patent number 10,332,857
- Issue date Jun 25, 2019
- IQE plc
- Andrew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,020,281
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines and pads and method of manufacturing thereof
- Patent number 8,586,472
- Issue date Nov 19, 2013
- Infineon Technologies AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...
- Publication number 20250054888
- Publication date Feb 13, 2025
- Huawei Technologies Co., Ltd
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20240395654
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230163085
- Publication date May 25, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ayuhiko SAITOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS AND/OR ADHESION ENHAN...
- Publication number 20210028149
- Publication date Jan 28, 2021
- SANDISK TECHNOLOGIES LLC
- Raghuveer S. MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JUNCTION STRUCTURE
- Publication number 20200321499
- Publication date Oct 8, 2020
- TDK Corporation
- Takasi SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200194392
- Publication date Jun 18, 2020
- Fuji Electric Co., Ltd.
- Rikihiro MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20190304948
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20180269177
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20180061804
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RARE EARTH INTERLAYS FOR MECHANICALLY LAYERING DISSIMILAR SEMICONDU...
- Publication number 20180012858
- Publication date Jan 11, 2018
- IQE, plc
- Andrew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redirecting solder material to visually inspectable package surface
- Publication number 20170278762
- Publication date Sep 28, 2017
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- G01 - MEASURING TESTING
Information Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
- Publication number 20150194398
- Publication date Jul 9, 2015
- INFINEON TECHNOLOGIES AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
- Publication number 20140048940
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
- Publication number 20120013011
- Publication date Jan 19, 2012
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded assembly containing oxidation barriers and/or adhesion enhan...

Semiconductor device having circuit board to which contact part is...

Junction structure

Metal bonding pads for packaging applications

Pnictide buffer structures and devices for GaN base applications

Metal bonding pads for packaging applications

Rare earth pnictides for strain management

Metal bonding pads for packaging applications

Conductive lines and pads and method of manufacturing thereof

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...

STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE

SEMICONDUCTOR DEVICE

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS AND/OR ADHESION ENHAN...

JUNCTION STRUCTURE

SEMICONDUCTOR DEVICE

METAL BONDING PADS FOR PACKAGING APPLICATIONS

METAL BONDING PADS FOR PACKAGING APPLICATIONS

METAL BONDING PADS FOR PACKAGING APPLICATIONS

RARE EARTH INTERLAYS FOR MECHANICALLY LAYERING DISSIMILAR SEMICONDU...

Redirecting solder material to visually inspectable package surface

Conductive Lines and Pads and Method of Manufacturing Thereof

Conductive Lines and Pads and Method of Manufacturing Thereof

Conductive Lines and Pads and Method of Manufacturing Thereof