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SEMICONDUCTOR WAFER SEAL RING
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Publication number 20250210427
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Publication date Jun 26, 2025
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Ming-Che Lee
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H01 - BASIC ELECTRIC ELEMENTS
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PUMP-OUT RESISTANT COLDPLATE
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Publication number 20250210442
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Publication date Jun 26, 2025
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Microsoft Technology Licensing, LLC
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Kathryn OSEEN-SENDA
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250210533
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Publication date Jun 26, 2025
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Samsung Electronics Co., Ltd.
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JIWON SHIN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250210502
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Publication date Jun 26, 2025
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Samsung Electronics Co., Ltd.
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Youngbae Kim
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20250210503
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Publication date Jun 26, 2025
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Kabushiki Kaisha Toshiba
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Fumiyoshi KAWASHIRO
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H01 - BASIC ELECTRIC ELEMENTS
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PRINTED CIRCUIT BOARD
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Publication number 20250212327
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Publication date Jun 26, 2025
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Samsung Electro-Mechanics Co., Ltd.
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Kyeong Yub Jung
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI-LAYER LINE STRUCTURE
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Publication number 20250210524
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Publication date Jun 26, 2025
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DAI NIPPON PRINTING CO., LTD.
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Hiroshi Kudo
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H01 - BASIC ELECTRIC ELEMENTS
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DIRECT BONDING OF SEMICONDUCTOR ELEMENTS
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Publication number 20250210585
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Publication date Jun 26, 2025
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Gaius Gillman FOUNTAIN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20250210592
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Publication date Jun 26, 2025
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KIOXIA Corporation
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Yasuo TAKEMOTO
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20250210532
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Publication date Jun 26, 2025
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ROHM CO., LTD.
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Oji SATO
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H01 - BASIC ELECTRIC ELEMENTS
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BOND PAD CONNECTION LAYOUT
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Publication number 20250210581
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Publication date Jun 26, 2025
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Lodestar Licensing Group LLC
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Bharat Bhushan
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H01 - BASIC ELECTRIC ELEMENTS