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CPC
H01L2924/0481
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/0481
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Patents Grants
last 30 patents
Information
Patent Grant
Vertically integrated wafers with thermal dissipation
Patent number
9,812,428
Issue date
Nov 7, 2017
EMPIRE TECHNOLOGY DEVELOPMENT LLC
Zhijiong Luo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION
Publication number
20170040295
Publication date
Feb 9, 2017
EMPIRE TECHNOLOGY DEVELOPMENT LLC
Zhijiong Luo
H01 - BASIC ELECTRIC ELEMENTS