11th Group

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Industry

CPC
H01L2924/0461

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/046111th Group

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packages
- Patent number 9,837,328
- Issue date Dec 5, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device packages
- Patent number 9,837,327
- Issue date Dec 5, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20160293568
- Publication date Oct 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS