11th Group

Industry

CPC
H01L2924/0541

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/054111th Group

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 11,676,936
- Issue date Jun 13, 2023
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure comprising a plurality of metal oxid...
- Patent number 10,943,873
- Issue date Mar 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 10,636,748
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing bonded body
- Patent number 10,290,601
- Issue date May 14, 2019
- Namics Corporation
- Raymond Dietz
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Package structure and method for forming the same
- Patent number 10,224,293
- Issue date Mar 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 10,163,818
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure comprising a plurality of metal oxid...
- Patent number 10,163,817
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,972,598
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame
- Patent number 9,653,385
- Issue date May 16, 2017
- SDI Corporation
- Ya-Cheng Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging device having plural microstructures disposed proximate t...
- Patent number 9,607,959
- Issue date Mar 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure comprising a plurality of metal oxid...
- Patent number 9,508,664
- Issue date Nov 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bumps and process for making same
- Patent number 9,449,931
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treating copper surfaces for packaging
- Patent number 9,425,180
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with surface treatment and meth...
- Patent number 9,385,100
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Hun Teak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,018,664
- Issue date Apr 28, 2015
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method and bonding material using metal particle
- Patent number 8,821,768
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pillar bumps and process for making same
- Patent number 8,823,166
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 8,642,392
- Issue date Feb 4, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...
- Publication number 20240266320
- Publication date Aug 8, 2024
- Yibu Semiconductor Co., Ltd.
- Yifan Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
- Publication number 20240067855
- Publication date Feb 29, 2024
- COOLER MATERIALS TECHNOLOGY INC.
- Po-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240006359
- Publication date Jan 4, 2024
- KIOXIA Corporation
- Akira NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS
- Publication number 20220328448
- Publication date Oct 13, 2022
- InnoLux Corporation
- Ming-Chang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210098418
- Publication date Apr 1, 2021
- NITTO DENKO CORPORATION
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING BONDING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20190252348
- Publication date Aug 15, 2019
- Hyundai Motor Company
- Hiyoshi Michiaki
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Package Structure
- Publication number 20180301424
- Publication date Oct 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY
- Publication number 20180082972
- Publication date Mar 22, 2018
- NAMICS CORPORATION
- Raymond DIETZ
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180082977
- Publication date Mar 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuki YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER
- Publication number 20170154863
- Publication date Jun 1, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Package with UBM and Methods of Forming
- Publication number 20160079190
- Publication date Mar 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Devices, Packaged Semiconductor Devices, and Packaging Me...
- Publication number 20160064348
- Publication date Mar 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTIVE BONDING OF A FLIP CHIP PACKAGE
- Publication number 20150137366
- Publication date May 21, 2015
- International Business Machines Corporation
- Gregory M. Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treating Copper Surfaces for Packaging
- Publication number 20150104903
- Publication date Apr 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Bumps and Process for Making Same
- Publication number 20140363966
- Publication date Dec 11, 2014
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treating Copper Surfaces for Packaging
- Publication number 20140252600
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTIVE BONDING OF A FLIP CHIP PACKAGE
- Publication number 20130320529
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Gregory M. Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Bumps and Process for Making Same
- Publication number 20120049346
- Publication date Mar 1, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20100187563
- Publication date Jul 29, 2010
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE
- Publication number 20080156398
- Publication date Jul 3, 2008
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method for semiconductor device

Semiconductor device structure comprising a plurality of metal oxid...

Package structure

Method of manufacturing bonded body

Package structure and method for forming the same

Package structure and method for forming the same

Semiconductor device structure comprising a plurality of metal oxid...

Method of manufacturing semiconductor device

Lead frame

Packaging device having plural microstructures disposed proximate t...

Semiconductor device structure comprising a plurality of metal oxid...

Pillar bumps and process for making same

Treating copper surfaces for packaging

Integrated circuit packaging system with surface treatment and meth...

Semiconductor device and production method therefor

Bonding method and bonding material using metal particle

Pillar bumps and process for making same

Semiconductor device and production method therefor

Patents Applicationslast 30 patents

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...

LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SINTERING BONDING METHOD FOR SEMICONDUCTOR DEVICE

Package Structure

METHOD OF MANUFACTURING BONDED BODY

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER

Package with UBM and Methods of Forming

Packaging Devices, Packaged Semiconductor Devices, and Packaging Me...

REACTIVE BONDING OF A FLIP CHIP PACKAGE

Treating Copper Surfaces for Packaging

Pillar Bumps and Process for Making Same

Treating Copper Surfaces for Packaging

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

REACTIVE BONDING OF A FLIP CHIP PACKAGE

Pillar Bumps and Process for Making Same

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE