13th Group

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CPC
H01L2924/0523

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/052313th Group

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20240395654
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS