13th Group

Industry

CPC
H01L2924/0483

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/048313th Group

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Vertically integrated wafers with thermal dissipation
- Patent number 9,812,428
- Issue date Nov 7, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,553,067
- Issue date Jan 24, 2017
- Toyota Jidosha Kabushiki Kaisha
- Takeshi Fukami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced contact resistance
- Patent number 8,390,131
- Issue date Mar 5, 2013
- International Rectifier Corporation
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SE...
- Publication number 20240055375
- Publication date Feb 15, 2024
- Fuji Electric Co., Ltd.
- Takashi TSUJI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180308812
- Publication date Oct 25, 2018
- Toyota Jidosha Kabushiki Kaisha
- Naoya TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180211930
- Publication date Jul 26, 2018
- Toyota Jidosha Kabushiki Kaisha
- Naoya TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION
- Publication number 20170040295
- Publication date Feb 9, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160284660
- Publication date Sep 29, 2016
- Toyota Jidosha Kabushiki Kaisha
- Takeshi FUKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Reduced Contact Resistance
- Publication number 20150001722
- Publication date Jan 1, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with Reduced Contact Resistance
- Publication number 20130175690
- Publication date Jul 11, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with reduced contact resistance
- Publication number 20080017987
- Publication date Jan 24, 2008
- International Rectifier Corporation
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vertically integrated wafers with thermal dissipation

Semiconductor device

Semiconductor device with reduced contact resistance

Patents Applicationslast 30 patents

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION

SEMICONDUCTOR DEVICE

Semiconductor Device with Reduced Contact Resistance

Power Semiconductor Device with Reduced Contact Resistance

Semiconductor device with reduced contact resistance