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CPC
H01L2924/0463
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/0463
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Patent Grant
Sintering materials and attachment methods using same
Patent number
11,389,865
Issue date
Jul 19, 2022
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Patents Applications
last 30 patents
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Patent Application
EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THER...
Publication number
20170158807
Publication date
Jun 8, 2017
DIC CORPORATION
Yasuyo YOSHIMOTO
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...