14th Group

Industry

CPC
H01L2924/0544

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/054414th Group

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,218,087
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,813
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous bonding layers for direct semiconductor bonding
- Patent number 12,205,921
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems and methods of manufacturing embedded cool...
- Patent number 12,191,233
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
- Patent number 12,183,659
- Issue date Dec 31, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,183,866
- Issue date Dec 31, 2024
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous bonding layers for direct semiconductor bonding
- Patent number 12,068,277
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film on surface between passivation...
- Patent number 12,057,416
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer and integrated circuit including redistributio...
- Patent number 12,021,046
- Issue date Jun 25, 2024
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display device
- Patent number 11,990,458
- Issue date May 21, 2024
- LG Display Co., Ltd.
- Jae Yong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 11,984,342
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage layers for wafer bonding
- Patent number 11,942,447
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- De-Yang Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure for wafer level bonding and bonded semicond...
- Patent number 11,929,335
- Issue date Mar 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical bonding method, package-type electronic component, and hyb...
- Patent number 11,916,038
- Issue date Feb 27, 2024
- Canon Anelva Corporation
- Takayuki Saitoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabricating semiconductor device with graphene layers
- Patent number 11,908,816
- Issue date Feb 20, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallization structure
- Patent number 11,876,041
- Issue date Jan 16, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,862,586
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mizuki Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 11,791,269
- Issue date Oct 17, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 11,776,923
- Issue date Oct 3, 2023
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for wavelength conversion using layers of different photo...
- Patent number 11,765,477
- Issue date Sep 19, 2023
- Sony Group Corporation
- Atsushi Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin bridge and multi-die ultrafine pitch patch architecture a...
- Patent number 11,756,889
- Issue date Sep 12, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
- Patent number 11,640,948
- Issue date May 2, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,640,954
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jeng-Nan Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250044510
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- G02 - OPTICS
Information Patent Application
BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
- Publication number 20250046744
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250046753
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20250038114
- Publication date Jan 30, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grain Structure Engineering for Metal Gapfill Materials
- Publication number 20250038137
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL
- Publication number 20250022829
- Publication date Jan 16, 2025
- AJINOMOTO CO., INC.
- Ichiro OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20250006674
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-...
- Publication number 20250006568
- Publication date Jan 2, 2025
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429222
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413037
- Publication date Dec 12, 2024
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240404909
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387422
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Cheng-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAP...
- Publication number 20240379738
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ISOLATION WITH CONFORMAL COATING
- Publication number 20240363465
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE
- Publication number 20240355696
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240355900
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Man-Nung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20240321820
- Publication date Sep 26, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Mark SCANNELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321851
- Publication date Sep 26, 2024
- SAMSUNG ELECTERONICS CO., LTD.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES
- Publication number 20240321855
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...
- Publication number 20240313025
- Publication date Sep 19, 2024
- Canon Kabushiki Kaisha
- RYO YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20240312820
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20240304593
- Publication date Sep 12, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with composite conductive features and method...

Semiconductor structure and manufacturing method thereof

Heterogenous bonding layers for direct semiconductor bonding

Embedded cooling systems and methods of manufacturing embedded cool...

Embedded cooling assemblies for advanced device packaging and metho...

Display device using micro LED, and manufacturing method therefor

Process flow for fabrication of cap metal over top metal with sinte...

Electrical interconnect bridge

Semiconductor device and method to minimize stress on stack via

Heterogenous bonding layers for direct semiconductor bonding

Integrated fan-out package structures with recesses in molding comp...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with metal film on surface between passivation...

Redistribution layer and integrated circuit including redistributio...

Semiconductor device with composite conductive features and method...

Light emitting diode display device

Info structure with copper pillar having reversed profile

Semiconductor device

Storage layers for wafer bonding

Semiconductor structure for wafer level bonding and bonded semicond...

Chemical bonding method, package-type electronic component, and hyb...

Method for fabricating semiconductor device with graphene layers

Semiconductor device having a metallization structure

Semiconductor device and method of manufacturing the same

Electrical interconnect bridge

Semiconductor device, manufacturing method, solid state image senso...

Apparatus for wavelength conversion using layers of different photo...

Ultrathin bridge and multi-die ultrafine pitch patch architecture a...

Microelectronic devices and apparatuses having a patterned surface...

Semiconductor package structure

Patents Applicationslast 30 patents

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE

ELECTRICAL INTERCONNECT BRIDGE

Grain Structure Engineering for Metal Gapfill Materials

UNDERFILL MATERIAL

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAP...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

DIE ISOLATION WITH CONFORMAL COATING

METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

BONDING METHOD

SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME

BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES

PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

DIRECT BONDING METHODS AND STRUCTURES