14th Group

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CPC
H01L2924/0544

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/054414th Group

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,362,314
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Debonding structures for wafer bonding
- Patent number 12,347,717
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 12,347,798
- Issue date Jul 1, 2025
- Sony Group Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure for wafer level bonding and bonded semicond...
- Patent number 12,334,462
- Issue date Jun 17, 2025
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode
- Patent number 12,334,481
- Issue date Jun 17, 2025
- PlayNitride Display Co., Ltd.
- Chi-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded inductor structures and methods of forming the same
- Patent number 12,334,430
- Issue date Jun 17, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Muhammed Shafi Kunnathodi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage layers for wafer bonding
- Patent number 12,315,837
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Yang Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,255,161
- Issue date Mar 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,218,087
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,813
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous bonding layers for direct semiconductor bonding
- Patent number 12,205,921
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems and methods of manufacturing embedded cool...
- Patent number 12,191,233
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
- Patent number 12,183,659
- Issue date Dec 31, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,183,866
- Issue date Dec 31, 2024
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous bonding layers for direct semiconductor bonding
- Patent number 12,068,277
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film on surface between passivation...
- Patent number 12,057,416
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer and integrated circuit including redistributio...
- Patent number 12,021,046
- Issue date Jun 25, 2024
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display device
- Patent number 11,990,458
- Issue date May 21, 2024
- LG Display Co., Ltd.
- Jae Yong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 11,984,342
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage layers for wafer bonding
- Patent number 11,942,447
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- De-Yang Chiou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20250239504
- Publication date Jul 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
- Publication number 20250239544
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
- Publication number 20250239546
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
- Publication number 20250239578
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tso-Jung Chang
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
- Publication number 20250239547
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20250226290
- Publication date Jul 10, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARCHITECTURES WITH HYBRID BONDING
- Publication number 20250220925
- Publication date Jul 3, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
- Publication number 20250219015
- Publication date Jul 3, 2025
- Canon Kabushiki Kaisha
- Nilabh K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING OF SEMICONDUCTOR ELEMENTS
- Publication number 20250210585
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
- Publication number 20250201668
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201747
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Shiun Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250183205
- Publication date Jun 5, 2025
- WIN SEMICONDUCTORS CORP.
- Shao-Yu TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...
- Publication number 20250157959
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Joon MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC ASSEMBLY FOR ENHANCED BONDING YIELD AND METHODS FOR FORMIN...
- Publication number 20250149477
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...
- Publication number 20250149524
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Sheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...
- Publication number 20250125309
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Hsiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118718
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250118612
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
- Publication number 20250112198
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyasha Mohapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250107106
- Publication date Mar 27, 2025
- Macronix International Co., Ltd.
- Jung-Chuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250087543
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE COMPOSITION, CURED PRODUCT FORMED FROM THE SAME AND USE OF...
- Publication number 20250084274
- Publication date Mar 13, 2025
- Daxin Materials Corp.
- Yun-Ching WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE STRUCTURES FOR EFFICIENT HEAT DISSIPATION
- Publication number 20250079258
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Woochan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
- Publication number 20250069918
- Publication date Feb 27, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...
- Publication number 20250070072
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250070078
- Publication date Feb 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE
- Publication number 20250062258
- Publication date Feb 20, 2025
- Avago Technologies International Sales Pte. Limited
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Debonding structures for wafer bonding

Semiconductor device, manufacturing method, solid state image senso...

Semiconductor structure for wafer level bonding and bonded semicond...

Micro light-emitting diode

Shielded inductor structures and methods of forming the same

Method of manufacturing die stack structure

Storage layers for wafer bonding

Capacitive coupling in a direct-bonded interface for microelectroni...

Info structure with copper pillar having reversed profile

Semiconductor device with composite conductive features and method...

Semiconductor device with composite conductive features and method...

Semiconductor structure and manufacturing method thereof

Heterogenous bonding layers for direct semiconductor bonding

Embedded cooling systems and methods of manufacturing embedded cool...

Embedded cooling assemblies for advanced device packaging and metho...

Display device using micro LED, and manufacturing method therefor

Process flow for fabrication of cap metal over top metal with sinte...

Electrical interconnect bridge

Semiconductor device and method to minimize stress on stack via

Heterogenous bonding layers for direct semiconductor bonding

Integrated fan-out package structures with recesses in molding comp...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with metal film on surface between passivation...

Redistribution layer and integrated circuit including redistributio...

Semiconductor device with composite conductive features and method...

Light emitting diode display device

Info structure with copper pillar having reversed profile

Semiconductor device

Storage layers for wafer bonding

Patents Applicationslast 30 patents

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...

SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...

OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...

SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

THREE-DIMENSIONAL MEMORY ARCHITECTURES WITH HYBRID BONDING

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

DIRECT BONDING OF SEMICONDUCTOR ELEMENTS

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...

PHOTONIC ASSEMBLY FOR ENHANCED BONDING YIELD AND METHODS FOR FORMIN...

PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY

MEMORY DEVICE

INTEGRATED CIRCUIT PACKAGES AND METHODS

CURABLE COMPOSITION, CURED PRODUCT FORMED FROM THE SAME AND USE OF...

PACKAGE STRUCTURES FOR EFFICIENT HEAT DISSIPATION

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE