1N purity grades

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H01L2924/01201

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/012011N purity grades

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Patents Grantslast 30 patents

Information Patent Grant
Cap layer for an aluminum copper bond pad
- Patent number 7,656,045
- Issue date Feb 2, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150054146
- Publication date Feb 26, 2015
- SUMITOMO BAKELITE CO., LTD.
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120292774
- Publication date Nov 22, 2012
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCT...
- Publication number 20090191088
- Publication date Jul 30, 2009
- Jun-Der LEE
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Cap layer for an aluminum copper bond pad
- Publication number 20070194460
- Publication date Aug 23, 2007
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS