TREA

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  • CPC
  • H01L2924/0531
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/05311st Group
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Reflow Process and Tool
    • Publication number 20150249062
    • Publication date Sep 3, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ai-Tee Ang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ETCHING OF UNDER BUMP METTALLIZATION LAYER AND RESULTING DEVICE
    • Publication number 20150221605
    • Publication date Aug 6, 2015
    • GLOBALFOUNDRIES INC.
    • Tanya Andreeva ATANASOVA
    • H01 - BASIC ELECTRIC ELEMENTS