2nd Group

Industry

CPC
H01L2924/0532

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/05322nd Group

Industries

Patents Grantslast 30 patents

Information Patent Grant
Laminate and electronic device
- Patent number 11,798,863
- Issue date Oct 24, 2023
- Sekisui Chemical Co., Ltd.
- Kouji Ashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for anisotropic conductive film, anisotropic conductive...
- Patent number 10,224,303
- Issue date Mar 5, 2019
- Samsung SDI Co., Ltd.
- Youn Jo Ko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,157,772
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,911,686
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with the integration of control circuit
- Patent number 9,887,183
- Issue date Feb 6, 2018
- Delta Electronics, Inc.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method for the same
- Patent number 9,773,720
- Issue date Sep 26, 2017
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method for manufacturing the same
- Patent number 9,728,484
- Issue date Aug 8, 2017
- Hyundai Mobis Co., Ltd.
- Jae Hyun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power electronic device packages and methods
- Patent number 9,601,327
- Issue date Mar 21, 2017
- The Board of Regents of the University of Oklahoma
- Patrick J. McCann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,368,436
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE AND ELECTRONIC DEVICE
- Publication number 20200388551
- Publication date Dec 10, 2020
- Sekisui Chemical Co., Ltd
- Kouji ASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Process
- Publication number 20170345708
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THER...
- Publication number 20170158807
- Publication date Jun 8, 2017
- DIC CORPORATION
- Yasuyo YOSHIMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...
- Publication number 20170162531
- Publication date Jun 8, 2017
- Samsung SDI Co., Ltd.
- Youn Jo KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170162468
- Publication date Jun 8, 2017
- HYUNDAI MOBIS Co., LTD.
- Jae Hyun KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT
- Publication number 20170012030
- Publication date Jan 12, 2017
- DELTA ELECTRONICS,INC.
- Tao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE
- Publication number 20160351432
- Publication date Dec 1, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD FOR THE SAME
- Publication number 20160218050
- Publication date Jul 28, 2016
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS
- Publication number 20160141275
- Publication date May 19, 2016
- LITTELFUSE, INC.
- Richard J. Bono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Power Electronic Device Packages and Methods
- Publication number 20160049351
- Publication date Feb 18, 2016
- BOARD OF REGENTS UNIVERSITY OF OKLAHOMA
- Patrick J. McCann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source Down Semiconductor Devices and Methods of Formation Thereof
- Publication number 20160035654
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laminate and electronic device

Semiconductor packaging structure and process

Composition for anisotropic conductive film, anisotropic conductive...

Semiconductor packaging structure and process

Source down semiconductor devices and methods of formation thereof

Power module with the integration of control circuit

Power module and fabrication method for the same

Power module package and method for manufacturing the same

High-power electronic device packages and methods

Source down semiconductor devices and methods of formation thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

LAMINATE AND ELECTRONIC DEVICE

Semiconductor Packaging Structure and Process

EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THER...

COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...

POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT

FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE

POWER MODULE AND FABRICATION METHOD FOR THE SAME

SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS

High-Power Electronic Device Packages and Methods

Source Down Semiconductor Devices and Methods of Formation Thereof