3N purity grades

Industry

CPC
H01L2924/01203

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/012033N purity grades

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,962,471
- Issue date Feb 24, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wire ball-bonded to electrode pad...
- Patent number 8,692,370
- Issue date Apr 8, 2014
- Semiconductor Components Industries, LLC
- Takashi Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,492,894
- Issue date Jul 23, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,395,261
- Issue date Mar 12, 2013
- Renesas Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 8,389,860
- Issue date Mar 5, 2013
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including coupling ball with layers of aluminu...
- Patent number 8,334,596
- Issue date Dec 18, 2012
- Renesas Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 8,299,356
- Issue date Oct 30, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device and method for producing the...
- Patent number 7,969,021
- Issue date Jun 28, 2011
- Nippon Steel Corporation
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,944,052
- Issue date May 17, 2011
- Renesas Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a stacked bump to reduce kirkendall voi...
- Patent number 7,847,398
- Issue date Dec 7, 2010
- Amkor Technology, Inc.
- Seok Ho Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 7,820,913
- Issue date Oct 26, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including a coupling region which includes lay...
- Patent number 7,791,198
- Issue date Sep 7, 2010
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor chip assembly with a precision-for...
- Patent number 7,232,706
- Issue date Jun 19, 2007
- Bridge Semiconductor Corporation
- Chia-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with bumped metal pillar
- Patent number 7,129,575
- Issue date Oct 31, 2006
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor chip assembly with a bumped metal...
- Patent number 7,112,521
- Issue date Sep 26, 2006
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with elongated wire ball bonded to chip...
- Patent number 6,653,170
- Issue date Nov 25, 2003
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold bumps bonding on connection pads and subsequent coining of the...
- Patent number 6,260,753
- Issue date Jul 17, 2001
- STMicroelectronics S.r.l.
- Loïc Renard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine wire made of a gold alloy, method for its production, and its use
- Patent number 6,242,106
- Issue date Jun 5, 2001
- W. C. Hereaeus GmbH & Co. KG
- Günter Herklotz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wedge bonding using a gold alloy wire
- Patent number 5,945,065
- Issue date Aug 31, 1999
- Tanaka Denshi Kogyo
- Teruo Kikuchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Lead frame surface finish enhancement
- Patent number 5,616,953
- Issue date Apr 1, 1997
- Micron Technology, Inc.
- Jerrold L. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor element
- Patent number 5,491,034
- Issue date Feb 13, 1996
- Nippon Steel Corporation
- Yasuhide Ohno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Fine copper wire for electronic instruments and method of manufactu...
- Patent number 4,986,856
- Issue date Jan 22, 1991
- The Furukawa Electric Co., Ltd.
- Toru Tanigawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
- Publication number 20230013769
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Ryo OISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD WITH THE...
- Publication number 20150014399
- Publication date Jan 15, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20140295619
- Publication date Oct 2, 2014
- Tanaka Kikinzoku Kogyo K.K.
- TOSHINORI OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120306077
- Publication date Dec 6, 2012
- RENESAS ELECTRONICS CORPORATION
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20110304046
- Publication date Dec 15, 2011
- ON SEMICONDUCTOR TRADING, LTD. a Bermuda limited company
- Takashi Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20110272802
- Publication date Nov 10, 2011
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20110241204
- Publication date Oct 6, 2011
- RENESAS ELECTRONICS CORPORATION
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110062585
- Publication date Mar 17, 2011
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20110011619
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AU ALLOY WIRE FOR BALL BONDING
- Publication number 20100314156
- Publication date Dec 16, 2010
- TANAKA DENSHI KOGYO K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20100294532
- Publication date Nov 25, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100200981
- Publication date Aug 12, 2010
- Advanced Semiconductor Engineering, Inc.
- Wen Pin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding wire for semiconductor device
- Publication number 20090188696
- Publication date Jul 30, 2009
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCT...
- Publication number 20090191088
- Publication date Jul 30, 2009
- Jun-Der LEE
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090039509
- Publication date Feb 12, 2009
- Matsushita Electric Industrial Co., Ltd.
- Manabu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20090032947
- Publication date Feb 5, 2009
- Seok Ho Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE
- Publication number 20090022621
- Publication date Jan 22, 2009
- W.C. Heraeus GmbH
- Albrecht Bischoff
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor device
- Publication number 20080203568
- Publication date Aug 28, 2008
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Au Alloy Bonding Wire
- Publication number 20080050267
- Publication date Feb 28, 2008
- Hiroshi Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper bonding wire for semiconductor packaging
- Publication number 20060186544
- Publication date Aug 24, 2006
- MK ELECTRON CO., LTD.
- Sung-Joon Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density integrated circuits and the method of packaging the same
- Publication number 20040124545
- Publication date Jul 1, 2004
- Daniel Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding wire for semiconductor and method of manufacturing the bond...
- Publication number 20040014266
- Publication date Jan 22, 2004
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method to produce the same
- Publication number 20020113322
- Publication date Aug 22, 2002
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density integrated circuits and the method of packaging the same
- Publication number 20020093088
- Publication date Jul 18, 2002
- Daniel Wang
- H01 - BASIC ELECTRIC ELEMENTS

3N purity grades

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bump, method for forming the bump, and method for mounting substrat...

Semiconductor device with copper wire ball-bonded to electrode pad...

Bump, method for forming the bump, and method for mounting substrat...

Semiconductor device

Bonding wire for semiconductor devices

Semiconductor device including coupling ball with layers of aluminu...

Bonding wire for semiconductor devices

Bonding wire for semiconductor device and method for producing the...

Semiconductor device

Semiconductor device having a stacked bump to reduce kirkendall voi...

Bonding wire for semiconductor device

Semiconductor device including a coupling region which includes lay...

Method of making a semiconductor chip assembly with a precision-for...

Semiconductor chip assembly with bumped metal pillar

Method of making a semiconductor chip assembly with a bumped metal...

Semiconductor chip assembly with elongated wire ball bonded to chip...

Gold bumps bonding on connection pads and subsequent coining of the...

Fine wire made of a gold alloy, method for its production, and its use

Method for wedge bonding using a gold alloy wire

Lead frame surface finish enhancement

Bonding wire for semiconductor element

Fine copper wire for electronic instruments and method of manufactu...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE

WIRE BONDING SYSTEMS AND RELATED METHODS

BONDING WIRE FOR SEMICONDUCTOR DEVICE

CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD WITH THE...

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

Semiconductor device

SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

AU ALLOY WIRE FOR BALL BONDING

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Bonding wire for semiconductor device

MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

BONDING WIRE

Semiconductor device

Au Alloy Bonding Wire

Copper bonding wire for semiconductor packaging

High density integrated circuits and the method of packaging the same

Bonding wire for semiconductor and method of manufacturing the bond...

Semiconductor device and method to produce the same

High density integrated circuits and the method of packaging the same