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H01L2924/0493

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/04933rd Group

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Patents Grantslast 30 patents

Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,611,372
- Issue date Apr 4, 2017
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming stacked metal contact in electrical communicatio...
- Patent number 9,331,033
- Issue date May 3, 2016
- Sunasic Technologies Inc.
- Chi-Chou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,269,596
- Issue date Feb 23, 2016
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED BIDIRECTIONAL FOUR QUADRANT SWITCHES WITH DRIVERS AND IN...
- Publication number 20240355717
- Publication date Oct 24, 2024
- Navitas Semiconductor Limited
- Alfred Hesener
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION
- Publication number 20150179478
- Publication date Jun 25, 2015
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS