3rd Group

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CPC
H01L2924/0533

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/05333rd Group

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chemical bonding method, package-type electronic component, and hyb...
- Patent number 11,916,038
- Issue date Feb 27, 2024
- Canon Anelva Corporation
- Takayuki Saitoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,163,774
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding interface layer
- Patent number 10,079,471
- Issue date Sep 18, 2018
- Hewlett Packard Enterprise Development LP
- Xue Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,611,372
- Issue date Apr 4, 2017
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,269,596
- Issue date Feb 23, 2016
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode for low-leakage devices
- Patent number 9,245,941
- Issue date Jan 26, 2016
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...
- Publication number 20230051810
- Publication date Feb 16, 2023
- Canon ANELVA Corporation
- Takayuki SAITOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Protrusion Bump Pads for Bond-on-Trace Processing
- Publication number 20190122976
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING INTERFACE LAYER
- Publication number 20180013260
- Publication date Jan 11, 2018
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Xue Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protrusion Bump Pads for Bond-on-Trace Processing
- Publication number 20160155697
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION
- Publication number 20150179478
- Publication date Jun 25, 2015
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode for Low-Leakage Devices
- Publication number 20140273427
- Publication date Sep 18, 2014
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition of Anisotropic Dielectric Layers Orientationally Matched...
- Publication number 20140264747
- Publication date Sep 18, 2014
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chemical bonding method, package-type electronic component, and hyb...

Protrusion bump pads for bond-on-trace processing

Bond materials with enhanced plasma resistant characteristics and a...

Protrusion bump pads for bond-on-trace processing

Bonding interface layer

Narrow-gap flip chip underfill composition

Narrow-gap flip chip underfill composition

Electrode for low-leakage devices

Patents Applicationslast 30 patents

CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...

Protrusion Bump Pads for Bond-on-Trace Processing

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

BONDING INTERFACE LAYER

Protrusion Bump Pads for Bond-on-Trace Processing

NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION

Electrode for Low-Leakage Devices

Deposition of Anisotropic Dielectric Layers Orientationally Matched...