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CPC
H01L2924/0554

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/05544th Group

Industries

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240234373
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240136327
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION
- Publication number 20240071968
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS