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5N purity grades

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  • CPC
  • H01L2924/01205
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/012055N purity grades
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRE BONDING SYSTEMS AND RELATED METHODS
    • Publication number 20190013290
    • Publication date Jan 10, 2019
    • Semiconductor Components Industries, LLC
    • Wentao QIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180005981
    • Publication date Jan 4, 2018
    • Rohm Co., Ltd.
    • Motoharu HAGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20140035115
    • Publication date Feb 6, 2014
    • SUMITOMO BAKELITE CO., LTD.
    • Shin-ichi Zenbutsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING STRUCTURE OF BONDING WIRE
    • Publication number 20110104510
    • Publication date May 5, 2011
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20110089549
    • Publication date Apr 21, 2011
    • SUMITOMO BAKELITE CO., LTD.
    • Shin-ichi Zenbutsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20110011618
    • Publication date Jan 20, 2011
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20100200981
    • Publication date Aug 12, 2010
    • Advanced Semiconductor Engineering, Inc.
    • Wen Pin HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, H...
    • Publication number 20090232695
    • Publication date Sep 17, 2009
    • Kazunari Maki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH BONDING RELIABILITY, H...
    • Publication number 20090120665
    • Publication date May 14, 2009
    • TANAKA DENSHI KOGYO K.K.
    • Kazunari Maki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    GOLD WIRE FOR SEMICONDUCTOR ELEMENT CONNECTION
    • Publication number 20090115059
    • Publication date May 7, 2009
    • Nippon Steel Materials Co., Ltd
    • Keiichi Kimura
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, H...
    • Publication number 20090101695
    • Publication date Apr 23, 2009
    • TANAKA DENSHI KOGYO K.K.
    • Kazunari Maki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire Bonds Having Pressure-Absorbing Balls
    • Publication number 20080251918
    • Publication date Oct 16, 2008
    • TEXAS INSTRUMENTS INCORPORATED
    • SOHICHI KADOGUCHI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Gold Wire for Connecting Semiconductor Chip
    • Publication number 20080105975
    • Publication date May 8, 2008
    • Keiichi Kimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire Bump Material
    • Publication number 20080075626
    • Publication date Mar 27, 2008
    • TANAKA DENSHI KOGYO K.K.
    • Michitaka Mikami
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20080061440
    • Publication date Mar 13, 2008
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Au Alloy Bonding Wire
    • Publication number 20080050267
    • Publication date Feb 28, 2008
    • Hiroshi Murai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Au Bonding Wire For Semiconductor Device
    • Publication number 20070298276
    • Publication date Dec 27, 2007
    • TANAKA DENSHI KOGYO K.K.
    • Satoshi Teshima
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Au alloy bonding wire
    • Publication number 20060251538
    • Publication date Nov 9, 2006
    • MK ELECTRON CO., LTD.
    • Gyung Sik Yun
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Copper bonding wire for semiconductor packaging
    • Publication number 20060186544
    • Publication date Aug 24, 2006
    • MK ELECTRON CO., LTD.
    • Sung-Joon Won
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonds having pressure-absorbing balls
    • Publication number 20060144907
    • Publication date Jul 6, 2006
    • Sohichi Kadoguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Gold-silver bonding wire for semiconductor device
    • Publication number 20030209810
    • Publication date Nov 13, 2003
    • MK ELECTON CO., LTD
    • Jeong-Tak Moon
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Gold wire for semiconductor element connection and semiconductor el...
    • Publication number 20020007957
    • Publication date Jan 24, 2002
    • Hiroshi Murai
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...