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H01L2924/0535
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/0535
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method to minimize stress on stack via
Patent number
12,080,600
Issue date
Sep 3, 2024
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layer metallic structure and method
Patent number
12,040,293
Issue date
Jul 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layer metallic structure and method
Patent number
11,502,050
Issue date
Nov 15, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
Patent number
11,195,725
Issue date
Dec 7, 2021
Texas Instruments Incorporated
Sebastian Meier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layer metallic structure and method
Patent number
10,916,517
Issue date
Feb 9, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method to minimize stress on stack via
Patent number
10,804,153
Issue date
Oct 13, 2020
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
10,804,237
Issue date
Oct 13, 2020
Denso Corporation
Kazuhiko Sugiura
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
Patent number
10,707,089
Issue date
Jul 7, 2020
Texas Instruments Incorporated
Sebastian Meier
G01 - MEASURING TESTING
Information
Patent Grant
Redistribution layer metallic structure and method
Patent number
10,658,315
Issue date
May 19, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing bonded body
Patent number
10,290,601
Issue date
May 14, 2019
Namics Corporation
Raymond Dietz
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Grant
Semiconductor devices and methods of manufacture thereof
Patent number
10,269,743
Issue date
Apr 23, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuei-Sung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer substrate with an embedded die
Patent number
9,711,459
Issue date
Jul 18, 2017
Qorvo US, Inc.
Bryan McChesney
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BONDING METHOD
Publication number
20240321820
Publication date
Sep 26, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Mark SCANNELL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Publication number
20240021548
Publication date
Jan 18, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Wei-Chun Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING JOINT PORTION BETWEEN CONDUCTIVE CON...
Publication number
20230260956
Publication date
Aug 17, 2023
SK HYNIX INC.
Mir IM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Layer Metallic Structure and Method
Publication number
20230072507
Publication date
Mar 9, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Shih Wei BIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD STRUCTURE, SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKA...
Publication number
20220084966
Publication date
Mar 17, 2022
CHANGXIN MEMORY TECHNOLOGIES, INC
PING-HENG WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Layer Metallic Structure and Method
Publication number
20210159196
Publication date
May 27, 2021
Taiwan Semiconductor Manufacturing Co., LTD
Shih Wei BIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method to Minimize Stress on Stack Via
Publication number
20200402855
Publication date
Dec 24, 2020
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
Publication number
20200303202
Publication date
Sep 24, 2020
TEXAS INSTRUMENTS INCORPORATED
Sebastian Meier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Layer Metallic Structure and Method
Publication number
20200144208
Publication date
May 7, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Shih Wei BIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
Publication number
20190304796
Publication date
Oct 3, 2019
TEXAS INSTRUMENTS INCORPORATED
Sebastian Meier
G01 - MEASURING TESTING
Information
Patent Application
Redistribution Layer Metallic Structure and Method
Publication number
20190304939
Publication date
Oct 3, 2019
Taiwan Semiconductor Manufacturing Co., LTD
Shih Wei BIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
Publication number
20190244919
Publication date
Aug 8, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuei-Sung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20190214360
Publication date
Jul 11, 2019
DENSO CORPORATION
Kazuhiko SUGIURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING BONDED BODY
Publication number
20180082972
Publication date
Mar 22, 2018
NAMICS CORPORATION
Raymond DIETZ
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
Publication number
20170221843
Publication date
Aug 3, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuei-Sung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER SUBSTRATE WITH AN EMBEDDED DIE
Publication number
20170025358
Publication date
Jan 26, 2017
RF Micro Devices, Inc.
Bryan McChesney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method to Minimize Stress on Stack Via
Publication number
20160276237
Publication date
Sep 22, 2016
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS