6N purity grades

Industry

CPC
H01L2924/01206

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/012066N purity grades

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,780,069
- Issue date Oct 3, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper alloy bonding wire for semiconductor device
- Patent number 8,610,291
- Issue date Dec 17, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper alloy bonding wire for semiconductor device
- Patent number 8,004,094
- Issue date Aug 23, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding lead with electrode of electronic device
- Patent number 5,316,204
- Issue date May 31, 1994
- Matsushita Electric Industrial Co., Ltd.
- Shinitsu Takehashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a bump electrode and manufacturing a resin-encaps...
- Patent number 5,299,729
- Issue date Apr 5, 1994
- Matsushita Electric Industrial Co., Ltd.
- Akira Matsushita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a bump electrode and manufacturing a resin-encaps...
- Patent number 5,172,851
- Issue date Dec 22, 1992
- Matsushita Electronics Corporation
- Akira Matsushita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine copper wire for electronic instruments and method of manufactu...
- Patent number 5,118,470
- Issue date Jun 2, 1992
- The Furukawa Electric Co., Ltd.
- Toru Tanigawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor integrated circuit device, method for producing or as...
- Patent number 5,031,821
- Issue date Jul 16, 1991
- Hitachi, Ltd.
- Tsuyoshi Kaneda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine copper wire for electronic instruments and method of manufactu...
- Patent number 4,986,856
- Issue date Jan 22, 1991
- The Furukawa Electric Co., Ltd.
- Toru Tanigawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Gold line for bonding semiconductor element
- Patent number 4,775,512
- Issue date Oct 4, 1988
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Yasuo Fukui
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE
- Publication number 20110104510
- Publication date May 5, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20110011618
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20080061440
- Publication date Mar 13, 2008
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Wire and Integrated Circuit Device Using the Same
- Publication number 20070235887
- Publication date Oct 11, 2007
- Shingo Kaimori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

6N purity grades

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Bonding structure of bonding wire

Copper alloy bonding wire for semiconductor device

Copper alloy bonding wire for semiconductor device

Method for bonding lead with electrode of electronic device

Method of forming a bump electrode and manufacturing a resin-encaps...

Method of forming a bump electrode and manufacturing a resin-encaps...

Fine copper wire for electronic instruments and method of manufactu...

Semiconductor integrated circuit device, method for producing or as...

Fine copper wire for electronic instruments and method of manufactu...

Gold line for bonding semiconductor element

Patents Applicationslast 30 patents

WIRE BONDING SYSTEMS AND RELATED METHODS

BONDING STRUCTURE OF BONDING WIRE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

Bonding Wire and Integrated Circuit Device Using the Same