TREA

6th Group

Follow

Industry

  • CPC
  • H01L2924/0536
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/05366th Group
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Chemical bonding method, package-type electronic component, and hyb...
    • Patent number 11,916,038
    • Issue date Feb 27, 2024
    • Canon Anelva Corporation
    • Takayuki Saitoh
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Semiconductor device
    • Patent number 10,804,237
    • Issue date Oct 13, 2020
    • Denso Corporation
    • Kazuhiko Sugiura
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Direct bonding method
    • Patent number 10,403,597
    • Issue date Sep 3, 2019
    • Commissariat a l'Energie Atomique et Aux Energies Alternatives
    • Paul Gondcharton
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents