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H01L2924/0537
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/0537
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device including bonding pads and method of manufactu...
Patent number
11,380,638
Issue date
Jul 5, 2022
Kioxia Corporation
Masayoshi Tagami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-to-wafer bonding structure
Patent number
9,941,243
Issue date
Apr 10, 2018
Samsung Electronics Co., Ltd.
Tae-yeong Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Facilitating chip dicing for metal-metal bonding and hybrid wafer b...
Patent number
9,059,333
Issue date
Jun 16, 2015
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING JOINT PORTION BETWEEN CONDUCTIVE CON...
Publication number
20230260956
Publication date
Aug 17, 2023
SK HYNIX INC.
Mir IM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN FILM TRANSISTOR AND METHOD FOR MAKING THE SAME
Publication number
20180158904
Publication date
Jun 7, 2018
TSINGHUA UNIVERSITY
YU-DAN ZHAO
C01 - INORGANIC CHEMISTRY
Information
Patent Application
THIN FILM TRANSISTOR AND METHOD FOR MAKING THE SAME
Publication number
20180158905
Publication date
Jun 7, 2018
TSINGHUA UNIVERSITY
YU-DAN ZHAO
C01 - INORGANIC CHEMISTRY
Information
Patent Application
WAFER-TO-WAFER BONDING STRUCTURE
Publication number
20170358553
Publication date
Dec 14, 2017
Samsung Electronics Co., Ltd.
TAE-YEONG KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FACILITATING CHIP DICING FOR METAL-METAL BONDING AND HYBRID WAFER B...
Publication number
20150155263
Publication date
Jun 4, 2015
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS