a passivation layer being used as a mask for patterning other parts

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H01L2224/11916

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11916a passivation layer being used as a mask for patterning other parts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Die with metal pillars
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- Issue date Nov 21, 2023
- STMicroelectronics (Tours) SAS
- Olivier Ory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 11,296,012
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor structure
- Patent number 10,872,870
- Issue date Dec 22, 2020
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
- Patent number 10,535,696
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 10,347,563
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor structure
- Patent number 10,325,872
- Issue date Jun 18, 2019
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 9,735,124
- Issue date Aug 15, 2017
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 9,698,079
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming stair-step structures
- Patent number 9,673,057
- Issue date Jun 6, 2017
- Lam Research Corporation
- In Deog Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 9,659,839
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
- Patent number 9,653,508
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, substrate processing apparatus, and st...
- Patent number 9,552,987
- Issue date Jan 24, 2017
- Tokyo Electron Limited
- Yuichiro Miyata
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 9,397,058
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivated copper chip pads
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- Issue date Jun 21, 2016
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bump pad structure having buffer pattern
- Patent number 9,368,465
- Issue date Jun 14, 2016
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
- Patent number 9,362,329
- Issue date Jun 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 8,963,326
- Issue date Feb 24, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240387430
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH METAL PILLARS
- Publication number 20240063162
- Publication date Feb 22, 2024
- STMicroelectronics (Tours) SAS
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20220230940
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH METAL PILLARS
- Publication number 20220068866
- Publication date Mar 3, 2022
- STMicroelectronics (Tours) SAS
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20190259723
- Publication date Aug 22, 2019
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20170309585
- Publication date Oct 26, 2017
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160190080
- Publication date Jun 30, 2016
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160133591
- Publication date May 12, 2016
- Amkor Technology, Inc.
- Sung Woong Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING BUMP PAD STRUCTURE HAVING BUFFER PATTERN
- Publication number 20150235974
- Publication date Aug 20, 2015
- Samsung Electronics Co., Ltd.
- Soo-Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Including Glue Layer and Non-Low-K Dielectric Layer i...
- Publication number 20150228690
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR
- Publication number 20150162305
- Publication date Jun 11, 2015
- Semiconductor Components Industries, LLC
- Richard D. Moyers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20150091165
- Publication date Apr 2, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivated Copper Chip Pads
- Publication number 20140295661
- Publication date Oct 2, 2014
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivated Copper Chip Pads
- Publication number 20130224946
- Publication date Aug 29, 2013
- INFINEON TECHNOLOGIES AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20130140691
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structures in BSI Image Sensor Chips
- Publication number 20130032916
- Publication date Feb 7, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivated Copper Chip Pads
- Publication number 20090200675
- Publication date Aug 13, 2009
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS

a passivation layer being used as a mask for patterning other parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die with metal pillars

Barrier structures between external electrical connectors

Fabrication method of semiconductor structure

Pad structure exposed in an opening through multiple dielectric lay...

Barrier structures between external electrical connectors

Fabrication method of semiconductor structure

Semiconductor structure and method of fabricating the same

Barrier structures between external electrical connectors

Method for forming stair-step structures

Barrier structures between external electrical connectors

Pad structure exposed in an opening through multiple dielectric lay...

Substrate processing method, substrate processing apparatus, and st...

Semiconductor device and method of forming patterned repassivation...

Passivated copper chip pads

Method of forming bump pad structure having buffer pattern

Pad structure exposed in an opening through multiple dielectric lay...

Semiconductor device and method of forming patterned repassivation...

Patents Applicationslast 30 patents

METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME

DIE WITH METAL PILLARS

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

Harvested Reconstitution Bumping

Barrier Structures Between External Electrical Connectors

DIE WITH METAL PILLARS

FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE

FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING BUMP PAD STRUCTURE HAVING BUFFER PATTERN

Pad Structure Including Glue Layer and Non-Low-K Dielectric Layer i...

METHOD OF FORMING A SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR

Semiconductor Device and Method of Forming Patterned Repassivation...

Passivated Copper Chip Pads

Passivated Copper Chip Pads

Semiconductor Device and Method of Forming Patterned Repassivation...

Pad Structures in BSI Image Sensor Chips

Passivated Copper Chip Pads