a passivation layer being used as a mask for patterning the bonding area

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03916a passivation layer being used as a mask for patterning the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
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- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 11,817,361
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
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Through silicon via design for stacking integrated circuits
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- Issue date Jul 18, 2023
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- Kong-Beng Thei
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Information Patent Grant
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- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias with metal caps for underlying conductive lines
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- Taiwan Semiconductor Manufacturing Company, Ltd
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via design for stacking integrated circuits
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- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor structure
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- Issue date Dec 22, 2020
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- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
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- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
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- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via design for stacking integrated circuits
- Patent number 10,629,592
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 10,388,620
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 10,325,869
- Issue date Jun 18, 2019
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor structure
- Patent number 10,325,872
- Issue date Jun 18, 2019
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including conductive pillars
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- Issue date Apr 30, 2019
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- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a contact
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- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive materials on semiconductor devices, a...
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- Issue date Sep 19, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
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- Issue date Aug 15, 2017
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date May 3, 2016
- Sunasic Technologies Inc.
- Chi-Chou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etchant and method for manufacturing semiconductor device using same
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- Issue date Dec 2, 2014
- Mitsubishi Gas Chemical Company, Inc.
- Akira Hosomi
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Information Patent Grant
Semiconductor devices including protected barrier layers
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- Issue date Oct 22, 2013
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bump structure and method for forming the same
- Patent number 8,274,150
- Issue date Sep 25, 2012
- ChipMOS Technologies Inc.
- Cheng Tang Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- Publication date Mar 14, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
- Publication number 20230378106
- Publication date Nov 23, 2023
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Structure with Planar Top Surfaces
- Publication number 20230360992
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
- Publication number 20220302108
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Structure with Planar Top Surfaces
- Publication number 20220262698
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20220059478
- Publication date Feb 24, 2022
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
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THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
- Publication number 20210343707
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
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- Samsung Electronics Co., Ltd.
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
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- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Structure and Method of Forming Same
- Publication number 20210118833
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200312800
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
- Publication number 20200243516
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
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THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
- Publication number 20200035672
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- Taiwan Semiconductor Manufacturing Co., LTD
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
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- Taiwan Semiconductor Manufacturing Co., LTD
- Kong-Beng Thei
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Information Patent Application
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- Taiwan Semiconductor Manufacturing Company, Ltd.
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- Ju-il Choi
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Method of Forming a Contact
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- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS
- Publication number 20170358547
- Publication date Dec 14, 2017
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- H01 - BASIC ELECTRIC ELEMENTS
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FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
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- INFINEON TECHNOLOGIES AG
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Semiconductor Devices Including Protected Barrier Layers
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Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick A...
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- Akira Hosomi
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SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION
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Information Patent Application
CHIP BUMP STRUCTURE AND METHOD FOR FORMING THE SAME
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Information Patent Application
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- Kabushiki Kaisha Toshiba
- Masaharu Seto
- H01 - BASIC ELECTRIC ELEMENTS

a passivation layer being used as a mask for patterning the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Patterned and planarized under-bump metallization

Connector structure and method of forming same

Passivation structure with planar top surfaces

Semiconductor devices, semiconductor packages, and methods of manuf...

Through silicon via design for stacking integrated circuits

Method for fabricating semiconductor device

Through silicon via design for stacking integrated circuits

Vias with metal caps for underlying conductive lines

Warpage-compensated bonded structure including a support chip and a...

Through silicon via design for stacking integrated circuits

Semiconductor devices, semiconductor packages, and methods of manuf...

Through silicon via design for stacking integrated circuits

Fabrication method of semiconductor structure

Semiconductor structure and manufacturing method thereof

Connector structure and method of forming same

Semiconductor devices and semiconductor devices including a redistr...

Through silicon via design for stacking integrated circuits

Connector structure and method of forming same

Semiconductor devices, semiconductor packages, and methods of manuf...

Fabrication method of semiconductor structure

Semiconductor devices including conductive pillars

Method of forming a contact

Methods of forming conductive materials on semiconductor devices, a...

Semiconductor structure and method of fabricating the same

Method for forming stacked metal contact in electrical communicatio...

Etchant and method for manufacturing semiconductor device using same

Semiconductor devices including protected barrier layers

Chip bump structure and method for forming the same

Patents Applicationslast 30 patents

SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...

PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION

Passivation Structure with Planar Top Surfaces

THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS

Passivation Structure with Planar Top Surfaces

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Connector Structure and Method of Forming Same

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS

THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS

THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS

Connector Structure and Method of Forming Same

SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...

FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...

Method of Forming a Contact

SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS

FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE

Semiconductor Device with Metal Structure Electrically Connected to...

Semiconductor Devices Including Protected Barrier Layers

Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick A...

ETCHANT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME

SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION

CHIP BUMP STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...