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H01L2924/065

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/065ABS

Industries

Patents Grantslast 30 patents

Information Patent Grant
Temporary bonding scheme
- Patent number 11,328,972
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary bonding scheme
- Patent number 10,170,387
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 10,056,308
- Issue date Aug 21, 2018
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 9,607,914
- Issue date Mar 28, 2017
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Temporary bonding scheme
- Patent number 9,202,799
- Issue date Dec 1, 2015
- Taiwan Semiconductor Manufactruing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
- Publication number 20250201668
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20210358884
- Publication date Nov 18, 2021
- DAICEL CORPORATION
- Naoko TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Bonding Scheme
- Publication number 20190139850
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20170170085
- Publication date Jun 15, 2017
- Intel Corporation
- Paul J. Gwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20160268178
- Publication date Sep 15, 2016
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Temporary Bonding Scheme
- Publication number 20150155260
- Publication date Jun 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS