Active alignment, i.e. by apparatus steering

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H01L2224/83121

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83121Active alignment, i.e. by apparatus steering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Applying stress compensation for aligning a companion chip with a h...
- Patent number 12,111,497
- Issue date Oct 8, 2024
- Ciena Corporation
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,901,342
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress compensating pick-up tool
- Patent number 11,846,806
- Issue date Dec 19, 2023
- Ciena Corporation
- Raphael Beaupré-Laflamme
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
- Patent number 11,667,817
- Issue date Jun 6, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takashi Tatsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 11,450,639
- Issue date Sep 20, 2022
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,222,874
- Issue date Jan 11, 2022
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus incorporating variable force distribution
- Patent number 11,121,113
- Issue date Sep 14, 2021
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 11,088,268
- Issue date Aug 10, 2021
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 11,004,808
- Issue date May 11, 2021
- Cree, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,910,335
- Issue date Feb 2, 2021
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable interposer to interposer connection
- Patent number 10,804,117
- Issue date Oct 13, 2020
- Intel Corporation
- Digvijay Ashokkumar Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,622,325
- Issue date Apr 14, 2020
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with enhanced thermal dissipation
- Patent number 10,461,021
- Issue date Oct 29, 2019
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 10,427,932
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 10,374,072
- Issue date Aug 6, 2019
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 10,242,970
- Issue date Mar 26, 2019
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slotted configuration for optimized placement of micro-components u...
- Patent number 10,175,448
- Issue date Jan 8, 2019
- Cisco Technology, Inc.
- Mary Nadeau
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,170,440
- Issue date Jan 1, 2019
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20240186298
- Publication date Jun 6, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Compensating Pick-up Tool
- Publication number 20230314712
- Publication date Oct 5, 2023
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230223376
- Publication date Jul 13, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20230137299
- Publication date May 4, 2023
- Showa Denko Materials Co., Ltd.
- Takashi TATSUZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20230017939
- Publication date Jan 19, 2023
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20220130807
- Publication date Apr 28, 2022
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Compensating Pick-up Tool
- Publication number 20220075117
- Publication date Mar 10, 2022
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20220005719
- Publication date Jan 6, 2022
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20210343862
- Publication date Nov 4, 2021
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE WITH DIFFERENT TYPES OF SEMICONDUCTOR DIES ATTACHED TO A FL...
- Publication number 20210233877
- Publication date Jul 29, 2021
- Cree, Inc.
- Xikun ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20210151405
- Publication date May 20, 2021
- Epistar Corporation
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE
- Publication number 20210125957
- Publication date Apr 29, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20200227371
- Publication date Jul 16, 2020
- Epistar Corporation
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20200006540
- Publication date Jan 2, 2020
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD TO ENABLE INTERPOSER TO INTERPOSER CONNECTION
- Publication number 20190304809
- Publication date Oct 3, 2019
- Intel Corporation
- Digvijay Ashokkumar Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20190241771
- Publication date Aug 8, 2019
- Hitachi Chemical Company, Ltd.
- Takashi TATSUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20190189597
- Publication date Jun 20, 2019
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20190109111
- Publication date Apr 11, 2019
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20170309733
- Publication date Oct 26, 2017
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOUNTING APPARATUS AND METHOD OF CORRECTING OFFSET AMOUNT OF THE SAME
- Publication number 20160351528
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- MAKOTO TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING
- Publication number 20160190028
- Publication date Jun 30, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- LEI SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS AND CHIP BONDING METHOD
- Publication number 20160155719
- Publication date Jun 2, 2016
- SAMSUNG DISPLAY CO., LTD.
- Seong Beom JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICOND...
- Publication number 20150024551
- Publication date Jan 22, 2015
- Samsung Electronics Co., Ltd.
- Yoshiaki YUKIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS U...
- Publication number 20140362457
- Publication date Dec 11, 2014
- Mary NADEAU
- G02 - OPTICS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20140295594
- Publication date Oct 2, 2014
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140242734
- Publication date Aug 28, 2014
- RENESAS ELECTRONICS CORPORATION
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...
- Publication number 20140239502
- Publication date Aug 28, 2014
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS

Active alignment, i.e. by apparatus steering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing thereof

Applying stress compensation for aligning a companion chip with a h...

Package with different types of semiconductor dies attached to a fl...

Methods and devices for fabricating and assembling printable semico...

Selective transfer of micro devices

Discontinuous patterned bonds for semiconductor devices and associa...

Stress compensating pick-up tool

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Electroconductive film, roll, connected structure, and process for...

Selective micro device transfer to receiver substrate

Semiconductor device and a method of manufacturing thereof

Discontinuous patterned bonds for semiconductor devices and associa...

Bonding apparatus incorporating variable force distribution

Methods and devices for fabricating and assembling printable semico...

Package with different types of semiconductor dies attached to a fl...

Semiconductor device and a method of manufacturing thereof

Method to enable interposer to interposer connection

Semiconductor device and a method of manufacturing thereof

Electronic assembly with enhanced thermal dissipation

Hermetically sealed MEMS device and its fabrication

Methods and devices for fabricating and assembling printable semico...

Discontinuous patterned bonds for semiconductor devices and associa...

Laser assisted transfer welding process

Slotted configuration for optimized placement of micro-components u...

Semiconductor device and a method of manufacturing thereof

Method for simultaneously bonding multiple chips of different heigh...

Patents Applicationslast 30 patents

SELECTIVE TRANSFER OF MICRO DEVICES

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

Stress Compensating Pick-up Tool

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

Stress Compensating Pick-up Tool

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

PACKAGE WITH DIFFERENT TYPES OF SEMICONDUCTOR DIES ATTACHED TO A FL...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

METHOD FOR FABRICATING AN ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

METHOD TO ENABLE INTERPOSER TO INTERPOSER CONNECTION

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

MOUNTING APPARATUS AND METHOD OF CORRECTING OFFSET AMOUNT OF THE SAME

METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING

CHIP BONDING APPARATUS AND CHIP BONDING METHOD

SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICOND...

SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS U...

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

LEADFRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...