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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 11,183,482
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus incorporating variable force distribution
- Patent number 11,121,113
- Issue date Sep 14, 2021
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,957,812
- Issue date Mar 23, 2021
- LG Display Co., Ltd.
- ChungHwan An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and placing a semiconductor device on a sub...
- Patent number 10,910,342
- Issue date Feb 2, 2021
- Imec VZW
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 10,784,129
- Issue date Sep 22, 2020
- FUJI CORPORATION
- Kohei Sugihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch bonding apparatus and bonding method
- Patent number 10,763,235
- Issue date Sep 1, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Xiaoyu Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,510,923
- Issue date Dec 17, 2019
- LG Display Co., Ltd.
- ChungHwan An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 10,490,525
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device with three machine bases and transfer method thereof
- Patent number 10,269,596
- Issue date Apr 23, 2019
- BOE Technology Group Co., Ltd.
- Xiaolong He
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer and opposing...
- Patent number 8,994,184
- Issue date Mar 31, 2015
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming interposer and opposing...
- Patent number 8,466,544
- Issue date Jun 18, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240379617
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20230119548
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE
- Publication number 20220375895
- Publication date Nov 24, 2022
- Japan Display Inc.
- Keisuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20220077108
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20210082870
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH BONDING APPARATUS AND BONDING METHOD
- Publication number 20190385972
- Publication date Dec 19, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Xiaoyu JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20190348392
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Transferring and Placing a Semiconductor Device on a Sub...
- Publication number 20180166416
- Publication date Jun 14, 2018
- IMEC vzw
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20180114709
- Publication date Apr 26, 2018
- FUJI MACHINE MFG. CO., LTD.
- Kohei SUGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...
- Publication number 20180114772
- Publication date Apr 26, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer and Opposing...
- Publication number 20130241080
- Publication date Sep 19, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer and Opposing...
- Publication number 20120217645
- Publication date Aug 30, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Active alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Shift control method in manufacture of semiconductor device

High speed handling of ultra-small chips by selective laser bonding...

Shift control method in manufacture of semiconductor device

Bonding apparatus incorporating variable force distribution

Display device and method of manufacturing the same

Method for transferring and placing a semiconductor device on a sub...

Mounting device and mounting method

Batch bonding apparatus and bonding method

Display device and method of manufacturing the same

High speed handling of ultra-small chips by selective laser bonding...

Transfer device with three machine bases and transfer method thereof

Method for simultaneously bonding multiple chips of different heigh...

Semiconductor device and method of forming interposer and opposing...

Semiconductor device and method of forming interposer and opposing...

Patents Applicationslast 30 patents

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

BATCH BONDING APPARATUS AND BONDING METHOD

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

Method for Transferring and Placing a Semiconductor Device on a Sub...

MOUNTING DEVICE AND MOUNTING METHOD

METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...

Semiconductor Device and Method of Forming Interposer and Opposing...

Semiconductor Device and Method of Forming Interposer and Opposing...