Adaptable interconnections

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CPC
H01L23/5382

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5382Adaptable interconnections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Composite component and method for manufacturing the same
- Patent number 12,002,760
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sharing package pins in a multi-chip module (MCM)
- Patent number 11,886,370
- Issue date Jan 30, 2024
- Advanced Micro Devices, Inc.
- Yulei Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System-on-wafer structure and fabrication method
- Patent number 11,876,071
- Issue date Jan 16, 2024
- ZHEJIANG LAB
- Weihao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for configuring multiple input-output channels
- Patent number 11,488,643
- Issue date Nov 1, 2022
- Micron Technology, Inc.
- Dean E. Walker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips
- Patent number 11,394,386
- Issue date Jul 19, 2022
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 11,282,791
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolating electric paths in semiconductor device packages
- Patent number 11,270,931
- Issue date Mar 8, 2022
- RAMBUS INC.
- Adrian E. Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded die last chip combination
- Patent number 11,211,332
- Issue date Dec 28, 2021
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage power module
- Patent number 11,206,740
- Issue date Dec 21, 2021
- Cree Fayetteville, Inc.
- Zachary Cole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage power module
- Patent number 11,172,584
- Issue date Nov 9, 2021
- Cree Fayetteville, Inc.
- Zachary Cole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable substrate and systems
- Patent number 11,171,126
- Issue date Nov 9, 2021
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,101,189
- Issue date Aug 24, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming Yen Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Logic drive based on multichip package comprising standard commodit...
- Patent number 10,985,154
- Issue date Apr 20, 2021
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit package and method
- Patent number 10,937,736
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips
- Patent number 10,886,924
- Issue date Jan 5, 2021
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redundancy scheme for multi-chip stacked devices
- Patent number 10,825,772
- Issue date Nov 3, 2020
- Steven P. Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module (MCM) with chip-to-chip connection redundancy and...
- Patent number 10,748,852
- Issue date Aug 18, 2020
- Marvell International Ltd.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage power module
- Patent number 10,750,627
- Issue date Aug 18, 2020
- Cree Fayetteville, Inc.
- Zachary Cole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,689,248
- Issue date Jun 23, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming Yen Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Modular interconnection repair of multi-die package
- Patent number 10,665,548
- Issue date May 26, 2020
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips
- Patent number 10,623,000
- Issue date Apr 14, 2020
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Molded die last chip combination
- Patent number 10,593,628
- Issue date Mar 17, 2020
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with programmable signal routing
- Patent number 10,586,764
- Issue date Mar 10, 2020
- Intel Corporation
- Russell S. Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically-connected packageless fuse device
- Patent number 10,446,488
- Issue date Oct 15, 2019
- Manufacturing Networks Incorporated (MNI)
- Faraj Sherrima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High voltage power module
- Patent number 10,448,524
- Issue date Oct 15, 2019
- Cree, Inc.
- Zachary Cole
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Cross-connected multi-chip modules coupled by silicon bent-bridge i...
- Patent number 10,431,545
- Issue date Oct 1, 2019
- Intel IP Corporation
- Georg Seidemann
- G11 - INFORMATION STORAGE
Information Patent Grant
Three dimensional integrated circuit having redundant through silic...
- Patent number 10,403,555
- Issue date Sep 3, 2019
- Industry-Academic Cooperation Foundation, Yonsei University
- Sungho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,388,582
- Issue date Aug 20, 2019
- Amkor Technology, Inc.
- Young Rae Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Circuit layout of printed circuit board
- Publication number 20240349421
- Publication date Oct 17, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- CHIA-LUNG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD
- Publication number 20240213169
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND MICRO-ASSEMBLY STRATEGIES AND DEVICES
- Publication number 20240213238
- Publication date Jun 27, 2024
- X Display Company Technology Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHARING PACKAGE PINS IN A MULTI-CHIP MODULE (MCM)
- Publication number 20240126712
- Publication date Apr 18, 2024
- ADVANCED MICRO DEVICES, INC.
- YULEI SHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME AND E...
- Publication number 20240079279
- Publication date Mar 7, 2024
- Hitachi Energy Switzerland AG
- Slavo KICIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CAVITY-EMBEDDED CUBES AND LOGI...
- Publication number 20240063068
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTIVITY LAYER IN 3D DEVICES
- Publication number 20240047364
- Publication date Feb 8, 2024
- Xilinx, Inc.
- Zachary BLAIR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SHARING PACKAGE PINS IN A MULTI-CHIP MODULE (MCM)
- Publication number 20230367730
- Publication date Nov 16, 2023
- ADVANCED MICRO DEVICES, INC.
- YULEI SHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR USING AN INTE...
- Publication number 20230282588
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE INCLUDING SWAPPABLE PHY CIRCUITRY AND SEMICONDU...
- Publication number 20230230923
- Publication date Jul 20, 2023
- Intel Corporation
- Gerald Pasdast
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING SUBSTRATE
- Publication number 20230187361
- Publication date Jun 15, 2023
- Industrial Technology Research Institute
- Tsung-Yi HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE WITH ACTIVE INTERPOSER
- Publication number 20230100032
- Publication date Mar 30, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONFIGURING MULTIPLE INPUT-OUTPUT CHANNELS
- Publication number 20230033822
- Publication date Feb 2, 2023
- Micron Technology, Inc.
- Dean E. Walker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
A METHOD OF CONNECTING CIRCUIT ELEMENTS
- Publication number 20230026967
- Publication date Jan 26, 2023
- Ken WILLIAMSON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROGRAMMABLE ROUTING BRIDGE
- Publication number 20220337248
- Publication date Oct 20, 2022
- Intel Corporation
- J-Wing Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS
- Publication number 20220321128
- Publication date Oct 6, 2022
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATING ELECTRIC PATHS IN SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20220262718
- Publication date Aug 18, 2022
- Rambus Inc.
- Adrian E. Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20220208680
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONFIGURING MULTIPLE INPUT-OUTPUT CHANNELS
- Publication number 20220068324
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- Dean E. Walker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPOSITE COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220020692
- Publication date Jan 20, 2022
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS
- Publication number 20210075423
- Publication date Mar 11, 2021
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON MULTICHIP PACKAGE COMPRISING STANDARD COMMODIT...
- Publication number 20210005592
- Publication date Jan 7, 2021
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20200411439
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Integrated Circuit Package and Method
- Publication number 20200395302
- Publication date Dec 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE POWER MODULE
- Publication number 20200359511
- Publication date Nov 12, 2020
- Cree Fayetteville, Inc.
- Zachary Cole
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUNDANCY SCHEME FOR MULTI-CHIP STACKED DEVICES
- Publication number 20200303311
- Publication date Sep 24, 2020
- Xilinx, Inc.
- Steven P. YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200283288
- Publication date Sep 10, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming Yen LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS
- Publication number 20200228120
- Publication date Jul 16, 2020
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MOLDED DIE LAST CHIP COMBINATION
- Publication number 20200168549
- Publication date May 28, 2020
- ADVANCED MICRO DEVICES, INC.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS

Adaptable interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Composite component and method for manufacturing the same

Sharing package pins in a multi-chip module (MCM)

System-on-wafer structure and fabrication method

Method for configuring multiple input-output channels

Multi-die package with bridge layer

Logic drive using standard commodity programmable logic IC chips

Semiconductor device having a heat dissipation structure connected...

Isolating electric paths in semiconductor device packages

Molded die last chip combination

High voltage power module

High voltage power module

Configurable substrate and systems

Semiconductor device package and method of manufacturing the same

Logic drive based on multichip package comprising standard commodit...

Hybrid integrated circuit package and method

Logic drive using standard commodity programmable logic IC chips

Redundancy scheme for multi-chip stacked devices

Multi-chip module (MCM) with chip-to-chip connection redundancy and...

High voltage power module

Semiconductor device package and method of manufacturing the same

Modular interconnection repair of multi-die package

Methods for making multi-die package with bridge layer

Logic drive using standard commodity programmable logic IC chips

Molded die last chip combination

Semiconductor package with programmable signal routing

Vertically-connected packageless fuse device

High voltage power module

Cross-connected multi-chip modules coupled by silicon bent-bridge i...

Three dimensional integrated circuit having redundant through silic...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

Circuit layout of printed circuit board

LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD

COMPOUND MICRO-ASSEMBLY STRATEGIES AND DEVICES

SHARING PACKAGE PINS IN A MULTI-CHIP MODULE (MCM)

POWER SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME AND E...

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CAVITY-EMBEDDED CUBES AND LOGI...

CONNECTIVITY LAYER IN 3D DEVICES

SHARING PACKAGE PINS IN A MULTI-CHIP MODULE (MCM)

SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR USING AN INTE...

MICROELECTRONIC DIE INCLUDING SWAPPABLE PHY CIRCUITRY AND SEMICONDU...

ELECTRONIC DEVICE HAVING SUBSTRATE

BONDED STRUCTURE WITH ACTIVE INTERPOSER

METHOD FOR CONFIGURING MULTIPLE INPUT-OUTPUT CHANNELS

A METHOD OF CONNECTING CIRCUIT ELEMENTS

PROGRAMMABLE ROUTING BRIDGE

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS

ISOLATING ELECTRIC PATHS IN SEMICONDUCTOR DEVICE PACKAGES

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

METHOD FOR CONFIGURING MULTIPLE INPUT-OUTPUT CHANNELS

COMPOSITE COMPONENT AND METHOD FOR MANUFACTURING THE SAME

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS

LOGIC DRIVE BASED ON MULTICHIP PACKAGE COMPRISING STANDARD COMMODIT...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Hybrid Integrated Circuit Package and Method

HIGH VOLTAGE POWER MODULE

REDUNDANCY SCHEME FOR MULTI-CHIP STACKED DEVICES

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Methods for Making Multi-Die Package With Bridge Layer

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS

MOLDED DIE LAST CHIP COMBINATION