Adaptations for fluid transport

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CPC
H05K1/0272

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0272Adaptations for fluid transport

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods of 3D-printing a circuit board on a heat sink a...
- Patent number 12,156,344
- Issue date Nov 26, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Localized immersion cooling enclosure with thermal efficiency features
- Patent number 12,156,372
- Issue date Nov 26, 2024
- Cisco Technology, Inc.
- M. Baris Dogruoz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package assembly
- Patent number 12,150,243
- Issue date Nov 19, 2024
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB heat dissipation assembly and server having same
- Patent number 12,133,367
- Issue date Oct 29, 2024
- BITMAIN TECHNOLOGIES INC.
- Xuesong Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inhaler component
- Patent number 12,089,640
- Issue date Sep 17, 2024
- NICOVENTURES TRADING LIMITED
- Helmut Buchberger
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Device for conducting biological amplification reactions
- Patent number 12,083,522
- Issue date Sep 10, 2024
- TERRABIO SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA
- Henryk Waldemar Roguszczak
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Printed circuit board and fabricating method thereof, and displayin...
- Patent number 12,082,337
- Issue date Sep 3, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Jiaxiang Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,075,558
- Issue date Aug 27, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhaozheng Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of constructing a circuitry assembly for heat dispersal usin...
- Patent number 12,068,223
- Issue date Aug 20, 2024
- Elta Systems Ltd.
- Michael Kedem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible and modular top and bottom side processor unit module cooling
- Patent number 12,055,986
- Issue date Aug 6, 2024
- Intel Corporation
- Andres Ramirez Macias
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation features of autonomous vehicle sensor
- Patent number 12,041,714
- Issue date Jul 16, 2024
- GM CRUISE HOLDINGS LLC
- Srinivasa Rao Damaraju
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cold plate with embedded power device, driver circuit, and microcon...
- Patent number 12,035,510
- Issue date Jul 9, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Circuit board
- Patent number 11,997,785
- Issue date May 28, 2024
- Unimicron Technology Corp.
- Chun-Lin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods providing high-density memory arrangements with...
- Patent number 11,997,792
- Issue date May 28, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus with airflow chamber
- Patent number 11,991,820
- Issue date May 21, 2024
- Comcast Cable Communications, LLC
- Osman Cueto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with heat dissipation structure and method for manufa...
- Patent number 11,979,977
- Issue date May 7, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structural lead frame
- Patent number 11,923,151
- Issue date Mar 5, 2024
- KEMET Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device assemblies having embedded PCBS and enhanced cooling a...
- Patent number 11,910,521
- Issue date Feb 20, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with connected component carrier and fluid coolin...
- Patent number 11,889,622
- Issue date Jan 30, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conducting track fuse
- Patent number 11,869,738
- Issue date Jan 9, 2024
- Tridonic GmbH & Co KG
- Claus Hechenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assemblies and methods of fabricating the same
- Patent number 11,856,689
- Issue date Dec 26, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded cooling systems utilizing heat pipes
- Patent number 11,849,539
- Issue date Dec 19, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Air-pocket prevention PCB, air-pocket prevention PCB module, electr...
- Patent number 11,825,599
- Issue date Nov 21, 2023
- SOLUM CO., LTD.
- Jun Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding method of a flat heat pipe into PCB for active device coo...
- Patent number 11,812,550
- Issue date Nov 7, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal insulation and temperature control of components
- Patent number 11,785,705
- Issue date Oct 10, 2023
- Xerox Corporation
- Yunda Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Systems including a vapor chamber as the heat spreading substrate o...
- Patent number 11,776,875
- Issue date Oct 3, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having a cooling area above and below a semiconductor...
- Patent number 11,778,735
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component assemblies and embedding for high density electronics
- Patent number 11,744,018
- Issue date Aug 29, 2023
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management for thermal cyclers using air tubes
- Patent number 11,690,169
- Issue date Jun 27, 2023
- Bio-Rad Laboratories, Inc.
- Amir Sadri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and package substrate including vent hole
- Patent number 11,682,614
- Issue date Jun 20, 2023
- SK hynix Inc.
- Hyun Chul Seo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Producing a PCB, as well as a PCB, and a Circuit Board
- Publication number 20240422894
- Publication date Dec 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS
- Publication number 20240421104
- Publication date Dec 19, 2024
- SAUDI ARABIANOIL COMPANY
- Dong Kyu Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BARRIER STRUCTURE FOR POWER MODULES
- Publication number 20240413118
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Peter Scherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-BOARD CHARGER
- Publication number 20240407081
- Publication date Dec 5, 2024
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Suhua Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-EMBEDDED CIRCUIT BOARD
- Publication number 20240397605
- Publication date Nov 28, 2024
- The Boeing Company
- Kyle Avery Woolrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING
- Publication number 20240345639
- Publication date Oct 17, 2024
- Intel Corporation
- Andres Ramirez Macias
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Systems and Methods Providing High-Density Memory Arrangements with...
- Publication number 20240306305
- Publication date Sep 12, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD - COLD PLATE ASSEMBLIES...
- Publication number 20240292564
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240237195
- Publication date Jul 11, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYIN...
- Publication number 20240224416
- Publication date Jul 4, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Jiaxiang ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate Structure and Terminal Device
- Publication number 20240196513
- Publication date Jun 13, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Kai Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING
- Publication number 20240188212
- Publication date Jun 6, 2024
- Intel Corporation
- Mohammad Mamunur Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORM...
- Publication number 20240114630
- Publication date Apr 4, 2024
- Meta Platforms Technologies, LLC
- Cameron Elliot Glasscock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY HAVING BOTH CHASSIS AND MODULE DUAL-FLOW CONNEC...
- Publication number 20240098874
- Publication date Mar 21, 2024
- Eagle Technology, LLC
- Voi NGUYEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEXTURED METAL CORE PRINTED CIRCUIT BOARDS FOR IMPROVED THERMAL DIS...
- Publication number 20240074031
- Publication date Feb 29, 2024
- CreeLED, Inc.
- Everett Bradford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY WITH INTEGRATED AIRFLOW PATH
- Publication number 20240023236
- Publication date Jan 18, 2024
- Dell Products L.P.
- Robert B. CURTIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods Providing High-Density Memory Arrangements with...
- Publication number 20240015890
- Publication date Jan 11, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD THEREOF
- Publication number 20240008171
- Publication date Jan 4, 2024
- Chipbond Technology Corporation
- Wei-Teng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE HAVING A CHANNEL INTEGRATED WITHIN A SUBSTRATE
- Publication number 20240003770
- Publication date Jan 4, 2024
- All Sensors Corporation
- Duy Trung Do
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM AND METHODS
- Publication number 20230422390
- Publication date Dec 28, 2023
- EvansWerks, Inc.
- SHUAIB BADAT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROLLER UNIT
- Publication number 20230413486
- Publication date Dec 21, 2023
- Aptiv Technologies Limited
- Peter REINHOLD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230413425
- Publication date Dec 21, 2023
- LG Innotek Co., Ltd.
- Myung Jae KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METH...
- Publication number 20230369167
- Publication date Nov 16, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...
- Publication number 20230309236
- Publication date Sep 28, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Stefanie Paller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DEVICE ASSEMBLIES HAVING EMBEDDED PCBS AND ENHANCED COOLING A...
- Publication number 20230300972
- Publication date Sep 21, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED SHOWERHEAD
- Publication number 20230298862
- Publication date Sep 21, 2023
- Applied Materials, Inc.
- Alexander BERGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER ELECTRONICS ASSEMBLIES AND METHODS OF FABRICATING THE SAME
- Publication number 20230284377
- Publication date Sep 7, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capillary structure of cooling element, cooling element and prepara...
- Publication number 20230240002
- Publication date Jul 27, 2023
- AAC TECHNOLOGIES (NANJING) CO., LTD.
- Guochuang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOCALIZED IMMERSION COOLING ENCLOSURE WITH THERMAL EFFICIENCY FEATURES
- Publication number 20230209767
- Publication date Jun 29, 2023
- Cisco Technology, Inc.
- M. Baris Dogruoz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT PACKAGE
- Publication number 20230189437
- Publication date Jun 15, 2023
- ORPYX MEDICAL TECHNOLOGIES INC.
- DAVID ALLAN VIBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Adaptations for fluid transport

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods of 3D-printing a circuit board on a heat sink a...

Localized immersion cooling enclosure with thermal efficiency features

Package assembly

PCB heat dissipation assembly and server having same

Inhaler component

Device for conducting biological amplification reactions

Printed circuit board and fabricating method thereof, and displayin...

Printed circuit board

Method of constructing a circuitry assembly for heat dispersal usin...

Flexible and modular top and bottom side processor unit module cooling

Heat dissipation features of autonomous vehicle sensor

Cold plate with embedded power device, driver circuit, and microcon...

Circuit board

Systems and methods providing high-density memory arrangements with...

Apparatus with airflow chamber

Circuit board with heat dissipation structure and method for manufa...

Structural lead frame

Power device assemblies having embedded PCBS and enhanced cooling a...

Electronic device with connected component carrier and fluid coolin...

Conducting track fuse

Power electronics assemblies and methods of fabricating the same

Embedded cooling systems utilizing heat pipes

Air-pocket prevention PCB, air-pocket prevention PCB module, electr...

Embedding method of a flat heat pipe into PCB for active device coo...

Thermal insulation and temperature control of components

Systems including a vapor chamber as the heat spreading substrate o...

Circuit board having a cooling area above and below a semiconductor...

Component assemblies and embedding for high density electronics

Thermal management for thermal cyclers using air tubes

Semiconductor package and package substrate including vent hole

Patents Applicationslast 30 patents

Method of Producing a PCB, as well as a PCB, and a Circuit Board

SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS

SOLDER BARRIER STRUCTURE FOR POWER MODULES

ON-BOARD CHARGER

MULTI-EMBEDDED CIRCUIT BOARD

FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING

Systems and Methods Providing High-Density Memory Arrangements with...

POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD - COLD PLATE ASSEMBLIES...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYIN...

Substrate Structure and Terminal Device

PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING

SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORM...

ELECTRONIC ASSEMBLY HAVING BOTH CHASSIS AND MODULE DUAL-FLOW CONNEC...

TEXTURED METAL CORE PRINTED CIRCUIT BOARDS FOR IMPROVED THERMAL DIS...

CIRCUIT BOARD ASSEMBLY WITH INTEGRATED AIRFLOW PATH

Systems and Methods Providing High-Density Memory Arrangements with...

SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD THEREOF

SENSOR PACKAGE HAVING A CHANNEL INTEGRATED WITHIN A SUBSTRATE

COOLING SYSTEM AND METHODS

ELECTRONIC CONTROLLER UNIT

CIRCUIT BOARD

LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METH...

Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...

POWER DEVICE ASSEMBLIES HAVING EMBEDDED PCBS AND ENHANCED COOLING A...

INTEGRATED SHOWERHEAD

POWER ELECTRONICS ASSEMBLIES AND METHODS OF FABRICATING THE SAME

Capillary structure of cooling element, cooling element and prepara...

LOCALIZED IMMERSION COOLING ENCLOSURE WITH THERMAL EFFICIENCY FEATURES

FLEXIBLE CIRCUIT PACKAGE