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adapted for localised heating
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H01L2224/78253
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/78253
adapted for localised heating
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Patents Grants
last 30 patents
Information
Patent Grant
Antioxidant gas blow-off unit
Patent number
9,415,456
Issue date
Aug 16, 2016
Shinkawa Ltd.
Toru Maeda
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Antioxidant gas blow-off unit
Patent number
9,362,251
Issue date
Jun 7, 2016
Shinkawa Ltd.
Mitsuaki Sakakura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermal compression bonding of semiconductor chips
Patent number
8,967,452
Issue date
Mar 3, 2015
ASM Technology Singapore Pte. Ltd.
Yiu Ming Cheung
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
Publication number
20240395765
Publication date
Nov 28, 2024
Yangtze Memory Technologies Co., Ltd.
XuHui Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR WIRE PREPARATION
Publication number
20190372294
Publication date
Dec 5, 2019
The Charles Stark Draper Laboratory, Inc.
Mitchell W. Meinhold
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BOND STRENGTHENING
Publication number
20160322329
Publication date
Nov 3, 2016
SKYWORKS SOLUTIONS, INC.
Aldrin Quinones GARING
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
Publication number
20140054277
Publication date
Feb 27, 2014
KAIJO CORPORATION
Akio Sugito
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS
Publication number
20130270230
Publication date
Oct 17, 2013
Yiu Ming CHEUNG
H01 - BASIC ELECTRIC ELEMENTS