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H01L23/49517

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49517Additional leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 12,166,162
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangements for integrated lateral diffusion field effe...
- Patent number 12,159,815
- Issue date Dec 3, 2024
- Silanna Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit power module and related methods
- Patent number 12,119,576
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead adapters for semiconductor package
- Patent number 12,113,000
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Ajay Poonjal Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach surface copper layer with protective layer for microelec...
- Patent number 12,074,096
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three level interconnect clip
- Patent number 12,057,376
- Issue date Aug 6, 2024
- Infineon Technologies AG
- Azlina Kassim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with clip interconnect and dual side c...
- Patent number 12,051,635
- Issue date Jul 30, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 12,040,197
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with die pads and leads
- Patent number 12,021,010
- Issue date Jun 25, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 11,996,344
- Issue date May 28, 2024
- Denso Corporation
- Shoichiro Omae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,984,386
- Issue date May 14, 2024
- Fuji Electric Co., Ltd.
- Hisato Inokuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,973,011
- Issue date Apr 30, 2024
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,961,790
- Issue date Apr 16, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,948,869
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Naoki Okawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module having a plurality of lead frames connected to a sub...
- Patent number 11,935,819
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Hideshi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,887,905
- Issue date Jan 30, 2024
- Denso Corporation
- Susumu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and clip with a die attach
- Patent number 11,869,830
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMDs integration on QFN by 3D stacked solution
- Patent number 11,842,948
- Issue date Dec 12, 2023
- STMicroelectronics S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with a support portion having a through hole over a heat...
- Patent number 11,837,530
- Issue date Dec 5, 2023
- Shinko Electric Industries Co., Ltd.
- Jun Izuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced isolated power converter package
- Patent number 11,791,249
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame member
- Patent number 11,776,929
- Issue date Oct 3, 2023
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 11,777,068
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous body on the side surface of a connector mounted to semicondu...
- Patent number 11,776,884
- Issue date Oct 3, 2023
- Kabushiki Kaisha Toshiba
- Yuning Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device topside cooling
- Patent number 11,742,266
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Laura May Antoinette Dela Paz Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,728,252
- Issue date Aug 15, 2023
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 11,710,681
- Issue date Jul 25, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Tanawan Chaowasakoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device with diagnosis unit for self-diagnosing presence or a...
- Patent number 11,652,013
- Issue date May 16, 2023
- Denso Corporation
- Tetsuya Ohmi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME
- Publication number 20250006583
- Publication date Jan 2, 2025
- Tesla, Inc.
- William Thomas Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240429200
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240413030
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240413060
- Publication date Dec 12, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER SEMICONDUCTOR PACKAGE
- Publication number 20240404925
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240404928
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND MANUFACURING METHOD THEREOF
- Publication number 20240387485
- Publication date Nov 21, 2024
- DIODES INCORPORATED
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND...
- Publication number 20240371734
- Publication date Nov 7, 2024
- ROHM CO., LTD.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...
- Publication number 20240363471
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20240355714
- Publication date Oct 24, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE
- Publication number 20240355753
- Publication date Oct 24, 2024
- PIERBURG GMBH
- MIKA NUOTIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240339385
- Publication date Oct 10, 2024
- NEPES LAWEH CORPORATION
- Byungcheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID QUAD FLAT NO-LEADS (QFN) INTEGRATED CIRCUIT PACKAGE
- Publication number 20240332143
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS
- Publication number 20240290695
- Publication date Aug 29, 2024
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE
- Publication number 20240250056
- Publication date Jul 25, 2024
- Mohd Afiz Hashim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240243044
- Publication date Jul 18, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240222232
- Publication date Jul 4, 2024
- ROHM CO., LTD.
- Akihiro KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213123
- Publication date Jun 27, 2024
- DENSO CORPORATION
- SACHIO KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240186221
- Publication date Jun 6, 2024
- Fuji Electric Co., Ltd.
- Hisato INOKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240178107
- Publication date May 30, 2024
- Kabushiki Kaisha Toshiba
- Katsuya SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240162205
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Marcus BÖHM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145349
- Publication date May 2, 2024
- DENSO CORPORATION
- TAKAHIRO HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED POWER PACKAGING WITH FLEXIBLE CONNECTIVITY
- Publication number 20240112977
- Publication date Apr 4, 2024
- LITTELFUSE, INC.
- Rhodri Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR EQUIPMENT
- Publication number 20240112995
- Publication date Apr 4, 2024
- Rohm Co., Ltd.
- Moe YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REDUCED PARASITIC INDUCTANCE
- Publication number 20240096768
- Publication date Mar 21, 2024
- Alpha and Omega Semiconductor International LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION
- Publication number 20240096759
- Publication date Mar 21, 2024
- STMicroelectronics S.r.l.
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE HAVING AN ELECTRICALLY CONDUCTIVE CLIP WITH A CONVEX...
- Publication number 20240087993
- Publication date Mar 14, 2024
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240071780
- Publication date Feb 29, 2024
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20240055393
- Publication date Feb 15, 2024
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS

Additional leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor light emitting device and method for manufacturing th...

Connection arrangements for integrated lateral diffusion field effe...

Press-fit power module and related methods

Lead adapters for semiconductor package

Die attach surface copper layer with protective layer for microelec...

Three level interconnect clip

Semiconductor device package with clip interconnect and dual side c...

Mechanical couplings designed to resolve process constraints

Electronic device with die pads and leads

Semiconductor device

Semiconductor device

Semiconductor module

Semiconductor module

Semiconductor device and method for manufacturing the same

Circuit module having a plurality of lead frames connected to a sub...

Semiconductor device

Semiconductor package and clip with a die attach

SMDs integration on QFN by 3D stacked solution

Lead frame with a support portion having a through hole over a heat...

Thermally enhanced isolated power converter package

Semiconductor device and lead frame member

Semiconductor light emitting device and method for manufacturing th...

Porous body on the side surface of a connector mounted to semicondu...

Electronic device topside cooling

Package-on-package assembly with wire bond vias

Semiconductor device package

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device

Sensor device with diagnosis unit for self-diagnosing presence or a...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME

SEMICONDUCTOR PACKAGE

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

SEMICONDUCTOR MODULE

MOLDED POWER SEMICONDUCTOR PACKAGE

LEAD FRAME AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT PACKAGE AND MANUFACURING METHOD THEREOF

ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND...

SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

POWER SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

HYBRID QUAD FLAT NO-LEADS (QFN) INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS

SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

ISOLATED POWER PACKAGING WITH FLEXIBLE CONNECTIVITY

SEMICONDUCTOR EQUIPMENT

SEMICONDUCTOR PACKAGE HAVING REDUCED PARASITIC INDUCTANCE

SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION

MOLDED PACKAGE HAVING AN ELECTRICALLY CONDUCTIVE CLIP WITH A CONVEX...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREFOR

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS