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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

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H05K3/305Affixing by adhesive

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing substrate with sensor
- Patent number 12,167,542
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Manabu Nakagawasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module having a soldering portion coupling a driving device...
- Patent number 12,149,811
- Issue date Nov 19, 2024
- LG Innotek Co., Ltd
- Jong Ho Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Module and manufacturing method of the same
- Patent number 12,108,526
- Issue date Oct 1, 2024
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory system
- Patent number 12,094,866
- Issue date Sep 17, 2024
- Kioxia Corporation
- Hayato Masubuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,052,903
- Issue date Jul 30, 2024
- Samsung Display Co., Ltd.
- Jong-Tae Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing circuit boards
- Patent number 11,974,404
- Issue date Apr 30, 2024
- TOPPAN INC.
- Yuki Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronics assembly
- Patent number 11,950,367
- Issue date Apr 2, 2024
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing components to substrate posts
- Patent number 11,950,375
- Issue date Apr 2, 2024
- X Display Company Technology Limited
- David Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, laminate, semiconductor wafer with resin composi...
- Patent number 11,924,979
- Issue date Mar 5, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Masashi Okaniwa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing electronics assembly and electronics assembly
- Patent number 11,910,530
- Issue date Feb 20, 2024
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit / printed circuit board assembly and method of m...
- Patent number 11,910,519
- Issue date Feb 20, 2024
- Eridan Communications, Inc.
- Douglas A. Kirkpatrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing ultrasound transducers and other components
- Patent number 11,845,108
- Issue date Dec 19, 2023
- FUJIFILM SonoSite, Inc.
- N. Christopher Chaggares
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Circuit formation method
- Patent number 11,849,545
- Issue date Dec 19, 2023
- FUJI CORPORATION
- Kenji Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens module
- Patent number 11,785,723
- Issue date Oct 10, 2023
- Primax Electronics Ltd.
- Sheng-Hsiang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 11,776,989
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection on a textile carrier material
- Patent number 11,764,491
- Issue date Sep 19, 2023
- ADAPTIVE REGELSYSTEME GESELLSCHAFT M.B.H
- Ulrich Klapper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of parallel transfer of micro-devices using mask layer
- Patent number 11,756,982
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory system
- Patent number 11,705,444
- Issue date Jul 18, 2023
- Kioxia Corporation
- Hayato Masubuchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Camera module having a soldering portion coupling a driving device...
- Patent number 11,671,690
- Issue date Jun 6, 2023
- LG Innotek Co., Ltd
- Jong Ho Chung
- G02 - OPTICS
Information Patent Grant
Method for manufacturing a circuit board with embedded nickel resistor
- Patent number 11,665,831
- Issue date May 30, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jian Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lightweight conformal phased array antenna using aerogel substrate
- Patent number 11,658,398
- Issue date May 23, 2023
- United States of America as represented by the Administrator of National Aero...
- James M. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for creating interconnections between a substrate and electr...
- Patent number 11,606,864
- Issue date Mar 14, 2023
- SunRay Scientific, Inc.
- Andrew Stemmermann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible display apparatus
- Patent number 11,604,389
- Issue date Mar 14, 2023
- E Ink Holdings Inc.
- Lih-Hsiung Chan
- G02 - OPTICS
Information Patent Grant
Intraluminal ultrasound imaging device and method of fabricating th...
- Patent number 11,596,387
- Issue date Mar 7, 2023
- PHILIPS IMAGE GUIDED THERAPY CORPORATION
- Jun Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fiber optics printed circuit board assembly surface cleaning and ro...
- Patent number 11,555,973
- Issue date Jan 17, 2023
- II-VI DELAWARE, INC.
- Tao Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chiplets with connection posts
- Patent number 11,552,034
- Issue date Jan 10, 2023
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing components to substrate posts
- Patent number 11,528,808
- Issue date Dec 13, 2022
- X Display Company Technology Limited
- David Gomez
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
BONDING MODULE AND A BONDING DEVICE
- Publication number 20240409355
- Publication date Dec 12, 2024
- ALL RING TECH CO., LTD.
- Chuen-Fa SHIH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
BONDING METHOD AND A BONDING APPARATUS FOR IMPLEMENTING THE BONDING...
- Publication number 20240409354
- Publication date Dec 12, 2024
- ALL RING TECH CO., LTD.
- Chuen-Fa SHIH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
TOOL AND PROCESSES FOR PICK-AND-PLACE ASSEMBLY
- Publication number 20240407148
- Publication date Dec 5, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
- Publication number 20240397631
- Publication date Nov 28, 2024
- Gold Circuit Electronics Ltd.
- Chen-Tse Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240397633
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS
- Publication number 20240381541
- Publication date Nov 14, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING COMPONENTS TO SUBSTRATE POSTS
- Publication number 20240349431
- Publication date Oct 17, 2024
- X Display Company Technology Limited
- David Gomez
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAF...
- Publication number 20240292544
- Publication date Aug 29, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Seon-Kyu CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276650
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY
- Publication number 20240237218
- Publication date Jul 11, 2024
- TactoTek Oy
- Vinski BRÄYSY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PR...
- Publication number 20240196545
- Publication date Jun 13, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki YOSHIOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNT BOARD
- Publication number 20240172366
- Publication date May 23, 2024
- NIPPON MEKTRON, LTD.
- Azumi TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD, DISPLAY PANEL AND METHOD FOR MANUFACTURING...
- Publication number 20240090127
- Publication date Mar 14, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yonglin CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE
- Publication number 20240080540
- Publication date Mar 7, 2024
- LG Innotek Co., Ltd.
- JONG HO CHUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240040708
- Publication date Feb 1, 2024
- FUJIKURA PRINTED CIRCUITS LTD.
- Daisuke Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORK PATCH FOR AN ELECTRONIC CIRCUIT
- Publication number 20240040706
- Publication date Feb 1, 2024
- Jabil Inc.
- Muhammad Irsyad Bin Suhaimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS
- Publication number 20240015428
- Publication date Jan 11, 2024
- LG Display Co., Ltd.
- Doyoung JEOUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR UNIT AND IMAGE FORMING APPARATUS INCLUDING SENSOR UNIT
- Publication number 20230403788
- Publication date Dec 14, 2023
- Canon Kabushiki Kaisha
- TAKUMI IDE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230397338
- Publication date Dec 7, 2023
- TDK Corporation
- Atsuhiro TSUYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF PARALLEL TRANSFER OF MICRO-DEVICES USING TREATMENT
- Publication number 20230395645
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY
- Publication number 20230389184
- Publication date Nov 30, 2023
- TactoTek Oy
- Vinski BRÄYSY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY
- Publication number 20230309231
- Publication date Sep 28, 2023
- TactoTek Oy
- Vinski BRÄYSY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20230307433
- Publication date Sep 28, 2023
- Kioxia Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT
- Publication number 20230300975
- Publication date Sep 21, 2023
- Intel Corporation
- Jan Proschwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Module With Discrete Optics and Methods of Assembling Same
- Publication number 20230284389
- Publication date Sep 7, 2023
- ABL IP Holding LLC
- John Bryan Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230276576
- Publication date Aug 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20230217599
- Publication date Jul 6, 2023
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing a component
- Publication number 20230209703
- Publication date Jun 29, 2023
- Scio Holding GmbH
- Marius Sillmann
- B60 - VEHICLES IN GENERAL

Affixing by adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing substrate with sensor

Camera module having a soldering portion coupling a driving device...

Module and manufacturing method of the same

Semiconductor memory system

Electronic device and method of manufacturing the same

Chiplets with connection posts

Method of producing circuit boards

Method for manufacturing electronics assembly

Printing components to substrate posts

Resin composition, laminate, semiconductor wafer with resin composi...

Method for manufacturing electronics assembly and electronics assembly

Integrated circuit / printed circuit board assembly and method of m...

Methods for manufacturing ultrasound transducers and other components

Circuit formation method

Circuit board structure and method for manufacturing a circuit boar...

Lens module

Methods of parallel transfer of micro-devices using treatment

Electrical connection on a textile carrier material

Methods of parallel transfer of micro-devices using mask layer

Semiconductor memory system

Camera module having a soldering portion coupling a driving device...

Method for manufacturing a circuit board with embedded nickel resistor

Lightweight conformal phased array antenna using aerogel substrate

System for creating interconnections between a substrate and electr...

Ultra-thin embedded semiconductor device package and method of manu...

Flexible display apparatus

Intraluminal ultrasound imaging device and method of fabricating th...

Fiber optics printed circuit board assembly surface cleaning and ro...

Chiplets with connection posts

Printing components to substrate posts

Patents Applicationslast 30 patents

BONDING MODULE AND A BONDING DEVICE

BONDING METHOD AND A BONDING APPARATUS FOR IMPLEMENTING THE BONDING...

TOOL AND PROCESSES FOR PICK-AND-PLACE ASSEMBLY

SEMICONDUCTOR MEMORY SYSTEM

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS

PRINTING COMPONENTS TO SUBSTRATE POSTS

METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAF...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY

ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PR...

CHIPLETS WITH CONNECTION POSTS

COMPONENT MOUNT BOARD

FLEXIBLE CIRCUIT BOARD, DISPLAY PANEL AND METHOD FOR MANUFACTURING...

CAMERA MODULE

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

REWORK PATCH FOR AN ELECTRONIC CIRCUIT

DISPLAY APPARATUS

SENSOR UNIT AND IMAGE FORMING APPARATUS INCLUDING SENSOR UNIT

ELECTRONIC COMPONENT

METHODS OF PARALLEL TRANSFER OF MICRO-DEVICES USING TREATMENT

METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY

METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY

SEMICONDUCTOR MEMORY SYSTEM

INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT

Light Module With Discrete Optics and Methods of Assembling Same

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...

Method for manufacturing a component