After-treatment introducing at least one additional element into the layer

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H01L21/76855

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76855After-treatment introducing at least one additional element into the layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Gate-all-around transistor with reduced source/drain contact resist...
- Patent number 12,191,151
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor contact with reduced contact resistance
- Patent number 12,107,086
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structure
- Patent number 12,080,595
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Keunwook Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,074,062
- Issue date Aug 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Taoyan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 12,068,197
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of contact bottom void in semiconductor fabrication
- Patent number 12,062,578
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having conductive pad structures with multi-b...
- Patent number 12,051,659
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for inhibiting line bending during conductive material depo...
- Patent number 11,935,782
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a FinFET by implanting a dielectric with a...
- Patent number 11,901,455
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a self-forming barrier layer at via bottom
- Patent number RE49820
- Issue date Jan 30, 2024
- GLOBALFOUNDRIES U.S. INC.
- Larry Zhao
Information Patent Grant
FinFET device and method of forming
- Patent number 11,854,811
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure of a semiconductor device
- Patent number 11,854,875
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact structure and method of forming the same in a semicon...
- Patent number 11,854,874
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electrode and semiconductor device
- Patent number 11,791,201
- Issue date Oct 17, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Motomu Kurata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, fabricating method thereof, and semicond...
- Patent number 11,749,603
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multi-layer diffusion barrier and met...
- Patent number 11,742,393
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal interconnection
- Patent number 11,715,689
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFETs with low source/drain contact resistance
- Patent number 11,695,061
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having contact plug
- Patent number 11,694,924
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Jia Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices having conductive pad...
- Patent number 11,688,703
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, fabricating method thereof, and semicond...
- Patent number 11,682,625
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with dielectric spacer liner on source/drain c...
- Patent number 11,670,690
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Cheng Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,646,231
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for smoothing dynamic random access memory bi...
- Patent number 11,631,680
- Issue date Apr 18, 2023
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 11,569,362
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ming Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance source drain contact formation with trench metastabl...
- Patent number 11,562,906
- Issue date Jan 24, 2023
- International Business Machines Corporation
- Oleg Gluschenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing multilayer stack including copper over feature...
- Patent number 11,562,925
- Issue date Jan 24, 2023
- Applied Materials, Inc.
- Shirish Pethe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device having a liner layer w...
- Patent number 11,545,390
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact plug with an air gap spacer
- Patent number 11,456,383
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING INTERCONNECT STRUCTURE
- Publication number 20240395613
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Keunwook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION
- Publication number 20240363409
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION
- Publication number 20240363429
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...
- Publication number 20240203786
- Publication date Jun 20, 2024
- Tahoe Research, Ltd.
- Hui Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interlayer for Resistivity Reduction in Metal Deposition Applications
- Publication number 20240194527
- Publication date Jun 13, 2024
- Applied Materials, Inc.
- Sahil Jaykumar PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO FORM METAL LINERS FOR INTERCONNECTS
- Publication number 20240153816
- Publication date May 9, 2024
- Ge QU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20240087953
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFETs With Low Source/Drain Contact Resistance
- Publication number 20230282733
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD STRUCTURES WITH MULTI-B...
- Publication number 20230275049
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsun HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20230170397
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING LAYERS
- Publication number 20230122969
- Publication date Apr 20, 2023
- Applied Materials, Inc.
- Shirish PETHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET DEVICE AND METHOD
- Publication number 20220359755
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE, FABRICATING METHOD THEREOF, AND SEMICOND...
- Publication number 20220344274
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Metal Via for Contact Resistance Reduction
- Publication number 20220293770
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20220277993
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD...
- Publication number 20220238467
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsun HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER DIFFUSION BARRIER AND METHOD OF MAKING THE SAME
- Publication number 20220190122
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Jyh-nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Semiconductor Interconnect
- Publication number 20220148977
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ru-Shang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER
- Publication number 20220115269
- Publication date Apr 14, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
- Publication number 20210335662
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jia HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection Structure, Fabricating Method Thereof, and Semicond...
- Publication number 20210327814
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRODE AND SEMICONDUCTOR DEVICE
- Publication number 20210257251
- Publication date Aug 19, 2021
- Semiconductor Energy Laboratory Co., Ltd.
- Motomu KURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFETs With Low Source/Drain Contact Resistance
- Publication number 20210167192
- Publication date Jun 3, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE, FABRICATING METHOD THEREOF, AND SEMICOND...
- Publication number 20210118807
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING LAYERS
- Publication number 20210118729
- Publication date Apr 22, 2021
- Applied Materials, Inc.
- Shirish PETHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SMOOTHING DYNAMIC RANDOM ACCESS MEMORY BI...
- Publication number 20210066309
- Publication date Mar 4, 2021
- Priyadarshi PANDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20210050254
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Buried Metal Line in a Semiconductor Substrate
- Publication number 20210028059
- Publication date Jan 28, 2021
- IMEC vzw
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS

After-treatment introducing at least one additional element into the layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gate-all-around transistor with reduced source/drain contact resist...

Field effect transistor contact with reduced contact resistance

Method of forming interconnect structure

Method for manufacturing semiconductor structure

Methods for forming contact plugs with reduced corrosion

Prevention of contact bottom void in semiconductor fabrication

Semiconductor devices having conductive pad structures with multi-b...

Methods for inhibiting line bending during conductive material depo...

Method of manufacturing a FinFET by implanting a dielectric with a...

Semiconductor device having a self-forming barrier layer at via bottom

FinFET device and method of forming

Contact structure of a semiconductor device

Metal contact structure and method of forming the same in a semicon...

Method of forming copper interconnect structure with manganese barr...

Method for fabricating electrode and semiconductor device

Interconnection structure, fabricating method thereof, and semicond...

Semiconductor device having a multi-layer diffusion barrier and met...

Method of forming metal interconnection

FinFETs with low source/drain contact resistance

Semiconductor device having contact plug

Methods of fabricating semiconductor devices having conductive pad...

Interconnection structure, fabricating method thereof, and semicond...

Semiconductor device with dielectric spacer liner on source/drain c...

Semiconductor device and method

Methods and apparatus for smoothing dynamic random access memory bi...

Semiconductor device and a method for fabricating the same

Low resistance source drain contact formation with trench metastabl...

Method of depositing multilayer stack including copper over feature...

Method of fabricating a semiconductor device having a liner layer w...

Semiconductor device having a contact plug with an air gap spacer

Patents Applicationslast 30 patents

METHOD OF FORMING INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION

PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION

SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...

Interlayer for Resistivity Reduction in Metal Deposition Applications

METHODS TO FORM METAL LINERS FOR INTERCONNECTS

Metal Contact Structure and Method of Forming the Same in a Semicon...

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

FinFETs With Low Source/Drain Contact Resistance

SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD STRUCTURES WITH MULTI-B...

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

METHOD OF DEPOSITING LAYERS

FINFET DEVICE AND METHOD

INTERCONNECTION STRUCTURE, FABRICATING METHOD THEREOF, AND SEMICOND...

Dual Metal Via for Contact Resistance Reduction

CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE

METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD...

MULTI-LAYER DIFFUSION BARRIER AND METHOD OF MAKING THE SAME

Method and Structure for Semiconductor Interconnect

COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER

SEMICONDUCTOR DEVICE HAVING CONTACT PLUG

Interconnection Structure, Fabricating Method Thereof, and Semicond...

METHOD FOR FABRICATING ELECTRODE AND SEMICONDUCTOR DEVICE

FinFETs With Low Source/Drain Contact Resistance

INTERCONNECTION STRUCTURE, FABRICATING METHOD THEREOF, AND SEMICOND...

METHOD OF DEPOSITING LAYERS

METHODS AND APPARATUS FOR SMOOTHING DYNAMIC RANDOM ACCESS MEMORY BI...

Metal Contact Structure and Method of Forming the Same in a Semicon...

Method for Forming a Buried Metal Line in a Semiconductor Substrate