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After-treatment introducing at least one additional element into the layer
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/76855
After-treatment introducing at least one additional element into the layer
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last 30 patents
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Methods for inhibiting line bending during conductive material depo...
Patent number
11,935,782
Issue date
Mar 19, 2024
Micron Technology, Inc.
Gurtej S. Sandhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a FinFET by implanting a dielectric with a...
Patent number
11,901,455
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Su-Hao Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a self-forming barrier layer at via bottom
Patent number
RE49820
Issue date
Jan 30, 2024
GLOBALFOUNDRIES U.S. INC.
Larry Zhao
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Patent Grant
FinFET device and method of forming
Patent number
11,854,811
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Contact structure of a semiconductor device
Patent number
11,854,875
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Joanna Chaw Yane Yin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Metal contact structure and method of forming the same in a semicon...
Patent number
11,854,874
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming copper interconnect structure with manganese barr...
Patent number
11,804,405
Issue date
Oct 31, 2023
TESSERA LLC
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for fabricating electrode and semiconductor device
Patent number
11,791,201
Issue date
Oct 17, 2023
Semiconductor Energy Laboratory Co., Ltd.
Motomu Kurata
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Interconnection structure, fabricating method thereof, and semicond...
Patent number
11,749,603
Issue date
Sep 5, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having a multi-layer diffusion barrier and met...
Patent number
11,742,393
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jyh-nan Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of forming metal interconnection
Patent number
11,715,689
Issue date
Aug 1, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
FinFETs with low source/drain contact resistance
Patent number
11,695,061
Issue date
Jul 4, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Lien Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having contact plug
Patent number
11,694,924
Issue date
Jul 4, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Wen-Jia Hsieh
H01 - BASIC ELECTRIC ELEMENTS
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Methods of fabricating semiconductor devices having conductive pad...
Patent number
11,688,703
Issue date
Jun 27, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Hsun Huang
H01 - BASIC ELECTRIC ELEMENTS
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Interconnection structure, fabricating method thereof, and semicond...
Patent number
11,682,625
Issue date
Jun 20, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with dielectric spacer liner on source/drain c...
Patent number
11,670,690
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chi-Cheng Hung
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method
Patent number
11,646,231
Issue date
May 9, 2023
Taiwan Semiconductor Manufacturing Company
Shahaji B. More
H01 - BASIC ELECTRIC ELEMENTS
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Methods and apparatus for smoothing dynamic random access memory bi...
Patent number
11,631,680
Issue date
Apr 18, 2023
Applied Materials, Inc.
Priyadarshi Panda
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and a method for fabricating the same
Patent number
11,569,362
Issue date
Jan 31, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Ming Hsu
H01 - BASIC ELECTRIC ELEMENTS
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Low resistance source drain contact formation with trench metastabl...
Patent number
11,562,906
Issue date
Jan 24, 2023
International Business Machines Corporation
Oleg Gluschenkov
H01 - BASIC ELECTRIC ELEMENTS
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Method of depositing multilayer stack including copper over feature...
Patent number
11,562,925
Issue date
Jan 24, 2023
Applied Materials, Inc.
Shirish Pethe
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of fabricating a semiconductor device having a liner layer w...
Patent number
11,545,390
Issue date
Jan 3, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Joanna Chaw Yane Yin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having a contact plug with an air gap spacer
Patent number
11,456,383
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Su-Hao Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Contact structure and formation thereof
Patent number
11,444,028
Issue date
Sep 13, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Hong-Mao Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
MOS devices having epitaxy regions with reduced facets
Patent number
11,411,109
Issue date
Aug 9, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsueh-Chang Sung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Interconnection structure, fabricating method thereof, and semicond...
Patent number
11,404,376
Issue date
Aug 2, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Prevention of contact bottom void in semiconductor fabrication
Patent number
11,362,003
Issue date
Jun 14, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Yun Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Dual metal via for contact resistance reduction
Patent number
11,349,015
Issue date
May 31, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Chung-Liang Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods of fabricating semiconductor devices having conductive pad...
Patent number
11,309,265
Issue date
Apr 19, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Po-Hsun Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer barrier for CMOS under array type memory device and met...
Patent number
11,296,112
Issue date
Apr 5, 2022
SanDisk Technologies LLC
Fumitaka Amano
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
Publication number
20240087953
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
Publication number
20240006237
Publication date
Jan 4, 2024
Adeia Semiconductor Solutions LLC
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FinFETs With Low Source/Drain Contact Resistance
Publication number
20230282733
Publication date
Sep 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Lien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD STRUCTURES WITH MULTI-B...
Publication number
20230275049
Publication date
Aug 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hsun HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
Publication number
20230170397
Publication date
Jun 1, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Ming HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF DEPOSITING LAYERS
Publication number
20230122969
Publication date
Apr 20, 2023
Applied Materials, Inc.
Shirish PETHE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINFET DEVICE AND METHOD
Publication number
20220359755
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Su-Hao Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE, FABRICATING METHOD THEREOF, AND SEMICOND...
Publication number
20220344274
Publication date
Oct 27, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dual Metal Via for Contact Resistance Reduction
Publication number
20220293770
Publication date
Sep 15, 2022
Taiwan Semiconductor Manufacturing Co., LTD
Chung-Liang Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
Publication number
20220277993
Publication date
Sep 1, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Joanna Chaw Yane YIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD...
Publication number
20220238467
Publication date
Jul 28, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hsun HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER DIFFUSION BARRIER AND METHOD OF MAKING THE SAME
Publication number
20220190122
Publication date
Jun 16, 2022
Taiwan Semiconductor Manufacturing Co., LTD
Jyh-nan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and Structure for Semiconductor Interconnect
Publication number
20220148977
Publication date
May 12, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Ru-Shang Hsiao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER
Publication number
20220115269
Publication date
Apr 14, 2022
Tessera, Inc.
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
Publication number
20210335662
Publication date
Oct 28, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Jia HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnection Structure, Fabricating Method Thereof, and Semicond...
Publication number
20210327814
Publication date
Oct 21, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung LIN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR FABRICATING ELECTRODE AND SEMICONDUCTOR DEVICE
Publication number
20210257251
Publication date
Aug 19, 2021
Semiconductor Energy Laboratory Co., Ltd.
Motomu KURATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FinFETs With Low Source/Drain Contact Resistance
Publication number
20210167192
Publication date
Jun 3, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Lien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE, FABRICATING METHOD THEREOF, AND SEMICOND...
Publication number
20210118807
Publication date
Apr 22, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF DEPOSITING LAYERS
Publication number
20210118729
Publication date
Apr 22, 2021
Applied Materials, Inc.
Shirish PETHE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHODS AND APPARATUS FOR SMOOTHING DYNAMIC RANDOM ACCESS MEMORY BI...
Publication number
20210066309
Publication date
Mar 4, 2021
Priyadarshi PANDA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
Publication number
20210050254
Publication date
Feb 18, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Method for Forming a Buried Metal Line in a Semiconductor Substrate
Publication number
20210028059
Publication date
Jan 28, 2021
IMEC vzw
Boon Teik Chan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MICROELECTRONIC DEVICES COMPRISING MANGANESE-CONTAINING CONDUCTIVE...
Publication number
20210020503
Publication date
Jan 21, 2021
Micron Technology, Inc.
Kentaro Ishii
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF
Publication number
20210005743
Publication date
Jan 7, 2021
Taiwan Semiconductor Manufacturing company Ltd.
POHAN KUNG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTERCONNECT STRUCTURE
Publication number
20200402848
Publication date
Dec 24, 2020
Tessera, Inc.
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER DIFFUSION BARRIER AND METHOD OF MAKING THE SAME
Publication number
20200365695
Publication date
Nov 19, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Jyh-nan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING A LINER LAYER W...
Publication number
20200350205
Publication date
Nov 5, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Joanna Chaw Yane YIN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
Publication number
20200350416
Publication date
Nov 5, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Ming HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Forming Metal Interconnection
Publication number
20200343177
Publication date
Oct 29, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Yi Yang
H01 - BASIC ELECTRIC ELEMENTS