After-treatment

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CPC
H05K3/0055

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0055After-treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number RE49929
- Issue date Apr 16, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
Information Patent Grant
Oxygen and humidity control in storage device
- Patent number 11,723,152
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shen-Min Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 11,690,178
- Issue date Jun 27, 2023
- Toppan Printing Co., Ltd.
- Hiroshi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and equipment for the treatment of panels
- Patent number 11,483,933
- Issue date Oct 25, 2022
- WISE S.R.L.
- Massimo Fiorani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Fabrication method of flexible electronic device
- Patent number 11,191,166
- Issue date Nov 30, 2021
- E Ink Holdings Inc.
- Kuo-Feng Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing a printed circuit board structure
- Patent number 11,172,576
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate
- Patent number 11,122,686
- Issue date Sep 14, 2021
- Ibiden Co., Ltd.
- Yasuki Kimishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning and removal of circuit board material using ultrafast la...
- Patent number 11,064,611
- Issue date Jul 13, 2021
- IPG Photonics Corporation
- David C. Clark
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided and multilayered printed circuit board fabrication usi...
- Patent number 11,039,541
- Issue date Jun 15, 2021
- Nano Dimension Technologies, LTD.
- Sharon Fima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polydimethylsiloxane films and method of manufacture
- Patent number 11,027,462
- Issue date Jun 8, 2021
- The Board of Trustees of Western Michigan University
- Michael James Joyce
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wiring substrate
- Patent number 11,019,722
- Issue date May 25, 2021
- Shinko Electric Industries Co., Ltd.
- Kenichi Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Asymmetric electronic substrate and method of manufacture
- Patent number 10,980,129
- Issue date Apr 13, 2021
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing same
- Patent number 10,952,320
- Issue date Mar 16, 2021
- Kyocera Corporation
- Tadashi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing transparent light emitting device by using...
- Patent number 10,925,169
- Issue date Feb 16, 2021
- Seung Hwan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, wiring board, substrate for wiring board, copper clad la...
- Patent number 10,912,193
- Issue date Feb 2, 2021
- Kabushiki Kaisha Toshiba
- Hajime Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Doped, low-temperature co-fired glass-ceramic (LTCC) insulating sub...
- Patent number 10,858,282
- Issue date Dec 8, 2020
- QUALCOMM Incorporated
- Klaus Dieter Aichholzer
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Fabrication method of circuit board
- Patent number 10,820,423
- Issue date Oct 27, 2020
- Gold Circuit Electronics Ltd.
- Chih-Hai Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing insulated circuit board, insulated circuit...
- Patent number 10,798,824
- Issue date Oct 6, 2020
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cured body and multilayered substrate
- Patent number 10,767,051
- Issue date Sep 8, 2020
- Sekisui Chemical Co., Ltd.
- Tatsushi Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Substrates for stretchable electronics and method of manufacture
- Patent number 10,736,212
- Issue date Aug 4, 2020
- ARES MATERIALS INC.
- Radu Reit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate production method
- Patent number 10,721,823
- Issue date Jul 21, 2020
- Intel Corporation
- Makoto Fujimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate production method
- Patent number 10,716,222
- Issue date Jul 14, 2020
- Intel Corporation
- Makoto Fujimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Asymmetric electronic substrate and method of manufacture
- Patent number 10,624,213
- Issue date Apr 14, 2020
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic component
- Patent number 10,537,020
- Issue date Jan 14, 2020
- Sumitomo Electric Industries, Ltd.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass substrate
- Patent number 10,531,566
- Issue date Jan 7, 2020
- AGC Inc.
- Mamoru Isobe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 10,492,288
- Issue date Nov 26, 2019
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Simon Sebanz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate and method for manufacturing the same
- Patent number 10,485,105
- Issue date Nov 19, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Sam Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240237221
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240237231
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240155760
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138076
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138071
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20240098884
- Publication date Mar 21, 2024
- LG Innotek Co., Ltd.
- Do Hyuk YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMI-FLEX PRINTED CIRCUIT BOARD
- Publication number 20240049396
- Publication date Feb 8, 2024
- TRIPOD (WUXI) ELECTRONIC CO., LTD.
- Cheng Ming LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE
- Publication number 20230337365
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Min YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20210259107
- Publication date Aug 19, 2021
- IBIDEN CO., LTD.
- Yasuki KIMISHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE
- Publication number 20210235583
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Min YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRAMICRO CIRCUIT BOARD BASED ON ULTRATHIN ADHESIVELESS FLEXIBLE C...
- Publication number 20210136922
- Publication date May 6, 2021
- SHENZHEN DANBOND TECHNOLOGY CO., LTD
- Ping LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Resin Films and Their Use in Layups
- Publication number 20210084776
- Publication date Mar 18, 2021
- Isola USA Corp.
- Johann R. Schumacher
- B32 - LAYERED PRODUCTS
Information Patent Application
DOPED, LOW-TEMPERATURE CO-FIRED GLASS-CERAMIC (LTCC) INSULATING SUB...
- Publication number 20200385304
- Publication date Dec 10, 2020
- QUALCOMM Incorporated
- Klaus Dieter Aichholzer
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
METHOD AND EQUIPMENT FOR THE TREATMENT OF PANELS
- Publication number 20200245467
- Publication date Jul 30, 2020
- WISE S.R.L.
- Massimo FIORANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASYMMETRIC ELECTRONIC SUBSTRATE AND METHOD OF MANUFACTURE
- Publication number 20200221577
- Publication date Jul 9, 2020
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE, WIRING BOARD, SUBSTRATE FOR WIRING BOARD, COPPER CLAD LA...
- Publication number 20200214126
- Publication date Jul 2, 2020
- KABUSHIKI KAISHA TOSHIBA
- Hajime NAKASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20200053864
- Publication date Feb 13, 2020
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Simon Sebanz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURED BODY AND MULTILAYERED SUBSTRATE
- Publication number 20200032059
- Publication date Jan 30, 2020
- SEKISUI CHEMICAL CO., LTD.
- Tatsushi Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20190394870
- Publication date Dec 26, 2019
- Shinko Electric Industries Co., Ltd.
- Kenichi Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING TRANSPARENT LIGHT EMITTING DEVICE BY USING...
- Publication number 20190350086
- Publication date Nov 14, 2019
- Seung Hwan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR HIGH-FREQUENCY PRINTED WIRING BOARD
- Publication number 20190215957
- Publication date Jul 11, 2019
- Sumitomo Electric Industries, Ltd.
- Shingo KAIMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE MODULE
- Publication number 20190150293
- Publication date May 16, 2019
- LUXVISIONS INNOVATION TECHNOLOGY LIMITED (GUANGZHOU) CO., LTD.
- JIANHUI CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Structure
- Publication number 20190150288
- Publication date May 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD, INSULATED CIRCUIT...
- Publication number 20190132956
- Publication date May 2, 2019
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED AND MULTILAYERED PRINTED CIRCUIT BOARD FABRICATION USI...
- Publication number 20190098771
- Publication date Mar 28, 2019
- Nano Dimension Technologies, LTD.
- Sharon Fima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20190098755
- Publication date Mar 28, 2019
- KYOCERA CORPORATION
- Tadashi WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Plater Arrangement for Failure-Free Copper Filling of a...
- Publication number 20190037703
- Publication date Jan 31, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ares Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE
- Publication number 20190021170
- Publication date Jan 17, 2019
- AGC Inc.
- Mamoru ISOBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT
- Publication number 20190008037
- Publication date Jan 3, 2019
- Sumitomo Electric Industries, Ltd.
- Kohei OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

After-treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hermetic metallized via with improved reliability

Substrate for high-frequency printed wiring board

Oxygen and humidity control in storage device

Multilayer printed wiring board and method of manufacturing the same

Method and equipment for the treatment of panels

Hermetic metallized via with improved reliability

Fabrication method of flexible electronic device

Method for producing a printed circuit board structure

Hermetic metallized via with improved reliability

Wiring substrate

Patterning and removal of circuit board material using ultrafast la...

Double-sided and multilayered printed circuit board fabrication usi...

Polydimethylsiloxane films and method of manufacture

Wiring substrate

Asymmetric electronic substrate and method of manufacture

Printed wiring board and method for manufacturing same

Method for manufacturing transparent light emitting device by using...

Structure, wiring board, substrate for wiring board, copper clad la...

Doped, low-temperature co-fired glass-ceramic (LTCC) insulating sub...

Fabrication method of circuit board

Method for manufacturing insulated circuit board, insulated circuit...

Cured body and multilayered substrate

Substrates for stretchable electronics and method of manufacture

Laminate production method

Laminate production method

Asymmetric electronic substrate and method of manufacture

Printed circuit board and electronic component

Glass substrate

Method of manufacturing a printed circuit board

Substrate and method for manufacturing the same

Patents Applicationslast 30 patents

HEAT SPREADER FOR MODIFIED EDGE COOLING

METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING SEMI-FLEX PRINTED CIRCUIT BOARD

OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE

WIRING SUBSTRATE

OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE

ULTRAMICRO CIRCUIT BOARD BASED ON ULTRATHIN ADHESIVELESS FLEXIBLE C...

Thin Resin Films and Their Use in Layups

DOPED, LOW-TEMPERATURE CO-FIRED GLASS-CERAMIC (LTCC) INSULATING SUB...

METHOD AND EQUIPMENT FOR THE TREATMENT OF PANELS

ASYMMETRIC ELECTRONIC SUBSTRATE AND METHOD OF MANUFACTURE

STRUCTURE, WIRING BOARD, SUBSTRATE FOR WIRING BOARD, COPPER CLAD LA...

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

CURED BODY AND MULTILAYERED SUBSTRATE

WIRING SUBSTRATE

METHOD FOR MANUFACTURING TRANSPARENT LIGHT EMITTING DEVICE BY USING...

SUBSTRATE FOR HIGH-FREQUENCY PRINTED WIRING BOARD

ELECTRONIC DEVICE MODULE

Circuit Board Structure

METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD, INSULATED CIRCUIT...

DOUBLE-SIDED AND MULTILAYERED PRINTED CIRCUIT BOARD FABRICATION USI...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

Method and Plater Arrangement for Failure-Free Copper Filling of a...

GLASS SUBSTRATE

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT