The invention relates to a printed circuit board structure comprising at least one insulation layer, at least one conductor layer, and at least one embedded component having a contact pad that has an outer barrier layer, in which printed circuit board structure at least two conductor paths/conductor layers are connected to at least two connections using vias.
The invention furthermore relates to a method for contacting a component embedded in a printed circuit board structure to a conductor segment by producing vias from a conductor layer to connections of the component.
According to the prior art, components are embedded in conductor structures and connected to conductors using copper vias. To this end, the contact pads of the components have copper connection pads that are built on a barrier layer, especially made of nickel. Such barrier layers are necessary to prevent copper from diffusing into adjacent layers, in the present case e.g. into an adhesion layer that comprises for instance titanium, titanium-tungsten, or chromium. In the case of semiconductors, such as e.g. a power MOSFET, disposed under the adhesion layer is a contact, made for instance of aluminum, for the drain or the gate of a MOSFET.
According to the prior art, metal connection pads, generally made of copper, are necessary at the connections of the components to permit proper connection of the connections to the conductors using copper vias. It is already possible to configure electronic and electronic components extremely thin, specifically on the order of magnitude of 20 μm, but due to such connection pads made of copper the thickness of the entire printed circuit board is relatively thick.
One object of the invention is to create a printed circuit board structure or a method for producing such, wherein the production costs may be lowered, it is possible to use even extremely thin components, e.g. a thickness on the order of magnitude of 20 μm, and the use of copper connections to the components to be embedded is not necessary.
This object is attained with a printed circuit board of the type cited in the foregoing and in which in accordance with the invention each via runs from a conductor path/conductor layer directly to the barrier contact layer of the corresponding connection of the component.
Thanks to the invention, the result is simplified production of printed circuit board structures that may also be designed to be extremely thin.
In useful embodiments, the material of the barrier contact layer is selected from the group of nickel, nickel-vanadium, platinum, palladium, and cobalt.
It is furthermore advantageous when the material of the barrier contact layer is nickel.
Embodiments in which the via comprises copper are cost effective and technologically simple to accomplish.
In reliable variants it is provided that arranged below the barrier contact layer is an adhesion layer, wherein the adhesion layer is advantageously selected from the group of titanium, titanium-tungsten, and chromium.
The invention's advantages are especially apparent when the component is a power component, wherein this may be an IGBT chip/MOSFET, or a power diode.
The invention advantageously leads to variants in which the printed circuit board structure is flexible, at least in segments.
The object is also attained with a method of the type cited in the foregoing in which in accordance with the invention, in the area of the connections of the components, at least one opening is produced in an outer conductor layer, which opening extends to a barrier layer of a connection, and then at least one via from the conductor path/conductor layer directly to the barrier layer of the corresponding connection of the component is produced.
In one advantageous variant it is provided that, for forming a copper layer on the surface and in the openings, currentless copper-plating is performed on at least one side of the printed circuit board structure.
It is furthermore useful when the at least one opening is produced by laser cutting.
It is also to be recommended that at least one opening is cleaned chemically prior to the production of the vias.
During the chemical cleaning step, it is useful to reduce the thickness of the barrier layer.
In one advantageous variant of the method it is provided that, after the currentless copper-plating, a mask is applied to the at least one side of the printed circuit board structure and then electrolytic copper-plating is conducted for producing at least one conductor layer and then the vias are produced and the mask be removed.
The invention and additional advantages are described in the following using exemplary embodiments that are illustrated in the drawings, wherein:
First
Provided for connecting to a conductor 7 or conductor layer, generally comprising copper, within a printed circuit board structure not shown until further below, from the conductor 7 to the connection 8 of the component 1, comprising contact 2, adhesion layer 3, barrier layer 4, and contact pad 5, is a via 9 that, as shall also be explained in greater detail below, is produced electrolytically. The connection between the conductor 7 and the connection 8 of the component 1 is thus produced using a “two-stage” copper connection, specifically, the via 9 and the copper contact pad 5.
In contrast,
In
At this point it should be noted that terms such as “top”, “bottom”, “upper”, “lower” and the like relate primarily to the drawings and are intended to simplify the description, but do not necessarily relate to any specific orientation of the described parts or their orientation in the production process.
The manufacture of an inventive printed circuit board structure is described in the following, referencing
In a first step, in accordance with
In the next step, as can be seen in
In another step, the openings 14, 15 are cleaned with hole cleaning processes known in the field of printed circuit boards, e.g. by chemical cleaning using potassium permanganate, and the thickness of all barrier layers 4d, 4g, 4s may be reduced by chemical dissolution of the barrier layers. It is possible to see the reduced thickness of the barrier layers 4d, 4g, 4s in
The result of a following step, in which currentless copper-plating is performed both on the top and on the bottom, is shown in
Although the description addresses copper layers, copper conductors, and the like, this shall in no way exclude the use of other suitable conductive materials, such as e.g. gold and silver.
With reference to
Once the mask 18 has been removed, the final result is the printed circuit board structure 21 that is illustrated in
Also visible in
In
The structure of the electrode contacting for the MOSFETs 23 and 24 and the control chip 25 is the same as illustrated in
In one embodiment depicted in the segment in accordance with
Because the invention makes it possible to keep the thickness of the printed circuit board structure very thin, it is also easily possible for the printed circuit board structure to be designed to be very flexible, at least in segments, wherein in this case polyimide, for instance, may be used as the material for the insulation layer.
Number | Date | Country | Kind |
---|---|---|---|
A 907/2013 | Nov 2013 | AT | national |
The current application is a divisional of U.S. application Ser. No. 15/039,372, filed May 25, 2016, now U.S. Pat. No. 10,219,384, which application is a national stage application No. PCT/AT2014/050239, filed Oct. 9, 2014, which application claims priority to Austrian Application No. A 907/2013, filed Nov. 27, 2013, the disclosures of which are hereby incorporated by reference in their entireties.
Number | Name | Date | Kind |
---|---|---|---|
4931134 | Hatkevitz et al. | Jun 1990 | A |
5206188 | Hiroi et al. | Apr 1993 | A |
5241456 | Marcinkiewicz et al. | Aug 1993 | A |
5561085 | Gorowitz et al. | Oct 1996 | A |
5645673 | Fasano et al. | Jul 1997 | A |
5730635 | De Haas et al. | Mar 1998 | A |
6005289 | Watanabe | Dec 1999 | A |
6120693 | Petti et al. | Sep 2000 | A |
6163049 | Bui | Dec 2000 | A |
6309912 | Chiou et al. | Oct 2001 | B1 |
6324067 | Nishiyama | Nov 2001 | B1 |
6442033 | Lu et al. | Aug 2002 | B1 |
6492726 | Ang | Dec 2002 | B1 |
6506632 | Cheng et al. | Jan 2003 | B1 |
6674159 | Peterson | Jan 2004 | B1 |
6687985 | Nishiyama | Feb 2004 | B2 |
6732428 | Kwong | May 2004 | B1 |
6815046 | Kumano | Nov 2004 | B2 |
6903458 | Nathan | Jun 2005 | B1 |
6919508 | Forcier | Jul 2005 | B2 |
7087991 | Chen et al. | Aug 2006 | B2 |
7154760 | Tsuchiya | Dec 2006 | B2 |
7282394 | Cho et al. | Oct 2007 | B2 |
7629204 | Hsu | Dec 2009 | B2 |
7705446 | Chia et al. | Apr 2010 | B2 |
7719104 | Hsu et al. | May 2010 | B2 |
7863735 | Cho et al. | Jan 2011 | B1 |
7894203 | Tsuda | Feb 2011 | B2 |
7947906 | Lee et al. | May 2011 | B2 |
7977579 | Bathan | Jul 2011 | B2 |
8049114 | Chen et al. | Nov 2011 | B2 |
8101868 | Ito et al. | Jan 2012 | B2 |
8130507 | Origuchi et al. | Mar 2012 | B2 |
8186045 | Sakamoto et al. | May 2012 | B2 |
8217509 | Horiuchi et al. | Jul 2012 | B2 |
8320135 | Ito et al. | Nov 2012 | B2 |
8354743 | Jensen | Jan 2013 | B2 |
8381394 | Shizuno | Feb 2013 | B2 |
8400776 | Sahara et al. | Mar 2013 | B2 |
8547701 | Tuominen et al. | Oct 2013 | B2 |
8563358 | Landesberger et al. | Oct 2013 | B2 |
8642465 | Schimetta et al. | Feb 2014 | B2 |
8736065 | Gonzalez et al. | May 2014 | B2 |
8785788 | Shimizu et al. | Jul 2014 | B2 |
8789271 | Zluc et al. | Jul 2014 | B2 |
8829357 | Mikado et al. | Sep 2014 | B2 |
8914974 | Lenhardt et al. | Dec 2014 | B2 |
9159693 | Choi | Oct 2015 | B2 |
9179553 | Suzuki | Nov 2015 | B2 |
9418930 | Stahr et al. | Aug 2016 | B2 |
9560769 | Shimabe et al. | Jan 2017 | B2 |
9648758 | Gotzinger et al. | May 2017 | B2 |
9713248 | Langer et al. | Jul 2017 | B2 |
9763337 | Jager et al. | Sep 2017 | B2 |
9781845 | Stahr et al. | Oct 2017 | B2 |
9820381 | Wang et al. | Nov 2017 | B2 |
10187997 | Weidinger et al. | Jan 2019 | B2 |
10219384 | Stahr et al. | Feb 2019 | B2 |
10779413 | Schwarz et al. | Sep 2020 | B2 |
20020036100 | Slemmons et al. | Mar 2002 | A1 |
20030015342 | Sakamoto et al. | Jan 2003 | A1 |
20030090883 | Asahi et al. | May 2003 | A1 |
20040014317 | Sakamoto et al. | Jan 2004 | A1 |
20040114652 | Yoshikawa | Jun 2004 | A1 |
20040168825 | Sakamoto et al. | Sep 2004 | A1 |
20040170766 | Inoue et al. | Sep 2004 | A1 |
20040233650 | Miyashita et al. | Nov 2004 | A1 |
20050017347 | Morimoto et al. | Jan 2005 | A1 |
20050048759 | Hsu | Mar 2005 | A1 |
20050103522 | Grundy et al. | May 2005 | A1 |
20050189640 | Grundy et al. | Sep 2005 | A1 |
20050190537 | Rossi et al. | Sep 2005 | A1 |
20050233122 | Nishimura et al. | Oct 2005 | A1 |
20060008970 | Oggioni et al. | Jan 2006 | A1 |
20060049530 | Hsu et al. | Mar 2006 | A1 |
20060101638 | Germann et al. | May 2006 | A1 |
20060120056 | Sasaki | Jun 2006 | A1 |
20060193108 | Usui et al. | Aug 2006 | A1 |
20060198570 | Ogawa et al. | Sep 2006 | A1 |
20060222285 | Minamio et al. | Oct 2006 | A1 |
20060231950 | Yoon | Oct 2006 | A1 |
20060278967 | Tuominen et al. | Dec 2006 | A1 |
20070069352 | Ho et al. | Mar 2007 | A1 |
20070131349 | Tuominen et al. | Jun 2007 | A1 |
20070166886 | Iihola et al. | Jul 2007 | A1 |
20080067666 | Hsu | Mar 2008 | A1 |
20080192443 | Hatanaka et al. | Aug 2008 | A1 |
20080192450 | Tuominen et al. | Aug 2008 | A1 |
20080196931 | Lee et al. | Aug 2008 | A1 |
20080202801 | Tuominen et al. | Aug 2008 | A1 |
20080264687 | Park et al. | Oct 2008 | A1 |
20080283491 | Arai et al. | Nov 2008 | A1 |
20080296056 | Kinoshita et al. | Dec 2008 | A1 |
20090001609 | Lim | Jan 2009 | A1 |
20090014749 | Matsuda et al. | Jan 2009 | A1 |
20090026168 | Tsai et al. | Jan 2009 | A1 |
20090194318 | Yeon et al. | Aug 2009 | A1 |
20090205859 | Tanaka et al. | Aug 2009 | A1 |
20090241333 | He et al. | Oct 2009 | A1 |
20090277673 | Sohn et al. | Nov 2009 | A1 |
20090293271 | Tanaka | Dec 2009 | A1 |
20100018761 | Wang et al. | Jan 2010 | A1 |
20100019368 | Shin | Jan 2010 | A1 |
20100084175 | Suzuki et al. | Apr 2010 | A1 |
20100170703 | Iihola et al. | Jul 2010 | A1 |
20100252303 | Chang et al. | Oct 2010 | A1 |
20100282498 | Tezak et al. | Nov 2010 | A1 |
20110089531 | Hillman et al. | Apr 2011 | A1 |
20110127076 | Jeong et al. | Jun 2011 | A1 |
20110127675 | Ewe et al. | Jun 2011 | A1 |
20110183093 | Wada | Jul 2011 | A1 |
20110198018 | Schrittwieser et al. | Aug 2011 | A1 |
20110203836 | Yokota et al. | Aug 2011 | A1 |
20110212274 | Selsley et al. | Sep 2011 | A1 |
20110215464 | Guzek et al. | Sep 2011 | A1 |
20110259630 | Park | Oct 2011 | A1 |
20110272177 | Weichslberger et al. | Nov 2011 | A1 |
20110284267 | Chang | Nov 2011 | A1 |
20110290408 | Samejima et al. | Dec 2011 | A1 |
20110290546 | Lee et al. | Dec 2011 | A1 |
20110304998 | Lin | Dec 2011 | A1 |
20110317381 | Kim et al. | Dec 2011 | A1 |
20120048605 | Chung | Mar 2012 | A1 |
20120091594 | Landesberger et al. | Apr 2012 | A1 |
20120153493 | Lee et al. | Jun 2012 | A1 |
20120181074 | Ishihara et al. | Jul 2012 | A1 |
20120247819 | Tsuyutani et al. | Oct 2012 | A1 |
20130146991 | Otremba et al. | Jun 2013 | A1 |
20130153269 | Takahashi et al. | Jun 2013 | A1 |
20130256884 | Meyer | Oct 2013 | A1 |
20140000941 | Weidinger et al. | Jan 2014 | A1 |
20140120291 | Kim et al. | May 2014 | A1 |
20140227834 | Karpman | Aug 2014 | A1 |
20140254119 | Im | Sep 2014 | A1 |
20150007934 | Götzinger et al. | Jan 2015 | A1 |
20150157862 | Greenberg et al. | Jun 2015 | A1 |
20150189763 | Schrittwieser | Jul 2015 | A1 |
20150334833 | Wang et al. | Nov 2015 | A1 |
20150334841 | Schmid et al. | Nov 2015 | A1 |
20150334844 | Shimabe et al. | Nov 2015 | A1 |
20150342062 | Jäger et al. | Nov 2015 | A1 |
20160021763 | Stahr et al. | Jan 2016 | A1 |
20160133558 | Stahr et al. | May 2016 | A1 |
20160324004 | Schwarz et al. | Nov 2016 | A1 |
20160353566 | Ianger et al. | Dec 2016 | A1 |
20170034923 | Lin et al. | Feb 2017 | A1 |
20170048984 | Weidinger et al. | Feb 2017 | A1 |
20170164481 | Stahr et al. | Jun 2017 | A1 |
20190082543 | Weidinger et al. | Mar 2019 | A1 |
20200323081 | Schwarz et al. | Oct 2020 | A1 |
Number | Date | Country |
---|---|---|
13434 | Dec 2013 | AT |
100525591 | Aug 2009 | CN |
102293070 | Dec 2011 | CN |
103199069 | Jul 2013 | CN |
203072246 | Jul 2013 | CN |
19642488 | Apr 1998 | DE |
20021698 | Apr 2001 | DE |
20221189 | Jun 2005 | DE |
102006009723 | Sep 2007 | DE |
102008025223 | Dec 2008 | DE |
102008040906 | Feb 2010 | DE |
102010042567 | Mar 2012 | DE |
195935 | Oct 1986 | EP |
275433 | Jul 1988 | EP |
1225629 | Jul 2002 | EP |
1304742 | Apr 2003 | EP |
1424731 | Jun 2004 | EP |
2119327 | Oct 2011 | EP |
2822338 | Sep 2002 | FR |
2485087 | May 2012 | GB |
11150368 | Jun 1999 | JP |
2003031914 | Jan 2003 | JP |
2003198133 | Jul 2003 | JP |
2004031682 | Jan 2004 | JP |
2005333109 | Dec 2005 | JP |
2007189006 | Jul 2007 | JP |
2007318090 | Dec 2007 | JP |
2010206124 | Sep 2010 | JP |
2011138873 | Jul 2011 | JP |
2012044102 | Mar 2012 | JP |
2012151359 | Aug 2012 | JP |
101253514 | Apr 2013 | KR |
1998020530 | May 1998 | WO |
2003092344 | Nov 2003 | WO |
2005020651 | Mar 2005 | WO |
2005104636 | Nov 2005 | WO |
2006013230 | Feb 2006 | WO |
2006134217 | Dec 2006 | WO |
2007087660 | Aug 2007 | WO |
2008098271 | Aug 2008 | WO |
2008104324 | Sep 2008 | WO |
2009143550 | Dec 2009 | WO |
2010048654 | May 2010 | WO |
2010085830 | Aug 2010 | WO |
2011088489 | Jul 2011 | WO |
2011099820 | Aug 2011 | WO |
2012016258 | Feb 2012 | WO |
2012065202 | May 2012 | WO |
2012100274 | Aug 2012 | WO |
2013029073 | Mar 2013 | WO |
2013029074 | Mar 2013 | WO |
2014131071 | Sep 2014 | WO |
2014197917 | Dec 2014 | WO |
2015077808 | Jun 2015 | WO |
2015085342 | Jun 2015 | WO |
2015113088 | Aug 2015 | WO |
2015127489 | Sep 2015 | WO |
Entry |
---|
Austrian Search Report for Application No. A 740/2012, Filing Date Jul. 7, 2012, Search Completed May 3, 2013, 2 pgs. |
International Preliminary Report on Patentability for International Application No. PCT/AT2013/000029, Report issued Aug. 26, 2014, dated Sep. 4, 2014, 13 Pgs. |
International Preliminary Report on Patentability for International Application No. PCT/AT2013/050128, Report completed Sep. 16, 2014, 11 Pgs. |
International Preliminary Report on Patentability for International Application No. PCT/AT2013/050249, Report issued Jun. 30, 2015, dated Jul. 9, 2015, 6 Pgs. |
International Preliminary Report on Patentability for International Application No. PCT/AT2013/050260, Report issued Mar. 27, 2015, dated Mar. 27, 2015, 8 Pgs. |
International Preliminary Report on Patentability for International Application No. PCT/AT2013/050262, Report issued Mar. 11, 2015, dated Mar. 11, 2015, 14 Pgs. |
International Preliminary Report on Patentability for International Application No. PCT/AT2014/050239, Report issued Mar. 1, 2016, dated Jun. 1, 2016, 9 Pgs. |
International Preliminary Report on Patentability for International Application PCT/AT2014/050044, Report Completed Jun. 23, 2015, dated Jun. 23, 2015, 18 Pgs. |
International Preliminary Report on Patentability for International Application PCT/AT2014/050113, Report issued Aug. 28, 2015, dated Aug. 28, 2015, 8 Pgs. |
International Preliminary Report on Patentability for International Application PCT/AT2014/050300, Report issued Oct. 10, 2015, dated Mar. 23, 2016, 9 Pgs. |
International Preliminary Report on Patentability for International Application PCT/AT2015/050019, Report issued Aug. 2, 2016, dated Aug. 11, 2016, 8 Pgs. |
International Preliminary Report on Patentability for International Application PCT/AT2015/050052, Report issued Jun. 6, 2016, dated Dec. 23, 2015, 16 Pgs. |
International Search Report for International Application No. PCT/AT2014/050300, Search completed Mar. 13, 2015, dated Mar. 23, 2015, 3 Pgs. |
International Search Report and Written Opinion for International Application No. PCT/AT2013/050262, Search completed Mar. 18, 2014, dated Mar. 27, 2014, 9 Pgs. |
International Search Report and Written Opinion for International Application No. PCT/AT2014/050044, Search completed May 9, 2014, dated May 20, 2014, 9 Pgs. |
International Search Report and Written Opinion for International Application No. PCT/AT2014/050239, Search completed Feb. 2, 2015, dated Feb. 9, 2015, 8 Pgs. |
International Search Report and Written Opinion for International Application No. PCT/AT2015/050019, Search completed Apr. 23, 2015, dated May 27, 2015, 9 Pgs. |
International Search Report and Written Opinion for International Application No. PCT/AT2015/050052, Search completed May 26, 2015, dated Jun. 2, 2015, 10 Pgs. |
International Search Report for International Application No. PCT/AT2013/050128, International Filing Date Jun. 25, 2013, Search Completed Oct. 23, 2013, dated Nov. 26, 2013, 6 pgs. |
International Search Report for International Application No. PCT/AT2013/050249, Search completed Apr. 1, 2014, dated Sep. 4, 2014, 4 Pgs. |
International Search Report for International Application No. PCT/AT2013/050260, Search completed Apr. 29, 2014, dated May 13, 2014, 4 Pgs. |
International Search Report for International Application PCT/AT2013/000029, completed May 31, 2013, dated Jun. 7, 2013, 6 pgs. |
International Search Report for International Application PCT/AT2014/050113, Report completed Aug. 22, 2014, dated Aug. 28, 2014, 3 Pgs. |
Written Opinion for International Application No. PCT/AT2013/050128, Search Completed Oct. 23, 2013, dated Nov. 26, 2013, 5 pgs. |
Written Opinion for International Application No. PCT/AT2013/050249, Search completed Apr. 1, 2014, dated Sep. 4, 2014, 5 Pgs. |
Written Opinion for International Application No. PCT/AT2013/050260, Search completed Apr. 29, 2014, dated May 13, 2014, 4 Pgs. |
Written Opinion for International Application No. PCT/AT2014/050300, Search completed Mar. 13, 2015, dated Mar. 23, 2015, 7 Pgs. |
Written Opinion for International Application PCT/AT2013/000029, completed May 31, 2013, dated Jun. 7, 2013, 5 pgs. |
Written Opinion for International Application PCT/AT2014/050113, Report completed Aug. 22, 2014, dated Aug. 28, 2014, 6 Pgs. |
Charboneau, B C et al. , “Double-Sided Liquid Cooling for Power Semiconductor Devices Using Embedded Power Packaging”, IEEE Transactions on Industry Applications, IEEE Service Center, vol. 44, No. 5, Sep. 1, 2008, pp. 1645-1655, XP011446042, ISSN: 0093-994, DOI: 10.1109/TIA.2008.2002270. |
Jian, Yin, “High Temperature SiC Embedded Chip Module (ECM) with Double-sided Metallization Structure”, Jan. 3, 2006, XP055135318, Gefunden im Internet: URL:http://hdl.handle.net/ 10919/30076. |
Mital et al., “Thermal Design Methodology for an Embedded Power Electronic Module Using Double-Sided Microchannel Cooling”, Journal of Electric Packaging, ASME International, US, vol. 130, No. 3, Sep. 1, 2008, XP008171354, DOI: 10.1115/1.2957320, Retrieved on Jul. 29, 2008. |
Pang, Y et al., “Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module”, Journal of Electronic Packaging, ASME International, US, vol. 129, No. 1, Mar. 1, 2007, pp. 1-8, XP008171355, ISSN: 1 043-7398, DOI: 1 0.1115/1.2429703. |
Number | Date | Country | |
---|---|---|---|
20190150288 A1 | May 2019 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 15039372 | US | |
Child | 16225567 | US |