Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger

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CPC
H05K7/206

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/206Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Hazardous location cooling system and method for use thereof
- Patent number RE50310
- Issue date Feb 18, 2025
- Ice Qube, Inc.
- Justin Greubel
Information Patent Grant
Coolant distribution unit and control methods
- Patent number 12,225,688
- Issue date Feb 11, 2025
- Hoffman Enclosures Inc.
- Matthew R. Archibald
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device for securing and releasing a first module and a second modul...
- Patent number 12,218,402
- Issue date Feb 4, 2025
- Huawei Technologies Co., Ltd.
- Niklas Lekselius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular heat-transfer systems
- Patent number 12,213,289
- Issue date Jan 28, 2025
- Coolit Systems, Inc.
- Geoff Sean Lyon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airflow guiding mechanism and electronic device
- Patent number 12,207,448
- Issue date Jan 21, 2025
- Wistron Corporation
- Yu-Chia Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid liquid cooling system for a computing rack
- Patent number 12,200,912
- Issue date Jan 14, 2025
- ZT GROUP INT'L, INC.
- Andrew Lafayette McAnally
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooling structure and liquid cooling system including the li...
- Patent number 12,181,230
- Issue date Dec 31, 2024
- SK hynix Inc.
- Nam Hyeon Choi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Localized immersion cooling enclosure with thermal efficiency features
- Patent number 12,156,372
- Issue date Nov 26, 2024
- Cisco Technology, Inc.
- M. Baris Dogruoz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for using additive manufacturing for thermal ma...
- Patent number 12,150,279
- Issue date Nov 19, 2024
- General Electric Company
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Composite cooling system and data center
- Patent number 12,127,367
- Issue date Oct 22, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Jinliang Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Container for one or more electronic devices and methods of use the...
- Patent number 12,120,847
- Issue date Oct 15, 2024
- Engendren LLC
- Alan Paul Meissner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cooling system in electronics cabinet comprising thermally coupled...
- Patent number 12,096,602
- Issue date Sep 17, 2024
- Pfannenberg GmbH
- Russell Fuller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for cryptocurrency mining center
- Patent number 12,086,879
- Issue date Sep 10, 2024
- BITMAINTECH PTE. LTD.
- Tao Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling servers with velocity augmentation using partial by-pass ai...
- Patent number 12,069,839
- Issue date Aug 20, 2024
- DYNAMIC DATA CENTERS SOLUTIONS, INC.
- Mark David Ortenzi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation system and an associated method thereof
- Patent number 11,997,839
- Issue date May 28, 2024
- GE Grid Solutions LLC
- Alistair Martin Waddell
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adaptive cascade cooling method for datacenters
- Patent number 11,991,866
- Issue date May 21, 2024
- Hewlett Packard Enterprise Development LP
- Munther Salim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling systems and methods using single-phase fluid
- Patent number 11,940,227
- Issue date Mar 26, 2024
- Inertech IP LLC
- Ming Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooling server deployment and delivery apparatus and operation
- Patent number 11,943,900
- Issue date Mar 26, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for cooling a fluid circuit for cooling a rack...
- Patent number 11,937,405
- Issue date Mar 19, 2024
- Quanta Computer Inc.
- Chao-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plug-in pump installation structure of cooling distribution unit
- Patent number 11,930,619
- Issue date Mar 12, 2024
- Ablecom Technology Inc.
- Chien-Fa Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for electronics cooling
- Patent number 11,895,805
- Issue date Feb 6, 2024
- Eagle Technology, LLC
- Donald S. George
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system of electronic systems, in particular for data centre
- Patent number 11,871,546
- Issue date Jan 9, 2024
- WIELAND PROVIDES SRL
- Franco Provenziani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat transfer interfaces for circuit card assembly (CCA) modules
- Patent number 11,839,061
- Issue date Dec 5, 2023
- Hamilton Sundstrand Corporation
- Alexander Trotman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 11,832,396
- Issue date Nov 28, 2023
- Google LLC
- Madhusudan Krishnan Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid cooling system for electronic racks
- Patent number 11,825,628
- Issue date Nov 21, 2023
- BAIDU USA LLC
- Shuai Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bidirectional connector for server liquid cooling
- Patent number 11,792,959
- Issue date Oct 17, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling arrangement for a rack hosting electronic equipment and at...
- Patent number 11,765,864
- Issue date Sep 19, 2023
- OVH
- Ali Chehade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-activated multiphase fluid-operated pump for electronics waste...
- Patent number 11,737,240
- Issue date Aug 22, 2023
- Hamfop Technologies LLC
- Mudasir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unified control of cooling in computers
- Patent number 11,729,940
- Issue date Aug 15, 2023
- Oracle International Corporation
- Matthew T. Gerdes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for servicing and controlling a leak segregation...
- Patent number 11,711,908
- Issue date Jul 25, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COOLING SERVERS WITH VELOCITY AUGMENTATION USING PARTIAL BY-PASS AI...
- Publication number 20250056768
- Publication date Feb 13, 2025
- Dynamic Data Centers Solutions, Inc.
- Mark David Ortenzi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MA...
- Publication number 20250048594
- Publication date Feb 6, 2025
- GENERAL ELECTRIC COMPANY
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIQUID-TO-LIQUID RACK MOUNTED HEAT EXCHANGER
- Publication number 20250040099
- Publication date Jan 30, 2025
- QUANTA COMPUTER INC.
- Chao-Jung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE IMMERSION COOLING SYSTEM
- Publication number 20250024638
- Publication date Jan 16, 2025
- Vertiv Corporation
- Russell Tipton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR REPLACING THE LIQUID IN A COOLING CIRCUIT OF A SUPERCOMP...
- Publication number 20240431072
- Publication date Dec 26, 2024
- BULL SAS
- Arnaud HILT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sealed Rack Server Unit
- Publication number 20240407139
- Publication date Dec 5, 2024
- Nexalus Limited
- Richard Jenkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealed Rack Server Unit
- Publication number 20240407140
- Publication date Dec 5, 2024
- Nexalus Limited
- Richard Jenkins
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEMS AND METHODS USING SINGLE-PHASE FLUID
- Publication number 20240384936
- Publication date Nov 21, 2024
- Inertech IP LLC
- Ming Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Switchgear Cabinet for Power Electronics
- Publication number 20240381592
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Martin Kautz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MIXED-WIDTH CIRCUIT CARD ASSEMBLY THERMAL CHIMNEY
- Publication number 20240377867
- Publication date Nov 14, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Alexander Trotman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTAINER DATA CENTER
- Publication number 20240381580
- Publication date Nov 14, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-INVERTER ASSEMBLY
- Publication number 20240341052
- Publication date Oct 10, 2024
- Delta Electronics, Inc.
- Kang-Yu Fan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HYBRID LIQUID COOLING SYSTEM FOR A COMPUTING RACK
- Publication number 20240251529
- Publication date Jul 25, 2024
- ZT Group Int’l, Inc. dba ZT Systems
- Andrew Lafayette McAnally
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART RACK LIQUID COOLING MANIFOLD SYSTEM HAVING INTEGRATED CONTROL...
- Publication number 20240237297
- Publication date Jul 11, 2024
- STRATEGIC THERMAL LABS, LLC
- AUSTIN SHELNUTT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION APPARATUS AND SERVER
- Publication number 20240237295
- Publication date Jul 11, 2024
- Huawei Technologies Co., Ltd
- Weiming Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAYED COLD PLATE FOR DIMMS
- Publication number 20240237296
- Publication date Jul 11, 2024
- QUANTA COMPUTER INC.
- Chao-Jung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COMPACT LIQUID COOLING UNIT AND ENERGY STORAGE CONTAINER
- Publication number 20240224472
- Publication date Jul 4, 2024
- Shenzhen Envicool Technology Co., Ltd.
- Honghao ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-MODE DATACENTER COOLING SYSTEM
- Publication number 20240215205
- Publication date Jun 27, 2024
- NVIDIA Corporation
- Pardeep Shahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING HEAT DISSIPATION STRUCTURE BASED ON DUAL COOLING PATHS
- Publication number 20240196563
- Publication date Jun 13, 2024
- Huawei Technologies Co., Ltd
- Hui JIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems And Methods For Cooling A Fluid Circuit For Cooling A Rack...
- Publication number 20240179875
- Publication date May 30, 2024
- QUANTA COMPUTER INC.
- Chao-Jung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLD PLATE PLACEMENT AND RETRACTION APPARATUS WITH PREDEFINED TRAVE...
- Publication number 20240155796
- Publication date May 9, 2024
- International Business Machines Corporation
- Madhana Sunder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INVERTER AND INTEGRATED PLATFORM HAVING SAME
- Publication number 20240147649
- Publication date May 2, 2024
- Sungrow Power Supply Co., Ltd.
- Xiaohu Wang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SMART RACK LIQUID COOLING MANIFOLD SYSTEM HAVING INTEGRATED CONTROL...
- Publication number 20240138118
- Publication date Apr 25, 2024
- STRATEGIC THERMAL LABS, LLC
- AUSTIN SHELNUTT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTIVE CASCADE COOLING METHOD FOR DATACENTERS
- Publication number 20240130089
- Publication date Apr 18, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Munther Salim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ELECTRONICS COOLING
- Publication number 20240107710
- Publication date Mar 28, 2024
- Eagle Technology, LLC
- Donald S. George
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEBRIS-RESISTANT COOLING PATH
- Publication number 20240074088
- Publication date Feb 29, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Alexander Trotman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEBRIS-RESISTANT COOLING PATH
- Publication number 20240074090
- Publication date Feb 29, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Alexander Trotman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLUG-IN PUMP INSTALLATION STRUCTURE OF COOLING DISTRIBUTION UNIT
- Publication number 20240057285
- Publication date Feb 15, 2024
- ABLECOM TECHNOLOGY INC.
- Chien-Fa LIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR TUNING VALVES OF A LIQUID MANIFOLD
- Publication number 20240057288
- Publication date Feb 15, 2024
- Dell Products L.P.
- Richard M. EILAND
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid cooling high-density pluggable modules for a network element
- Publication number 20240049434
- Publication date Feb 8, 2024
- CIENA CORPORATION
- Behzad Mohajer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hazardous location cooling system and method for use thereof

Coolant distribution unit and control methods

Device for securing and releasing a first module and a second modul...

Modular heat-transfer systems

Airflow guiding mechanism and electronic device

Hybrid liquid cooling system for a computing rack

Liquid cooling structure and liquid cooling system including the li...

Localized immersion cooling enclosure with thermal efficiency features

Systems and methods for using additive manufacturing for thermal ma...

Composite cooling system and data center

Container for one or more electronic devices and methods of use the...

Cooling system in electronics cabinet comprising thermally coupled...

Method and system for cryptocurrency mining center

Cooling servers with velocity augmentation using partial by-pass ai...

Heat dissipation system and an associated method thereof

Adaptive cascade cooling method for datacenters

Cooling systems and methods using single-phase fluid

Liquid cooling server deployment and delivery apparatus and operation

Systems and methods for cooling a fluid circuit for cooling a rack...

Plug-in pump installation structure of cooling distribution unit

Systems and methods for electronics cooling

Cooling system of electronic systems, in particular for data centre

Heat transfer interfaces for circuit card assembly (CCA) modules

Cooling electronic devices in a data center

Hybrid cooling system for electronic racks

Bidirectional connector for server liquid cooling

Cooling arrangement for a rack hosting electronic equipment and at...

Heat-activated multiphase fluid-operated pump for electronics waste...

Unified control of cooling in computers

System and method for servicing and controlling a leak segregation...

Patents Applicationslast 30 patents

COOLING SERVERS WITH VELOCITY AUGMENTATION USING PARTIAL BY-PASS AI...

SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MA...

LIQUID-TO-LIQUID RACK MOUNTED HEAT EXCHANGER

TWO-PHASE IMMERSION COOLING SYSTEM

METHOD FOR REPLACING THE LIQUID IN A COOLING CIRCUIT OF A SUPERCOMP...

Sealed Rack Server Unit

Sealed Rack Server Unit

COOLING SYSTEMS AND METHODS USING SINGLE-PHASE FLUID

Switchgear Cabinet for Power Electronics

MIXED-WIDTH CIRCUIT CARD ASSEMBLY THERMAL CHIMNEY

CONTAINER DATA CENTER

DUAL-INVERTER ASSEMBLY

HYBRID LIQUID COOLING SYSTEM FOR A COMPUTING RACK

SMART RACK LIQUID COOLING MANIFOLD SYSTEM HAVING INTEGRATED CONTROL...

HEAT DISSIPATION APPARATUS AND SERVER

ARRAYED COLD PLATE FOR DIMMS

COMPACT LIQUID COOLING UNIT AND ENERGY STORAGE CONTAINER

DUAL-MODE DATACENTER COOLING SYSTEM

LIQUID COOLING HEAT DISSIPATION STRUCTURE BASED ON DUAL COOLING PATHS

Systems And Methods For Cooling A Fluid Circuit For Cooling A Rack...

COLD PLATE PLACEMENT AND RETRACTION APPARATUS WITH PREDEFINED TRAVE...

INVERTER AND INTEGRATED PLATFORM HAVING SAME

SMART RACK LIQUID COOLING MANIFOLD SYSTEM HAVING INTEGRATED CONTROL...

ADAPTIVE CASCADE COOLING METHOD FOR DATACENTERS

SYSTEMS AND METHODS FOR ELECTRONICS COOLING

DEBRIS-RESISTANT COOLING PATH

DEBRIS-RESISTANT COOLING PATH

PLUG-IN PUMP INSTALLATION STRUCTURE OF COOLING DISTRIBUTION UNIT

SYSTEMS AND METHODS FOR TUNING VALVES OF A LIQUID MANIFOLD

Liquid cooling high-density pluggable modules for a network element