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SEMICONDUCTOR PACKAGES
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Publication number 20240162181
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Publication date May 16, 2024
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Samsung Electronics Co., Ltd.
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Sun Jae KIM
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H01 - BASIC ELECTRIC ELEMENTS
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Integrated Circuit Package and Method
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Publication number 20240021488
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Publication date Jan 18, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Sey-Ping Sun
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRICAL INTERCONNECT BRIDGE
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Publication number 20230361043
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Publication date Nov 9, 2023
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Intel Corporation
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Srinivas V. Pietambaram
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP-SCALE PACKAGE
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Publication number 20230230892
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Publication date Jul 20, 2023
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NEXPERIA B.V.
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Regnerus Hermannus Poelma
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H01 - BASIC ELECTRIC ELEMENTS
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LOW STRESS DIRECT HYBRID BONDING
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Publication number 20230197655
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Publication date Jun 22, 2023
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Jeremy Alfred Theil
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20230062835
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Publication date Mar 2, 2023
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KIOXIA Corporation
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Takuya KONNO
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H01 - BASIC ELECTRIC ELEMENTS
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FILM STRUCTURE FOR BOND PAD
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Publication number 20220254744
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Publication date Aug 11, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Julie Yang
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H01 - BASIC ELECTRIC ELEMENTS
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FILM STRUCTURE FOR BOND PAD
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Publication number 20210098398
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Publication date Apr 1, 2021
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Taiwan Semiconductor Manufacturing Co., LTD
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Julie Yang
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H01 - BASIC ELECTRIC ELEMENTS
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LAMINATE AND ELECTRONIC DEVICE
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Publication number 20200388551
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Publication date Dec 10, 2020
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Sekisui Chemical Co., Ltd
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Kouji ASHIBA
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRICAL INTERCONNECT BRIDGE
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Publication number 20200350251
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Publication date Nov 5, 2020
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Intel Corporation
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Srinivas V. Pietambaram
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE STRUCTURE
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Publication number 20190363066
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Publication date Nov 28, 2019
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Taiwan Semiconductor Manufacturing company Ltd.
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JENG-NAN HUNG
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H01 - BASIC ELECTRIC ELEMENTS
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