Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

Industry

CPC
H05K3/4638

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4638Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Via bond attachment
- Patent number 11,950,378
- Issue date Apr 2, 2024
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Misalignment measuring apparatus and misalignment measuring method
- Patent number 11,776,112
- Issue date Oct 3, 2023
- Kioxia Corporation
- Yuki Watanabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compensating misalignment of component carrier feature by modifying...
- Patent number 11,778,751
- Issue date Oct 3, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and systems for aligning a component
- Patent number 11,711,898
- Issue date Jul 25, 2023
- Google LLC
- Douglas Raymond Dykaar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board automated layup system
- Patent number 11,653,484
- Issue date May 16, 2023
- Raytheon Company
- Mikhail Pevzner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Manufacturing method of multilayer printed circuit boards
- Patent number 11,252,823
- Issue date Feb 15, 2022
- Tadco, Inc. LLC
- Philip Martin Widner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 11,240,915
- Issue date Feb 1, 2022
- Lincstech Co., Ltd.
- Masahiro Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for manufacturing flexible laminated circuit boards
- Patent number 11,229,126
- Issue date Jan 18, 2022
- Duetto Integrated Systems, Inc.
- Anthony Faraci
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coil component
- Patent number 11,107,620
- Issue date Aug 31, 2021
- Sumida Corporation
- Tomoyuki Kanno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carriers sandwiching a sacrificial structure and having p...
- Patent number 11,051,410
- Issue date Jun 29, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sacrificial structure with dummy core and two sections of separate...
- Patent number 10,973,133
- Issue date Apr 6, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transponder fabrication methods
- Patent number 10,839,279
- Issue date Nov 17, 2020
- Sriram Manivannan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package substrate and package structure
- Patent number 10,818,584
- Issue date Oct 27, 2020
- Dyi-Chung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board via hole registration and accuracy
- Patent number 10,811,210
- Issue date Oct 20, 2020
- Sanmina Corporation
- Shinichi Iketani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for detecting ion migration
- Patent number 10,779,416
- Issue date Sep 15, 2020
- Hyundai Mobis Co., Ltd.
- Jae Hyun Park
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing multilayer substrate
- Patent number 10,766,238
- Issue date Sep 8, 2020
- DENSO CORPORATION
- Yoshihito Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-layered substrate manufacturing method
- Patent number 10,714,351
- Issue date Jul 14, 2020
- Nikon Corporation
- Hidehiro Maeda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Composite substrate, method of manufacturing composite substrate, a...
- Patent number 10,701,805
- Issue date Jun 30, 2020
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical waveguide having aluminum nitride thin film
- Patent number 10,667,388
- Issue date May 26, 2020
- II-VI Delaware Inc.
- Henry Meyer Daghighian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for manufacturing flexible laminated circuit boards
- Patent number 10,638,615
- Issue date Apr 28, 2020
- Duetto Integrated Systems, Inc.
- Anthony Faraci
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum nitride substrate with graphite foil
- Patent number 10,470,302
- Issue date Nov 5, 2019
- Finisar Corporation
- Henry Meyer Daghighian
- G02 - OPTICS
Information Patent Grant
Multilayer printed circuit board via hole registration and accuracy
- Patent number 10,446,356
- Issue date Oct 15, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 10,321,558
- Issue date Jun 11, 2019
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Nikolai Haslebner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuses with integrated metals
- Patent number 10,276,337
- Issue date Apr 30, 2019
- Littelfuse, Inc.
- Michael Doering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and manufacturing method thereof
- Patent number 10,123,413
- Issue date Nov 6, 2018
- Subtron Technology Co., Ltd.
- Chih-Hong Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing same
- Patent number 10,051,740
- Issue date Aug 14, 2018
- Ibiden Co., Ltd.
- Kazuki Kajihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective segment via plating process and structure
- Patent number 9,867,290
- Issue date Jan 9, 2018
- Multek Technologies Limited
- Kwan Pen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool, method and machine for manufacturing multi-layer printed circ...
- Patent number 9,826,644
- Issue date Nov 21, 2017
- Chemplate Materials, S.L.
- Victor Lazaro Gallego
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective segment via plating process and structure
- Patent number 9,763,327
- Issue date Sep 12, 2017
- Multek Technologies Limited
- Kwan Pen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a multilayer element
- Patent number 9,728,706
- Issue date Aug 8, 2017
- EPCOS AG
- Georg Kuegerl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SURFACE TENSION DRIVEN FLEXIBLE ELECTRONICS TRANSFER PRINTING METHOD
- Publication number 20240215152
- Publication date Jun 27, 2024
- DALIAN UNIVERSITY OF TECHNOLOGY
- Ming LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Via Bond attachment
- Publication number 20230053225
- Publication date Feb 16, 2023
- Harbor Electronics, Inc.
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compensating Misalignment of Component Carrier Feature by Modifying...
- Publication number 20210174494
- Publication date Jun 10, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MANUFACTURING METHOD OF MULTILAYER PRINTED CIRCUIT BOARDS
- Publication number 20210007228
- Publication date Jan 7, 2021
- Tadco, Inc. LLC
- Philip Martin Widner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR ALIGNING A COMPONENT
- Publication number 20200288581
- Publication date Sep 10, 2020
- Douglas Raymond Dykaar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR MANUFACTURING FLEXIBLE LAMINATED CIRCUIT BOARDS
- Publication number 20200214146
- Publication date Jul 2, 2020
- DUETTO INTEGRATED SYSTEMS, INC.
- Anthony FARACI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL WAVEGUIDE HAVING ALUMINUM NITRIDE THIN FILM
- Publication number 20200068706
- Publication date Feb 27, 2020
- Finisar Corporation
- Henry Meyer Daghighian
- G02 - OPTICS
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY
- Publication number 20200043690
- Publication date Feb 6, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20190350083
- Publication date Nov 14, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Masahiro KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20180146554
- Publication date May 24, 2018
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY
- Publication number 20180110133
- Publication date Apr 19, 2018
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20170006713
- Publication date Jan 5, 2017
- Subtron Technology Co., Ltd.
- Chih-Hong Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE SEGMENT VIA PLATING PROCESS AND STRUCTURE
- Publication number 20160278208
- Publication date Sep 22, 2016
- Multek Technologies Ltd.
- Kwan Pen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH PROJECTION SCREEN AND MANUFACTURING METHOD THEREOF
- Publication number 20160216789
- Publication date Jul 28, 2016
- CORETRONIC CORPORATION
- Kun-Rong Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Processes For Forming Waveguides Using LTCC Substrates
- Publication number 20160087325
- Publication date Mar 24, 2016
- Telekom Malaysia Berhad
- Rosidah Alias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR MANUFACTURING FLEXIBLE LAMINATED CIRCUIT BOARDS
- Publication number 20160014909
- Publication date Jan 14, 2016
- DUETTO INTEGRATED SYSTEMS, INC.
- ANTHONY FARACI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAKING MULTI-LAYER MICRO-WIRE STRUCTURE
- Publication number 20150271930
- Publication date Sep 24, 2015
- RONALD Steven COK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE DEVICE AND ELECTRIC CIRCUIT ARRANGEMENT
- Publication number 20150237729
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOL, METHOD AND MACHINE FOR MANUFACTURING MULTI-LAYER PRINTED CIRC...
- Publication number 20150223344
- Publication date Aug 6, 2015
- CHEMPLATE MATERIALS, S.L.
- Victor Lazaro Gallego
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS
- Publication number 20140332162
- Publication date Nov 13, 2014
- DUETTO INTEGRATED SYSTEMS, INC.
- ANTHONY FARACI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH SENSING DEVICE AND A METHOD OF FABRICATING THE SAME
- Publication number 20140139445
- Publication date May 22, 2014
- JIADONG CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-LAYER WIRING BOARD
- Publication number 20140131073
- Publication date May 15, 2014
- FUJIKURA LTD.
- Atsushi Itabashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR MANUFACTURING LAMINTED CIRCUIT BOARDS
- Publication number 20140034244
- Publication date Feb 6, 2014
- DUETTO INTEGRATED SYSTEMS, INC.
- ANTHONY FARACI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED PRINTED CIRCUIT BOARD WITH CONDUCTIVE TEST AREAS AS W...
- Publication number 20140034368
- Publication date Feb 6, 2014
- Arno Klamminger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140028336
- Publication date Jan 30, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sang Yoon LEE
- G01 - MEASURING TESTING
Information Patent Application
TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140016290
- Publication date Jan 16, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Min LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR HIGH RESOLUTION, HIGH THROUGHPUT PROCESSING O...
- Publication number 20140013566
- Publication date Jan 16, 2014
- Flextronics International USA, Inc.
- Galen Murray
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMPLEMENTING ENHANCED LOW LOSS, THIN, HIGH PERFORMANCE FLEXIBLE CI...
- Publication number 20140005818
- Publication date Jan 2, 2014
- International Business Machines Corporation
- John R. Dangler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible-Rigid Circuit Board Composite and Method for Producing a F...
- Publication number 20130333925
- Publication date Dec 19, 2013
- Frederik Sporon-Fiedler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED FOIL SHEET DEVICE
- Publication number 20130306227
- Publication date Nov 21, 2013
- Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO
- Erwin Rinaldo Meinders
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Via bond attachment

Misalignment measuring apparatus and misalignment measuring method

Compensating misalignment of component carrier feature by modifying...

Methods and systems for aligning a component

Printed circuit board automated layup system

Manufacturing method of multilayer printed circuit boards

Method for manufacturing multilayer wiring board

System and method for manufacturing flexible laminated circuit boards

Coil component

Component carriers sandwiching a sacrificial structure and having p...

Sacrificial structure with dummy core and two sections of separate...

Transponder fabrication methods

Package substrate and package structure

Multilayer printed circuit board via hole registration and accuracy

Apparatus and method for detecting ion migration

Method of manufacturing multilayer substrate

Multi-layered substrate manufacturing method

Composite substrate, method of manufacturing composite substrate, a...

Optical waveguide having aluminum nitride thin film

System and method for manufacturing flexible laminated circuit boards

Aluminum nitride substrate with graphite foil

Multilayer printed circuit board via hole registration and accuracy

Printed circuit board

Fuses with integrated metals

Package substrate and manufacturing method thereof

Wiring substrate and method for manufacturing same

Selective segment via plating process and structure

Tool, method and machine for manufacturing multi-layer printed circ...

Selective segment via plating process and structure

Method for producing a multilayer element

Patents Applicationslast 30 patents

SURFACE TENSION DRIVEN FLEXIBLE ELECTRONICS TRANSFER PRINTING METHOD

Via Bond attachment

Compensating Misalignment of Component Carrier Feature by Modifying...

MANUFACTURING METHOD OF MULTILAYER PRINTED CIRCUIT BOARDS

METHODS AND SYSTEMS FOR ALIGNING A COMPONENT

SYSTEM AND METHOD FOR MANUFACTURING FLEXIBLE LAMINATED CIRCUIT BOARDS

OPTICAL WAVEGUIDE HAVING ALUMINUM NITRIDE THIN FILM

MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME

MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

SELECTIVE SEGMENT VIA PLATING PROCESS AND STRUCTURE

TOUCH PROJECTION SCREEN AND MANUFACTURING METHOD THEREOF

Processes For Forming Waveguides Using LTCC Substrates

SYSTEM AND METHOD FOR MANUFACTURING FLEXIBLE LAMINATED CIRCUIT BOARDS

MAKING MULTI-LAYER MICRO-WIRE STRUCTURE

SUBSTRATE DEVICE AND ELECTRIC CIRCUIT ARRANGEMENT

TOOL, METHOD AND MACHINE FOR MANUFACTURING MULTI-LAYER PRINTED CIRC...

SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS

TOUCH SENSING DEVICE AND A METHOD OF FABRICATING THE SAME

MULTI-LAYER WIRING BOARD

SYSTEM FOR MANUFACTURING LAMINTED CIRCUIT BOARDS

MULTI-LAYERED PRINTED CIRCUIT BOARD WITH CONDUCTIVE TEST AREAS AS W...

PRINTED CIRCUIT BOARD

TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME

SYSTEM AND METHOD FOR HIGH RESOLUTION, HIGH THROUGHPUT PROCESSING O...

IMPLEMENTING ENHANCED LOW LOSS, THIN, HIGH PERFORMANCE FLEXIBLE CI...

Flexible-Rigid Circuit Board Composite and Method for Producing a F...

STACKED FOIL SHEET DEVICE