Aligning the bump connectors with the mounting substrate

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H01L2021/60067

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

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H01L2021/60067Aligning the bump connectors with the mounting substrate

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Patents Grantslast 30 patents

Information Patent Grant
System and method for forming solder bumps
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- International Business Machines Corporation
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Information Patent Grant
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- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date Mar 21, 2023
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- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out light-emitting diode (LED) device substrate with embedded b...
- Patent number 11,574,951
- Issue date Feb 7, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for prefixing of substrates
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- Issue date May 10, 2022
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming solder bumps
- Patent number 10,879,202
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for prefixing of substrates
- Patent number 10,438,822
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for prefixing of substrates
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- Issue date Jul 2, 2019
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
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- Issue date Mar 15, 2016
- PS4 Luxco S.A.R.L.
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Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,178,971
- Issue date May 15, 2012
- Elpida Memory, Inc.
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT LIGHT-EMITTING DIODE (LED) DEVICE SUBSTRATE WITH EMBEDDED B...
- Publication number 20230163155
- Publication date May 25, 2023
- Lumileds LLC
- Tze Yang HIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT LIGHT-EMITTING DIODE (LED) DEVICE SUBSTRATE WITH EMBEDDED B...
- Publication number 20200312903
- Publication date Oct 1, 2020
- Lumileds LLC
- Tze Yang HIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREFIXING OF SUBSTRATES
- Publication number 20190385870
- Publication date Dec 19, 2019
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREFIXING OF SUBSTRATES
- Publication number 20190198362
- Publication date Jun 27, 2019
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PREFIXING OF SUBSTRATES
- Publication number 20170345690
- Publication date Nov 30, 2017
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
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- Publication date Sep 10, 2009
- ELPIDA MEMORY, INC.
- Seiya Fujii
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Aligning the bump connectors with the mounting substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System and method for forming solder bumps

Fan-out light-emitting diode (LED) device substrate with embedded b...

Fan-out light-emitting diode (LED) device substrate with embedded b...

Fan-out light-emitting diode (LED) device substrate with embedded b...

Method for prefixing of substrates

System and method for forming solder bumps

Method for prefixing of substrates

Device for prefixing of substrates

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

FAN-OUT LIGHT-EMITTING DIODE (LED) DEVICE SUBSTRATE WITH EMBEDDED B...

FAN-OUT LIGHT-EMITTING DIODE (LED) DEVICE SUBSTRATE WITH EMBEDDED B...

METHOD FOR PREFIXING OF SUBSTRATES

METHOD FOR PREFIXING OF SUBSTRATES

METHOD AND DEVICE FOR PREFIXING OF SUBSTRATES

Semiconductor device and method of manufacturing the same