Aligning the plurality of semiconductor or solid-state bodies

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H01L2224/9512

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/9512Aligning the plurality of semiconductor or solid-state bodies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro-light emitting diode for LED display
- Patent number 11,869,880
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip bond semiconductor packages and assembly tools
- Patent number 11,676,934
- Issue date Jun 13, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 11,183,482
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus incorporating variable force distribution
- Patent number 11,121,113
- Issue date Sep 14, 2021
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,957,812
- Issue date Mar 23, 2021
- LG Display Co., Ltd.
- ChungHwan An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and placing a semiconductor device on a sub...
- Patent number 10,910,342
- Issue date Feb 2, 2021
- Imec VZW
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 10,784,129
- Issue date Sep 22, 2020
- FUJI CORPORATION
- Kohei Sugihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch bonding apparatus and bonding method
- Patent number 10,763,235
- Issue date Sep 1, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Xiaoyu Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Picking up irregular semiconductor chips
- Patent number 10,672,638
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,510,923
- Issue date Dec 17, 2019
- LG Display Co., Ltd.
- ChungHwan An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 10,490,525
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device with three machine bases and transfer method thereof
- Patent number 10,269,596
- Issue date Apr 23, 2019
- BOE Technology Group Co., Ltd.
- Xiaolong He
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 9,161,448
- Issue date Oct 13, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming interposer and opposing...
- Patent number 8,994,184
- Issue date Mar 31, 2015
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming interposer and opposing...
- Patent number 8,466,544
- Issue date Jun 18, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, manufacturing method of semiconductor device,...
- Patent number 8,404,525
- Issue date Mar 26, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Kunio Hosoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFID tag and RFID tag manufacturing method
- Patent number 8,302,869
- Issue date Nov 6, 2012
- Fujitsu Limited
- Shunji Baba
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Assembly comprising a functional device and a resonator and method...
- Patent number 7,967,204
- Issue date Jun 28, 2011
- Alien Technology Corporation
- Mark A. Hadley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for self-assembling microstructures
- Patent number 7,943,052
- Issue date May 17, 2011
- NATIONAL TAIWAN UNIVERSITY
- Enboa Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing display device using LED chips formed in a...
- Patent number 7,727,788
- Issue date Jun 1, 2010
- Samsung Mobile Display Co., Ltd.
- In-Taek Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fabricating self-assembling microstructures
- Patent number 7,727,804
- Issue date Jun 1, 2010
- The Regents of the University of California
- John Stephen Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled electrical networks
- Patent number 7,724,541
- Issue date May 25, 2010
- President and Fellows of Harvard College
- David H. Gracias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element arrangement method
- Patent number 7,698,800
- Issue date Apr 20, 2010
- Sony Corporation
- Toshihiko Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising functional block deposited therein
- Patent number 7,615,479
- Issue date Nov 10, 2009
- Alien Technology Corporation
- Gordon S. W. Craig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
RFID strap capacitively coupled and method of making same
- Patent number 7,551,141
- Issue date Jun 23, 2009
- Alien Technology Corporation
- Mark A. Hadley
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240379617
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY
- Publication number 20230395575
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20230119548
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE
- Publication number 20220375895
- Publication date Nov 24, 2022
- Japan Display Inc.
- Keisuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20220077108
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED DISPLAY AND METHOD FOR MANUFACTURING SAME
- Publication number 20210265327
- Publication date Aug 26, 2021
- Samsung Electronics Co., Ltd.
- Jamyeong KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20210082870
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH BONDING APPARATUS AND BONDING METHOD
- Publication number 20190385972
- Publication date Dec 19, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Xiaoyu JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20190348392
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR PARALLEL ASSEMBLY, TRANSFER, AND BONDING OF...
- Publication number 20180261570
- Publication date Sep 13, 2018
- SelfArray, Inc.
- Mark DURNIAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Transferring and Placing a Semiconductor Device on a Sub...
- Publication number 20180166416
- Publication date Jun 14, 2018
- IMEC vzw
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20180114709
- Publication date Apr 26, 2018
- FUJI MACHINE MFG. CO., LTD.
- Kohei SUGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...
- Publication number 20180114772
- Publication date Apr 26, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer and Opposing...
- Publication number 20130241080
- Publication date Sep 19, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer and Opposing...
- Publication number 20120217645
- Publication date Aug 30, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER ASSISTED TRANSFER WELDING PROCESS
- Publication number 20120115262
- Publication date May 10, 2012
- Semprius, Inc.
- Etienne Menard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device, Manufacturing Method of Semiconductor Device,...
- Publication number 20110230015
- Publication date Sep 22, 2011
- Semiconductor Energy Laboratory Co., Ltd
- Kunio Hosoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEM...
- Publication number 20100170086
- Publication date Jul 8, 2010
- Agency for Science, Technology and Research
- Qasem Ramadan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for fabricating self-assembling microstructures
- Publication number 20100075463
- Publication date Mar 25, 2010
- The Regents of the University of California
- John Stephen Smith
- G02 - OPTICS
Information Patent Application
ASSEMBLY COMPRISING A FUNCTIONAL DEVICE AND A RESONATOR AND METHOD...
- Publication number 20090109002
- Publication date Apr 30, 2009
- Mark A. Hadley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND ME...
- Publication number 20090056113
- Publication date Mar 5, 2009
- Gordon S.W. Craig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Self chip redistribution apparatus and method for the same
- Publication number 20080229574
- Publication date Sep 25, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID TAG AND RFID TAG MANUFACTURING METHOD
- Publication number 20080203173
- Publication date Aug 28, 2008
- FUJITSU LIMITED
- Shunji Baba
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR SELF-ASSEMBLING MICROSTRUCTURES
- Publication number 20080023435
- Publication date Jan 31, 2008
- Enboa WU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing display device using LED chips
- Publication number 20070224713
- Publication date Sep 27, 2007
- In-Taek Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method of semiconductor device,...
- Publication number 20070158804
- Publication date Jul 12, 2007
- Semiconductor Energy Laboratory Co., Ltd
- Kunio Hosoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatuses for fluidic self assembly
- Publication number 20070092654
- Publication date Apr 26, 2007
- John Stephen Smith
- B82 - NANO-TECHNOLOGY
Information Patent Application
Apparatus for block assembly process
- Publication number 20070082464
- Publication date Apr 12, 2007
- Kenneth David Schatz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatuses relating to block receptor configurations a...
- Publication number 20070079571
- Publication date Apr 12, 2007
- Kenneth David Schatz
- G06 - COMPUTING CALCULATING COUNTING

Aligning the plurality of semiconductor or solid-state bodies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Shift control method in manufacture of semiconductor device

Substrate bonding apparatus and method of manufacturing a semicondu...

Method of transferring micro-light emitting diode for LED display

Clip bond semiconductor packages and assembly tools

High speed handling of ultra-small chips by selective laser bonding...

Shift control method in manufacture of semiconductor device

Bonding apparatus incorporating variable force distribution

Display device and method of manufacturing the same

Method for transferring and placing a semiconductor device on a sub...

Mounting device and mounting method

Batch bonding apparatus and bonding method

Picking up irregular semiconductor chips

Display device and method of manufacturing the same

High speed handling of ultra-small chips by selective laser bonding...

Transfer device with three machine bases and transfer method thereof

Laser assisted transfer welding process

Method for simultaneously bonding multiple chips of different heigh...

Laser assisted transfer welding process

Semiconductor device and method of forming interposer and opposing...

Semiconductor device and method of forming interposer and opposing...

Semiconductor device, manufacturing method of semiconductor device,...

RFID tag and RFID tag manufacturing method

Assembly comprising a functional device and a resonator and method...

Method for self-assembling microstructures

Method of manufacturing display device using LED chips formed in a...

Method and apparatus for fabricating self-assembling microstructures

Self-assembled electrical networks

Element arrangement method

Assembly comprising functional block deposited therein

RFID strap capacitively coupled and method of making same

Patents Applicationslast 30 patents

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

MICRO-LED DISPLAY AND METHOD FOR MANUFACTURING SAME

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

BATCH BONDING APPARATUS AND BONDING METHOD

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

METHODS AND SYSTEMS FOR PARALLEL ASSEMBLY, TRANSFER, AND BONDING OF...

Method for Transferring and Placing a Semiconductor Device on a Sub...

MOUNTING DEVICE AND MOUNTING METHOD

METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...

Semiconductor Device and Method of Forming Interposer and Opposing...

Semiconductor Device and Method of Forming Interposer and Opposing...

LASER ASSISTED TRANSFER WELDING PROCESS

Semiconductor Device, Manufacturing Method of Semiconductor Device,...

DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEM...

Method and apparatus for fabricating self-assembling microstructures

ASSEMBLY COMPRISING A FUNCTIONAL DEVICE AND A RESONATOR AND METHOD...

STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND ME...

Self chip redistribution apparatus and method for the same

RFID TAG AND RFID TAG MANUFACTURING METHOD

METHOD FOR SELF-ASSEMBLING MICROSTRUCTURES

Method of manufacturing display device using LED chips

Semiconductor device, manufacturing method of semiconductor device,...

Methods and apparatuses for fluidic self assembly

Apparatus for block assembly process

Methods and apparatuses relating to block receptor configurations a...