Alignment aids

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H01L2224/48993

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48993Alignment aids

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Patents Grantslast 30 patents

Information Patent Grant
Radiofrequency transmission/reception device
- Patent number 11,502,411
- Issue date Nov 15, 2022
- PRIMO1D
- Gianfranco Andia Vera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact wirebonding in stacked-chip system in package, and methods...
- Patent number 10,847,450
- Issue date Nov 24, 2020
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package assembly with improved bond wire separation
- Patent number 9,431,364
- Issue date Aug 30, 2016
- Cypess Semiconductor Corporation
- Kiah Ling Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedgebond pads having a nonplanar surface structure
- Patent number 6,982,493
- Issue date Jan 3, 2006
- International Business Machines Corporation
- Kevin Shawn Petrarca
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...
- Publication number 20240038720
- Publication date Feb 1, 2024
- SK HYNIX INC.
- Su Ji UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIOFREQUENCY TRANSMISSION/RECEPTION DEVICE
- Publication number 20200381829
- Publication date Dec 3, 2020
- PRIMO1D
- Gianfranco Andia Vera
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Multi-Chip Package Assembly with Improved Bond Wire Separation
- Publication number 20140191417
- Publication date Jul 10, 2014
- SPANSION LLC
- Kiah Ling Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20120049386
- Publication date Mar 1, 2012
- Samsung Electronics Co., Ltd.
- Hyung-Geun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package and producing method thereof
- Publication number 20060180906
- Publication date Aug 17, 2006
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wedgebond Pads Having A Nonplanar Surface Structure
- Publication number 20040195679
- Publication date Oct 7, 2004
- International Business Machines Corporation
- Kevin Shawn Petrarca
- H01 - BASIC ELECTRIC ELEMENTS