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H01L2224/26165

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/26165Alignment aids

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component module
- Patent number 11,239,145
- Issue date Feb 1, 2022
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 9,646,948
- Issue date May 9, 2017
- Sumida Corporation
- Yasuo Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,559,078
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 9,343,334
- Issue date May 17, 2016
- Sumida Corporation
- Yasuo Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,202,804
- Issue date Dec 1, 2015
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Easily assembled chip assembly and chip assembling method
- Patent number 8,890,326
- Issue date Nov 18, 2014
- Hon Hai Precision Industry Co., Ltd.
- Kai-Wen Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,841,783
- Issue date Sep 23, 2014
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for manufacturing the same
- Patent number 8,653,651
- Issue date Feb 18, 2014
- Kabushiki Kaisha Toshiba
- Masayuki Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a filling of a gap in semiconductor devices
- Patent number 8,586,411
- Issue date Nov 19, 2013
- International Business Machines Corporation
- Thomas Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noncontact information storage medium and method for manufacturing...
- Patent number 8,083,150
- Issue date Dec 27, 2011
- Panasonic Corporation
- Daisuke Sakurai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adhesive for electronic components, method for manufacturing semico...
- Patent number 7,915,743
- Issue date Mar 29, 2011
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low shrinkage polyester thermosetting resins
- Patent number 7,868,113
- Issue date Jan 11, 2011
- Designer Molecules, Inc.
- Stephen M. Dershem
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method for fixing semiconductor bodies on a substrate using wires
- Patent number 5,310,701
- Issue date May 10, 1994
- Eupec Europaeische Gesellschaft fur Leistungshalbleiter mbH&Co
- Franz Kaussen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SP...
- Publication number 20240071975
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Bong Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE
- Publication number 20210035900
- Publication date Feb 4, 2021
- Kabushiki Kaisha Toshiba
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140357025
- Publication date Dec 4, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EASILY ASSEMBLED CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD
- Publication number 20130285243
- Publication date Oct 31, 2013
- HON HAI Precision Industry CO., LTD.
- KAI-WEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SELF-ALIGNMENT ASSEMBLY WHICH CAN BE USED WITH FLIP-CHIP...
- Publication number 20130181339
- Publication date Jul 18, 2013
- Mars Technology
- Wenjun Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20130134574
- Publication date May 30, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Takumi Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20130021766
- Publication date Jan 24, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING A FILLING OF A GAP IN SEMICONDUCTOR DEVICES
- Publication number 20120282739
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Thomas Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120235291
- Publication date Sep 20, 2012
- Kabushiki Kaisha Toshiba
- Masayuki UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120153462
- Publication date Jun 21, 2012
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive for electronic components, method and for manufacturing se...
- Publication number 20090311827
- Publication date Dec 17, 2009
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Noncontact Information Storage Medium and Method for Manufacturing...
- Publication number 20090039168
- Publication date Feb 12, 2009
- Daisuke Sakurai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Low shrinkage polyester thermosetting resins
- Publication number 20080251935
- Publication date Oct 16, 2008
- Stephen Dersham
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electronic device including a substrate structure and a process for...
- Publication number 20060137901
- Publication date Jun 29, 2006
- Gang Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Alignment aids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component module

Electronic component and method for manufacturing electronic component

Electronic component

Electronic component and method for manufacturing electronic component

Semiconductor device and method of manufacturing semiconductor device

Easily assembled chip assembly and chip assembling method

Semiconductor device and method of manufacturing semiconductor device

Semiconductor apparatus and method for manufacturing the same

Manufacturing a filling of a gap in semiconductor devices

Noncontact information storage medium and method for manufacturing...

Adhesive for electronic components, method for manufacturing semico...

Low shrinkage polyester thermosetting resins

Method for fixing semiconductor bodies on a substrate using wires

Patents Applicationslast 30 patents

SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SP...

ELECTRONIC COMPONENT MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

EASILY ASSEMBLED CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD

MULTI-CHIP SELF-ALIGNMENT ASSEMBLY WHICH CAN BE USED WITH FLIP-CHIP...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Electronic Component

MANUFACTURING A FILLING OF A GAP IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Adhesive for electronic components, method and for manufacturing se...

Noncontact Information Storage Medium and Method for Manufacturing...

Low shrinkage polyester thermosetting resins

Electronic device including a substrate structure and a process for...