Alignment aids

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H01L2224/48998

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48998Alignment aids

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 11,804,447
- Issue date Oct 31, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic manufactured mesoscopic microelectronics interconnect
- Patent number 11,233,030
- Issue date Jan 25, 2022
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,943,871
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,141,269
- Issue date Nov 27, 2018
- Amkor Technology, Inc.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal block and double-faced cooling power module using the same
- Patent number 9,972,559
- Issue date May 15, 2018
- Hyundai Motor Company
- Sung Won Park
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Brace for bond wire
- Patent number 8,680,660
- Issue date Mar 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lai Cheng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 8,278,680
- Issue date Oct 2, 2012
- Forward Electronics Co., Ltd.
- Pei-Hsuan Lan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...
- Publication number 20230069967
- Publication date Mar 9, 2023
- Fuji Electric Co., Ltd.
- Nobuhiro HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20210143105
- Publication date May 13, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE BOND BETWEEN AT LEAST TWO ELECTRICAL COMPON...
- Publication number 20180166413
- Publication date Jun 14, 2018
- Fraunhofer-Gesellschaft zur foerderung der Angewandten Forschung e.V.
- Christoph Bayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPARING A SUBSTRATE FOR EMBEDDING WIRE
- Publication number 20130075134
- Publication date Mar 28, 2013
- FEINICS AMATECH NOMINEE LIMITED
- David Finn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor package structure
- Publication number 20110186898
- Publication date Aug 4, 2011
- Forward Electronics Co., Ltd.
- Pei-Hsuan Lan
- H01 - BASIC ELECTRIC ELEMENTS

Alignment aids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having conductive wire with increased attachme...

Microfluidic manufactured mesoscopic microelectronics interconnect

Semiconductor device having conductive wire with increased attachme...

Semiconductor device having conductive wire with increased attachme...

Signal block and double-faced cooling power module using the same

Brace for bond wire

Semiconductor package structure

Patents Applicationslast 30 patents

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

ELECTRICALLY CONDUCTIVE BOND BETWEEN AT LEAST TWO ELECTRICAL COMPON...

PREPARING A SUBSTRATE FOR EMBEDDING WIRE

Semiconductor package structure